JPH03209206A - Photoelectronic device with photocoupler - Google Patents

Abstract

PURPOSE:To improve photocoupling efficiency and to shorten time for assembly by engaging a semiconductor laser drive through a male screw, which is provided on the outer peripheral surface of a stem, to a female screw to be provided on the inner peripheral surface of a fitting guide. CONSTITUTION:On the other end side of a fitting guide 4, a female screw 10 is provided as a lock part on the inner peripheral surface and a male screw 11 is provided as the lock part to be engaged to this female screw 10 on the outer peripheral surface of a stem 12 of a semiconductor laser device 1. Therefore, the semiconductor laser device 1 can be fitted to the fitting guide 4 by screwing the male screw 11 of the stem 12 so as to be engaged to the female screw 10 of the fitting guide 4. Thus, photocoupling work is made easy and for an assembled photoelectronic device with photocoupler, the photocoupling efficiency is improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a manufacturing technology for an optoelectronic device with an optical coupler, for example, an optoelectronic device with an optical coupler that combines a semiconductor laser device and an optical fiber connector. In particular, this paper relates to a technology that is effective when applied to a technology that connects a semiconductor laser device to a receiver that guides a single-mode optical fiber. [Prior Art] Semiconductor laser devices, light emitting diode devices, and photodiode devices are used as light sources and light receivers for optical fiber communications. To connect optoelectronic devices such as semiconductor laser devices, light emitting diode devices, and photodiode devices to optical fibers (optical fiber cables),
Optical coupling bodies such as receptacles and optical connectors that are paired with each other are used in 1M. For example, "Obto Device Data Book" published by Hitachi, Ltd., September 1988.
A laser diode (optoelectronic device with optical coupler) with a package structure with a receiver is introduced in the monthly issue, page 180. In this package with receipt tartar,
Fibers with FC-PC type connectors can be connected. [Problem to be solved by the invention] Conventionally, optoelectronic devices with optical couplers used for communication applications are
The connection between the receptacle to which the optical connector is attached and the opto-electronic device is fixed in optical alignment at a mounting guide attached to the receptacle. the! A adjustment requires three-dimensional adjustment in the optical axis direction and perpendicular to the optical axis, making the adjustment work complicated. On the other hand, the present applicant prepares multiple mounting guides with different lengths, measures the focal point of each semiconductor laser device, and then selects a mounting guide with a length suitable for each semiconductor laser device. We propose a technology that maximizes the optical coupling efficiency between the optical fiber held in the receptacle and the semiconductor laser device by selecting and then integrating the receptacle, the mounting guide, and the semiconductor laser device. There is. However, such a technique has a problem in that it takes a long time to measure the focal point of each semiconductor laser device and to select a mounting guide corresponding to the focal point.

An object of the present invention is to provide an optoelectronic device with an optocoupler that can increase the optical coupling efficiency between the optocoupler and the optoelectronic device and shorten the assembly time. The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the attached drawings. (Means for Solving the Problems) A brief overview of typical inventions disclosed in this application is as follows. That is, the optoelectronic device with an optical coupler of the present invention includes a can-sealed semiconductor laser device (optoelectronic device) having a lens in the center of a cap, a receptacle (optical coupling) for guiding an optical fiber connector, and the receptacle. and a tubular mounting guide that connects the semiconductor laser device, and the semiconductor laser device is mounted on the inner circumferential surface of the mounting guide via a male thread provided on the outer circumferential surface of the stem. The part that engages with the female thread is fixed with solder, and the outer end of the mounting guide that comes off from the connection part is embedded and sealed with resin (embedded body). In the adjustment work to maximize the optical coupling efficiency between the semiconductor laser device and the optical fiber connector attached to the receptacle in the assembly of optoelectronic devices with optical couplers, adjustment along the optical axis direction is relative to the installation guide. This is done by rotating the semiconductor laser device, and the position in the plane perpendicular to the optical axis is adjusted by rubbing the end of the mounting guide against the receptacle. After the position adjustment, the mounting guide and the receptor are fixed by welding, and the mounting guide and the semiconductor laser device are fixed by temporarily melting the solder film that was previously provided on the inner circumferential surface of the mounting guide. Furthermore, the outer end of the mounting guide is filled with resin to seal it. [Operation] According to the above-described means, the optoelectronic device with an optical coupler of the present invention can connect an optical coupler and the optoelectronic device W! which require three-dimensional position adjustment. For mutual connections, adjustments in the direction of the optical axis can be made using a screw structure, allowing for continuous fine adjustment, and adjustments in the direction perpendicular to the optical axis can be made by rubbing the mounting guide and the optical coupler against each other. Furthermore, after positioning, the optical coupler, mounting guide, and optoelectronic device can be fixed by welding or soldering, which not only provides high optical coupling efficiency but also reduces adjustment work time. Ru. [Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view showing an outline of a photoelectronic device with a receptacle according to an embodiment of the present invention, FIG. 2 is a partially enlarged cross-sectional view, and FIG. FIG. 4 is a flowchart showing the manufacturing process of the optoelectronic device with a receiver,
FIG. 5 is a sectional view showing the main parts of the optoelectronic device with a photocoupler, also showing the optical coupling adjustment state. The one shown in Figures 1 and 2 is an optoelectronic device with an optical coupler of the simplest structure. This optoelectronic device with an optical coupler is roughly divided into an optoelectronic device as a first connector, specifically, a semiconductor laser device 1 of the kitchen type, and an optical coupler as a second connector, specifically, It consists of a receptacle 3 for guiding the optical fiber 2, and a tubular mounting guide 4 for integrally connecting the receptacle 3 and the optoelectronic device 1. A receptacle 3 is fixed to one end of the mounting guide 4, and a semiconductor laser device fil is fixed to the other end.

On the other hand, the optical fiber 2 is attached so that its tip passes through the center of the cylindrical optical fiber connector 5.
This optical fiber connector 5 is inserted into the receptacle 3. Further, the tubular mounting guide 4 fixed to the receptacle 3 has a center axis such that the central axis of the tube is the optical axis 7 of the laser beam 6 emitted from the optical fiber 2 and the semiconductor laser device 1.
It is fixed to match. The semiconductor laser device 1 is attached to such a mounting guide 4 via mutually provided locking portions, specifically, a screw structure.
That is, a female screw 10 as a locking portion is provided on the inner peripheral surface of the other end of the mounting guide 4, and a male screw 1l as a locking portion that engages with this female screw 1O is attached to the semiconductor laser device. It is provided on the outer peripheral surface of the stem l2 of rIl■. Therefore, the semiconductor laser device 1 is mounted on the mounting guide 4 by screwing the male thread 1l of the stem 12 into the female thread 10 of the mounting guide 4 so as to mesh with it. Further, the mounting guide 4 and the semiconductor laser device 21 are fixed with solder. 1! Prior to machining, a solder film 13 is provided on the surface of the female screw 10, as shown in FIG. After the male screw 1l is screwed into the female screw lO and the position of the semiconductor laser device iI71 is set, the solder 11Jl3 is temporarily melted. As a result, the female screw 10 and the male screw 1l are fixed with solder as a fixing means, although not shown in FIG. Further, the outer end portion of the mounting guide 4 is filled with an embedded body 14 made of resin, and the opening is closed (It t ).
It is written. The semiconductor laser device If includes a disk-shaped metal stem 12, a metal heat sink 15 fixed to the main surface of the stem l2, and a semiconductor laser element 16 attached to the upper end of one side of the heat sink 15. and the stem l
The camp 17 is attached to the main surface of the heat sink 2 and covers the heat sink 15, the semiconductor laser element 16, etc. in an airtight manner. Further, two guide rods 18 are attached to the stem 12. One lead l8 is directly fixed to the conductive stem l2, and the other lead l8 penetrates the main surface of the stem l2 and is insulatively attached. The upper end of this insulated lead l8 and the upper electrode of the semiconductor laser element I6 are electrically connected by a wire (not shown). When a predetermined voltage is applied to the pair of leads 18, laser light 6 is emitted from the emission surface of the semiconductor laser element 16, respectively. On the other hand, since a spherical lens 19 is attached to the center of the ceiling portion of the cap 17, the laser beam 6 passes through this lens 19 to the outside of the cap 17, that is, from the stem 12 and the camp 17. It is emitted outside the package. This laser beam 6 travels toward the tip of the optical fiber 2 held by the receptacle 3.
Although not shown in detail, the optical fiber 2 consists of a core extending along the center and a cladding covering the core, and the laser beam 6 is taken into the core and transmitted. The optical fiber 2 has a cladding diameter of, for example, 125 μm, and a core diameter of about 7 to 8 μm in the case of a single mode fiber.

In such an optoelectronic device with an optical coupler, since the mounting guide 4 is concentrically joined to the receptacle 3 by a fitting structure, the position adjustment in the plane direction perpendicular to the optical axis can be performed accurately. Become. Further, the position adjustment in the optical axis direction can be performed by rotating the semiconductor laser device l relative to the mounting guide 4. In this case, by adjusting the rotation of the semiconductor laser device 1, the semiconductor laser device 1 can be moved forward or backward along the axial direction (optical axis direction) of the mounting guide 4, and this forward movement is continuous. Since this can be done, fine adjustments can be made by adjusting the rotation angle of the semiconductor laser device 1, and it is possible to precisely set the position of the semiconductor laser device 11 that increases the optical coupling efficiency, and it is also possible to shorten the time required for position adjustment work. becomes.

Next, a more specific optoelectronic device with an optical coupler of the present invention will be explained.

As shown in FIG. 3, this optoelectronic device with an optical coupler includes an optoelectronic device rIl (semiconductor laser device) 1 as an L-th connecting body, and a second connecting body to which an optical fiber connector (not shown) is attached. photocoupler (recebutacle)
3, and a tubular mounting guide 4 that connects the receptacle 3 and the semiconductor laser device 1. The semiconductor laser device I has a stem I2 made of a metal disc.
It has a structure in which a metal sheet sink 5 is fixed to the center of the top (main surface) using brazing material. A semiconductor laser element l is mounted on one side of the heat sink l5 via a submount 20.
6 is fixed. This semiconductor laser element 16 emits laser light 6 from its upper end and lower end, respectively. A light receiving element 21 is fixed to the main surface of the stem 12.

This light receiving element 2l serves as a monitor element that receives the laser beam 6 emitted from the lower end of the semiconductor laser element 16 and detects the optical output. Three ropes 18 are attached to the stem 12. One lead 18 is stem 1
The other two leads 18 pass through the stem 12 and are insulatively fixed to the stem 12. The upper ends of the two through-hole wires 18 are electrically connected to the respective electrodes of the semiconductor laser element 16 and the light receiving element 21 via wires 22, respectively. On the other hand, a metal cap l7 having a lens 19 is hermetically fixed to the ceiling of the stem 12, and the heat sink 15, the semiconductor laser element 16, the light receiving element 21. lead 1
8, the wire 22, etc. are sealed. therefore,
The laser beam 6 emitted from the upper end of the semiconductor laser element 16 passes through this lens 19 and connects to the stem 12. Yap l7
Light is emitted outside the package, which is shaped by The semiconductor laser device (optoelectronic device) (1) serving as the first connector is attached to one end of the tubular attachment guide 4. The mounting guide 4 is made of a metal circular tube, and has a female thread 10 on the inner peripheral surface on the tip side to which the semiconductor laser device l is attached.
is provided. A male thread 11 that engages with this female thread 10 is provided on the outer peripheral surface of the stem l2.

Therefore, the semiconductor laser device 1 can be screwed and fixed to the mounting guide 4. Ultimately, the semiconductor laser system i! 1i. A rotation operation is performed to set a predetermined position, that is, a position in the optical axis direction. Further, a solder film 13 is provided in advance on the surface of the female screw lO, and this solder film I3 is temporarily melted after setting the fixed position of the semiconductor laser device l. Therefore, the solder film I3 is melted and hardened. The semiconductor laser assembly Wll is securely fixed to the mounting guide 4 by soldering. Further, the end of the mounting guide 4 on the outside of the stem 12 is filled with an embedded body 14 made of resin and sealed. On the other hand, on the other end side of the mounting guide 4, a receptacle (optical coupling body) 3 as a second connection body is fixed with a welded portion 26 by laser welding. The other end of the mounting guide 4 is configured to come into contact with the flat sliding surface (rubbing surface) of the receptacle 3. The receptacle 3 has a cylindrical portion 30 into which a ferrule portion of an optical fiber connector is inserted.
and a through hole 3l that abuts the ferrule at the bottom of the cylindrical part 30.
It consists of a stop part 32 with a . In such an optoelectronic device with a receptacle, when a predetermined voltage is applied to the pair of glue leads 18, the semiconductor laser element 16 disposed in the package consisting of the stem 12 and the cap 17 is activated.
A laser beam 6 is emitted from the This laser beam 6 passes through a lens 19 and a through hole 31, and is taken into an optical fiber of an optical fiber connector (not shown) guided by a cylindrical portion 30 and a stop portion 32.

Next, the assembly of such an optoelectronic device with a receptacle (
The manufacturing method will be explained. As shown in the flowchart of FIG. 4, the optoelectronic device with a receptacle consists of joining the receptacle and the mounting guide, screwing together the optoelectronic device, setting the optical coupling position, fixing the optoelectronic device, and sealing with a filler (embedding body). Manufactured through a process.

First, the semiconductor laser device 1 is screwed onto one end of the mounting guide 4. Then this installation guy! Bring one end surface of '4 into contact with the flat sliding surface of receptacle 3. Next, as shown in FIG. 5, a predetermined voltage is applied to the lead 18, and while the laser beam 6 is emitted from the semiconductor laser element 16, the optical fiber of the optical fiber connector 5 attached to the receptacle 3 is connected. The optical coupling position is selected while measuring the output of the captured light. The position along the optical axis direction can be adjusted by rotationally adjusting the semiconductor laser device 1 with respect to the mounting guide 4.
Adjust by moving in the direction of the optical axis. Further, the position adjustment in the plane direction perpendicular to the optical axis direction is performed by sliding one end surface of the mounting guide 4 against the sliding surface of the receiver 3. After the optical coupling position of the semiconductor laser device [1] is set, heat is temporarily applied to the solder film l3 to melt it, and the ζ semiconductor laser device 1 is fixed to the mounting guide 4 with solder (first connection step). At the same time, the mounting guide 4 and the receptacle 3
is fixed by a welded part 26 by laser welding (second connection process). Furthermore, the hole on the tip side of the mounting guide 4 is filled with resin and cured to form an embedded body 14 and sealed, thereby producing an optoelectronic device with a receptor as shown in FIG. 3. . Note that either of the f-th connecting step and the second connecting step may be performed first.

According to such an embodiment, the following effects can be obtained.

(1) In the optoelectronic device including the receptacle of the present invention, the receptacle and the semiconductor laser device have an integrated structure with a mounting guide interposed, and the semiconductor laser device is attached to the mounting guide with a screw structure. and rotation U8 of the semiconductor laser device! ! Since the position along the optical axis direction is set by , it is possible to achieve the effect that it can be fixed accurately and reliably at a desired position. (2) According to the above (1), in the optoelectronic device with a receptacle of the present invention, the The connection position between the semiconductor laser device and the mounting guide can be set by adjusting the relative rotation of the semiconductor laser device to the mounting guide using the screw structure. This makes assembly easier and reduces work time. (3
) In the optoelectronic device with a receptacle of the present invention, the receptacle and the semiconductor laser device have an integrated structure with a mounting guide interposed therebetween, and the mounting guide and the receptacle are fixed by laser welding. However, since the mounting guide is fixed in a structure that contacts the sliding surface of the receptacle prior to welding, the mounting guide can be moved and adjusted so that it rubs against the sliding surface of the receptacle prior to fixing. This has the effect of accurately adjusting the position in the plane direction perpendicular to the axis. (4) According to (1) and (3) above, according to the present invention, the position in the optical axis direction and the position in the plane perpendicular to the optical axis can be accurately and reliably adjusted in assembling an optoelectronic device with a receptacle. Therefore, the optical coupling state between the semiconductor laser device and the optical fiber tube can be made as low as possible, and an optoelectronic device with a receptacle with high optical coupling efficiency can be provided. (5) In the optoelectronic device with a receptacle of the present invention, since the exposed surface side of the semiconductor laser device screwed into the mounting guide is covered with a resin embedding body, the semiconductor laser device is fixed to the mounting guide. This has the effect of increasing the reliability of optical coupling.

(6) In the optoelectronic device with a receptacle of the present invention, since there is no glass plate or the like that causes reflection between the semiconductor laser device and the optical fiber held by the receptacle, there is no possibility of light returning to the semiconductor laser element. As a result, kinks do not occur in the characteristics of the relationship between optical output and current, making it possible to provide a stable light source for optical communication, etc. (7) According to the above (1) to (6), according to the present invention, a synergistic effect can be obtained in that an optoelectronic device with a receptacle with high optical coupling reliability and stable light emission characteristics can be provided at a low cost. .

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, in the embodiment described above, the locking portion is formed of a screw, but it goes without saying that the locking portion may be formed of another structure. Further, although the mounting guide and the optoelectronic device are fixed by solder, that is, a bonding material, other fixing means may be used, such as fixing by melting the base material by laser welding or fixing by deforming the base material by caulking or the like. A similar effect can be obtained. FIG. 6 is a sectional view showing the main parts of a photoelectronic device with a receptacle according to another embodiment of the present invention. In this embodiment, the semiconductor laser device 1jl, which is not sealed with a cap, is connected to the mounting guide 4 using a screw structure, and the tip of the optical fiber 2 attached to the optical fiber connector 5 is connected to the mounting guide 4 using a screw structure. It protrudes from the inner end, and the tip becomes tapered and has a hemispherical shape (the spherical tip 4).
0). The laser beam 6 emitted from the semiconductor laser element l6 is directly transmitted to the bulbous end portion 40 of the optical fiber 2.
It is now possible to proceed to . In this structure, there is no glass plate or lens that causes reflection between the semiconductor laser element l6 and the optical fiber 2, and the optical fiber 2
Since the tip sphere 40 has a structure that makes it difficult to generate return light, the amount of return light to the semiconductor laser element 16 is reduced, and kinks do not occur in the characteristics of the relationship between optical output and current. ．． Therefore, it can serve as a stable light source for optical communication, etc.

The above explanation mainly describes the case in which the invention made by the present inventor is applied to the manufacturing technology of an optoelectronic device with an optical coupler incorporating a semiconductor laser device as a light source for optical communication, which is the field of application that formed the background of the invention. However, the present invention is not limited thereto, and can be applied to a manufacturing technology for an optoelectronic device with an optical coupler that incorporates a light emitting diode that emits light or a light receiving device that receives light.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows. The optoelectronic device with an optical coupler of the present invention has a structure in which a receptacle for guiding an optical fiber connector is fixed to one end of a tubular mounting guide, and a semiconductor laser device is screwed and fixed to the other end. Therefore, in the optical coupling work during assembly, the position in the optical axis direction can be adjusted by rotating the screw part, and the position in the plane perpendicular to the optical axis can be adjusted by rubbing the receptacle and the mounting guide. , the optical coupling work becomes easier, and the assembled optoelectronic device with the optical coupler has high optical coupling efficiency.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an outline of an optoelectronic device with a receptacle according to an embodiment of the present invention, FIG. 2 is a partially enlarged sectional view, and FIG. 3 is a more specific outline of an optoelectronic device with a receptacle according to the present invention. FIG. 4 is a flowchart showing the manufacturing process of the optoelectronic device with a receptacle; FIG. 5 is a sectional view showing the main parts of the optoelectronic device with an optocoupler, showing the optical coupling adjustment state; FIG. 6 FIG. 2 is a sectional view showing a main part of an optoelectronic device with an optical coupler according to another embodiment of the present invention. l... Semiconductor laser device (optoelectronic device), 2... Optical fiber, 3... Receptacle (optical coupler), 4... Installation guide, 5...
Optical fiber connector, 6...Laser beam, 7...Optical axis, 10...Female screw, 1l...Ill screw, 12...
・Stem, 13...Solder film, l4...Embedded body, 15
...Heat sink, 16...Semiconductor laser element, l
7... Cap, l8... Lead, 19... Lens, 20... Submount, 21... Light receiving element, 2
2... Wire, 26... Welded part, 30... Cylindrical part, 31... Through hole, 32... Stop part, 40... Lead ball part.

Claims (1)

[Claims] 1. A mounting guide, a photoelectronic device as a first connecting body attached to one end of the mounting guide, and a second connecting body attached to the other end of the mounting guide. an optoelectronic device with an optical coupler, wherein a connecting portion of the optoelectronic device and the mounting guide is provided with a locking portion that can adjust the mutual connection position; A photoelectronic device with an optical coupler, characterized in that the attachment guides are attached to each other via the locking portion, and both are further fixed by a fixing means. 2. The optoelectronic device with an optical coupler according to claim 1, wherein the locking portion is composed of a female screw and a male screw that engages with the female screw.