JPH0320465U - - Google Patents

Info

Publication number

JPH0320465U

JPH0320465U JP7994889U JP7994889U JPH0320465U JP H0320465 U JPH0320465 U JP H0320465U JP 7994889 U JP7994889 U JP 7994889U JP 7994889 U JP7994889 U JP 7994889U JP H0320465 U JPH0320465 U JP H0320465U

Authority

JP

Japan

Prior art keywords

mounting hole

metal foil

component mounting

board

printed wiring

Prior art date

1989-07-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011888 foil Substances 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 5
• 229910052751 metal Inorganic materials 0.000 claims description 5
• 229910000679 solder Inorganic materials 0.000 claims description 4
• 238000007598 dipping method Methods 0.000 claims 1
• 230000037431 insertion Effects 0.000 claims 1
• 238000003780 insertion Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1