JPH0320425U - - Google Patents
Info
- Publication number
- JPH0320425U JPH0320425U JP8063589U JP8063589U JPH0320425U JP H0320425 U JPH0320425 U JP H0320425U JP 8063589 U JP8063589 U JP 8063589U JP 8063589 U JP8063589 U JP 8063589U JP H0320425 U JPH0320425 U JP H0320425U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- solder
- dip
- small hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8063589U JPH0320425U (de) | 1989-07-07 | 1989-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8063589U JPH0320425U (de) | 1989-07-07 | 1989-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320425U true JPH0320425U (de) | 1991-02-28 |
Family
ID=31625872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8063589U Pending JPH0320425U (de) | 1989-07-07 | 1989-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320425U (de) |
-
1989
- 1989-07-07 JP JP8063589U patent/JPH0320425U/ja active Pending