JPH03203290A - Ultrasonic probe - Google Patents
Ultrasonic probeInfo
- Publication number
- JPH03203290A JPH03203290A JP1344001A JP34400189A JPH03203290A JP H03203290 A JPH03203290 A JP H03203290A JP 1344001 A JP1344001 A JP 1344001A JP 34400189 A JP34400189 A JP 34400189A JP H03203290 A JPH03203290 A JP H03203290A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- thermal conductor
- piezoelectric
- probe
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 8
- 239000002470 thermal conductor Substances 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000012856 packing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は超音波探触子を利用分野とし、特に医用関係に
利用される配列型探触子に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to the field of application of ultrasonic probes, and particularly to array-type probes used in medical applications.
(発明の背景)
配列型探触子は複数の圧電片を列設し例えばリニアある
いはセクタ駆動され、生体の疾患部等を超音波により検
査する。いわゆる超音波診断装置の送受波部として有用
されるものである。近年では、疾患部の早期発見等の理
由から、雑音体信号比(S/N比)を良好として高画質
の得られるものが望まれている。(Background of the Invention) An array type probe has a plurality of piezoelectric pieces arranged in a row and is driven, for example, linearly or sectorally, and inspects a diseased part of a living body using ultrasonic waves. It is useful as a wave transmitting/receiving section of a so-called ultrasonic diagnostic device. In recent years, for reasons such as early detection of diseased areas, it has been desired to have a high image quality with a good signal-to-noise ratio (S/N ratio).
(従来技術)
112図はこの種の一従来例を説明する配列型探触子図
で、同図(a)は斜視図、同図(b)は断面図である。(Prior Art) Fig. 112 is a diagram of an array type probe illustrating a conventional example of this type, in which Fig. 112 (a) is a perspective view and Fig. 112 (b) is a sectional view.
超音波探触子は例えばジルコン酸チタン酸鉛(通常PZ
T)とした圧電片1の複数個をバッキング材2上に列設
してなる。各圧電片1の両主面には図示しない電極が、
超音波の送受波面(被検出体側)には音響整合層3が形
成される。そして、各圧電片lの両端側からはバッキン
グ材2との間にフレキシブル基板4を介在させて電極を
外部に導出する。また、放射面側には図示しない共通線
路を接続した構成とする。Ultrasonic probes are made of lead zirconate titanate (usually PZ), for example.
A plurality of piezoelectric pieces 1 (T) are arranged in a row on a backing material 2. Electrodes (not shown) are provided on both main surfaces of each piezoelectric piece 1.
An acoustic matching layer 3 is formed on the ultrasonic wave transmitting/receiving surface (detected object side). Then, electrodes are led out from both ends of each piezoelectric piece l with a flexible substrate 4 interposed between it and the backing material 2. Further, a common line (not shown) is connected to the radiation surface side.
(従来技術の問題点)
しかしながら、このようなものにおいて、S/N比を良
好として画質向上を計るには、受信感度を上げる必要が
ある。この場合、一方法として送信電圧を高くすること
が一般に考えられる。しかし、送信電圧を高くすると圧
電片1の温度が上昇し、音響整合層3や音響レンズ(未
図示)に悪影響を及ぼすことになる。また、上記のよう
に圧電片1の放射面側の音響整合層3及び下面のバッキ
ング材2は通常エポキシ系及びゴム系等の材料が使用さ
れる。したがって、いずれも熱伝導性が悪くて放熱しに
くく、その影響が大きくなる。このようなことから、特
に医用分野で使用する場合には、放射面が生体の皮膚を
押圧して接触するため、低温火傷を招来する問題があっ
た。(Problems with the Prior Art) However, in such a device, in order to improve the S/N ratio and improve the image quality, it is necessary to increase the receiving sensitivity. In this case, one method is generally to increase the transmission voltage. However, if the transmission voltage is increased, the temperature of the piezoelectric piece 1 will rise, which will adversely affect the acoustic matching layer 3 and the acoustic lens (not shown). Further, as described above, the acoustic matching layer 3 on the radiation surface side of the piezoelectric piece 1 and the backing material 2 on the lower surface are usually made of epoxy-based, rubber-based, or the like materials. Therefore, both have poor thermal conductivity and are difficult to dissipate heat, which increases the influence. For this reason, especially when used in the medical field, the radiation surface presses against and contacts the skin of a living body, resulting in a problem of low-temperature burns.
(発明の目的)
本発明は、熱による悪影響を除去して受信感度を良好と
した超音波探触子を提供することを目的とする。(Objective of the Invention) An object of the present invention is to provide an ultrasonic probe with improved reception sensitivity by eliminating the adverse effects of heat.
(解決手段)
本発明は、超音波を発生ずる圧電片に放熱用の熱伝導体
を取着して外部に放熱しやすくしたことを解決手段とす
る。以下、本発明の一実施例を説明する。(Solution) The present invention provides a solution in that a heat conductor for heat radiation is attached to a piezoelectric piece that generates ultrasonic waves to facilitate heat radiation to the outside. An embodiment of the present invention will be described below.
(実施例)
第1図は本発明の一実施例を説明する超音波探触子の分
解図である。なお前従来例図乞同一部分には同番号を付
与してその説明は簡略する。(Embodiment) FIG. 1 is an exploded view of an ultrasonic probe illustrating an embodiment of the present invention. In addition, the same parts as those in the figures of the conventional example are given the same numbers and the explanation thereof will be simplified.
超音波探触子は前述のようにバッキング材2上にP Z
Tとした圧電片1を列設し、各圧電片1からフレキシ
ブル基板1ta−延出し”〔バラ・キング材2の両側直
にJJ7曲する。そして、圧tH片の両端部を除いて音
響整合層3を形成する。なお、ここまでのtllJ或を
探触子本体とする。The ultrasonic probe is placed on the backing material 2 as described above.
The piezoelectric pieces 1 having a shape of T are arranged in a row, and a flexible substrate 1ta is extended from each piezoelectric piece 1 and bent JJ7 directly on both sides of the loose king material 2. Then, acoustic matching is performed except for both ends of the piezoelectric pieces 1. Form layer 3. Note that tllJ up to this point is the probe body.
そして、この実施例では、接触子本体を熱導伝体5によ
り包囲した構成とする。但し、超a波が実際に放射され
る送受波面等を除く。具体的には、例えばバッキング材
2をAleの基台5a上に保持する。そして、各圧電片
1の放射面側になるー・端側に例えば銀箔;5N)を接
続する。なお、他端側に番よ共通線路6を接続する。ま
た、探触子本体を周回する側面及び基i25の底面には
銅箔5cを配置し、た構成とする。In this embodiment, the contact main body is surrounded by a thermal conductor 5. However, this excludes the transmitting/receiving surface where ultra-a waves are actually emitted. Specifically, for example, the backing material 2 is held on the Ale base 5a. Then, a silver foil (5N), for example, is connected to the end side of each piezoelectric piece 1, which is the radiation surface side. Note that a common line 6 is connected to the other end. Further, a copper foil 5c is arranged on the side surface surrounding the probe body and the bottom surface of the base i25.
このような構成であれば、圧電片1に発生する熱は、熱
伝導体5により外部に放出され温度の上昇を防止する。With this configuration, the heat generated in the piezoelectric piece 1 is released to the outside by the heat conductor 5, thereby preventing a rise in temperature.
しt:がって、送信電圧をAめCも特性を損なうことな
く受信感度を高め、S / N比を良好として画質の向
上を計ることができる。そして、医用の場合には、低温
火傷の虞がなく安全な診断を行うことかで・5!Iる。Therefore, even if the transmission voltage is changed to A or C, the reception sensitivity can be increased without impairing the characteristics, and the S/N ratio can be improved to improve the image quality. And, in the case of medical use, it is important to perform a safe diagnosis without the risk of low temperature burns.・5! I.
(他の事項)
なお、上記実施例では、熱伝導体はIE電片1?こ近接
する順に伝導率の小さくなるAg、 Cu、 A1
としたが、これに限ら・r放熱効果により決定すればよ
いものであ?S、、また、送受波面を除く探触す本体の
周醒すべてに導伝体を配置するとともにA1どした基台
の低面にはC11を配置したが、前同様に条件に応じて
その一部を省略できるものである。このような邊合、例
えばトランジスタのヒトシンクの設計書を利用して材t
τ及び寸法等を決定で・きる。また、音響整合層3はJ
′E電片1のN端部を除いて形、或したが、圧電片の全
面に、@威してもよい。また、熱伝導体!Tl i)1
よ圧は片[の一端側のみに形成したが、両端側に形成し
てもよい。この場合共通線路6を除去して兼工8シ、で
もよい。 また、熱伝導体5bは送受波面としたが、フ
レキシブル基板4の図示しない線路と絶縁を維持した上
でバッキング材2側としてもよい。但し、実施例のよう
に基型電位西側(この場合は送受波面)に接続し7た方
が望ましい。(Other matters) In the above embodiment, the thermal conductor is the IE electric piece 1? Ag, Cu, A1 whose conductivity decreases in the order of proximity
However, is it only necessary to determine it based on the heat dissipation effect? In addition, conductors were placed all around the probe body except for the wave transmitting/receiving surface, and C11 was placed on the lower surface of the base such as A1, but as before, depending on the conditions, one of the conductors could be placed. This section can be omitted. In such cases, for example, using the human sink design document of a transistor, material t
It is possible to determine τ, dimensions, etc. Moreover, the acoustic matching layer 3 is J
'E shape except for the N end of the piezoelectric piece 1, but it is also possible to use @ on the entire surface of the piezoelectric piece. Also a heat conductor! Tl i)1
Although the pressure was formed only on one end of the piece, it may be formed on both ends. In this case, the common line 6 may be removed and a dual line 8 may be used. Furthermore, although the thermal conductor 5b is used as a wave transmitting/receiving surface, it may be placed on the backing material 2 side while maintaining insulation from the unillustrated lines of the flexible substrate 4. However, it is preferable to connect it to the west side of the substrate potential (in this case, the wave transmitting/receiving surface) as in the embodiment.
(発明の効果)
本発明は、超音波を発生する圧電片に放熱用の熱伝導体
を族1着したので、熱による悪影響を除去して受信感度
を良好とする超音波探触子を提供でき、実際上の効果は
人である。(Effects of the Invention) The present invention provides an ultrasonic probe that eliminates the adverse effects of heat and improves reception sensitivity since the piezoelectric piece that generates ultrasonic waves is equipped with a thermal conductor for heat radiation. Yes, the practical effect is on people.
第1図は本発明の−・実施例を説明する超音波接触子の
分解図である。
第2図は従来例を説明する超音波探触子の図で、綱図(
A)は分解図、#Pi図(b )は断面図である。
第2閏
−611−FIG. 1 is an exploded view of an ultrasonic contactor illustrating an embodiment of the present invention. Figure 2 is a diagram of an ultrasonic probe to explain a conventional example.
A) is an exploded view, and #Pi diagram (b) is a cross-sectional view. 2nd leap -611-
Claims (1)
いて、前記圧電片に放熱用の熱伝導体を取着し、該圧電
片の駆動時に生ずる熱を外部に放出したことを特徴とす
る超音波探触子。In an ultrasonic probe in which electrodes are formed on both main surfaces of a piezoelectric piece, a heat conductor for heat dissipation is attached to the piezoelectric piece, and the heat generated when the piezoelectric piece is driven is released to the outside. Features of ultrasonic probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1344001A JP2884173B2 (en) | 1989-12-28 | 1989-12-28 | Ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1344001A JP2884173B2 (en) | 1989-12-28 | 1989-12-28 | Ultrasonic probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03203290A true JPH03203290A (en) | 1991-09-04 |
JP2884173B2 JP2884173B2 (en) | 1999-04-19 |
Family
ID=18365894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1344001A Expired - Lifetime JP2884173B2 (en) | 1989-12-28 | 1989-12-28 | Ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2884173B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1879024A1 (en) * | 2006-07-10 | 2008-01-16 | Nihon Dempa Kogyo Co., Ltd. | Ultrasonic probe with thermal transfer means |
CN109738528A (en) * | 2018-12-19 | 2019-05-10 | 中国兵器科学研究院宁波分院 | A kind of ultrasonic C-scanning automatic checkout system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61240157A (en) * | 1985-04-17 | 1986-10-25 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
-
1989
- 1989-12-28 JP JP1344001A patent/JP2884173B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61240157A (en) * | 1985-04-17 | 1986-10-25 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1879024A1 (en) * | 2006-07-10 | 2008-01-16 | Nihon Dempa Kogyo Co., Ltd. | Ultrasonic probe with thermal transfer means |
JP2008022077A (en) * | 2006-07-10 | 2008-01-31 | Nippon Dempa Kogyo Co Ltd | Ultrasonic probe |
US8574159B2 (en) | 2006-07-10 | 2013-11-05 | Nihon Dempa Kogyo Co., Ltd. | Thermally enhanced ultrasonic probe |
CN109738528A (en) * | 2018-12-19 | 2019-05-10 | 中国兵器科学研究院宁波分院 | A kind of ultrasonic C-scanning automatic checkout system |
CN109738528B (en) * | 2018-12-19 | 2021-06-08 | 中国兵器科学研究院宁波分院 | Ultrasonic C scanning automatic detection system |
Also Published As
Publication number | Publication date |
---|---|
JP2884173B2 (en) | 1999-04-19 |
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