JPH03197994A - El panel - Google Patents
El panelInfo
- Publication number
- JPH03197994A JPH03197994A JP33627489A JP33627489A JPH03197994A JP H03197994 A JPH03197994 A JP H03197994A JP 33627489 A JP33627489 A JP 33627489A JP 33627489 A JP33627489 A JP 33627489A JP H03197994 A JPH03197994 A JP H03197994A
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- resin layer
- panel
- type insulating
- setting type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000011347 resin Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000006096 absorbing agent Substances 0.000 claims abstract description 16
- 229910021536 Zeolite Inorganic materials 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000010457 zeolite Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005401 electroluminescence Methods 0.000 abstract description 2
- 239000000741 silica gel Substances 0.000 abstract description 2
- 229910002027 silica gel Inorganic materials 0.000 abstract description 2
- 238000004078 waterproofing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 49
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000001723 curing Methods 0.000 description 7
- 230000002745 absorbent Effects 0.000 description 6
- 239000002250 absorbent Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- CADICXFYUNYKGD-UHFFFAOYSA-N sulfanylidenemanganese Chemical compound [Mn]=S CADICXFYUNYKGD-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は交流電界の印加によってＥＬ（エレクトロルミ
ネッセンス）発光を呈するＥＬパネルに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an EL panel that emits EL (electroluminescence) light upon application of an alternating current electric field.
（従来の技術）
一般的にＥＬパネルはＥＬ素子を絶縁性材料及び背面基
板で封止してなり、この封止はＥＬ素子を長時間にわた
り安定に動作させるために行なわれる。従来のＥＬパネ
ルは第２図に示すようにガラスなどからなるパネル基板
１上に透明電極２、ＥＬ薄膜及び背面電極６を積層して
なるＥＬ素子と凹型状に加工された背面基板１１を貼り
合わせ、該貼り合わせにより設けられた空隙部にシリコ
ーンオイルなどの絶縁性流体１２を封入してＥＬ素子を
封止した構造を有している。ところで、上記ＥＬ薄膜と
してはマンガンをドープした硫化亜鉛やセレン化亜鉛な
どからなるＥＬ発光層４を酸化アルミニウムや酸化チタ
ンなどからなる第一誘電体層３及び第二誘電体層５で挾
んだ二重絶縁構造のものなど絶縁耐圧、発光効率および
動作の安定性に優れたものが開発されてきているが、こ
のようなＥＬ薄膜は水分との接触により輝度劣化を生ず
る。そこで、ＥＬパネルにおけるＥＬ薄膜についての防
湿対策が必要となる。(Prior Art) Generally, an EL panel is made up of an EL element sealed with an insulating material and a back substrate, and this sealing is performed to ensure stable operation of the EL element over a long period of time. As shown in FIG. 2, a conventional EL panel has an EL element formed by laminating a transparent electrode 2, an EL thin film, and a back electrode 6 on a panel substrate 1 made of glass or the like, and a back substrate 11 processed into a concave shape. The structure has a structure in which the EL element is sealed by sealing an insulating fluid 12 such as silicone oil into the gap created by the bonding. By the way, the above-mentioned EL thin film includes an EL light-emitting layer 4 made of manganese-doped zinc sulfide, zinc selenide, etc., sandwiched between a first dielectric layer 3 and a second dielectric layer 5 made of aluminum oxide, titanium oxide, etc. Although EL thin films such as those having a double insulation structure that have excellent dielectric strength, luminous efficiency, and operational stability have been developed, such EL thin films deteriorate in brightness when they come into contact with moisture. Therefore, moisture-proofing measures are required for the EL thin film in the EL panel.
従来のＥＬパネルにおける防湿対策としては、吸湿剤を
シート状にして背面基板の内壁に貼設する方法や封入す
る絶縁性流体中に水分吸収体を混入するという方法など
がとられている。しかしながら、吸湿剤をシート状にし
て背面基板の内壁に貼設する方法においては、防湿剤を
シート状にする工程、防湿剤を貼設する工程などが必要
となり、その作製工程が繁雑になるという問題があり、
−方絶縁性流体中に水分吸収体を混入する方法において
は、長時間静止状態でＥＬパネルの使用を続けると、水
分吸収体が沈殿、偏在してしまい、充分な防湿効果が得
られないという問題がある。Conventional moisture-proofing measures for EL panels include a method of forming a sheet of moisture absorbent and pasting it on the inner wall of a rear substrate, and a method of mixing a moisture absorber into an insulating fluid to be sealed. However, the method of forming a moisture absorbent into a sheet and pasting it on the inner wall of the back substrate requires a process of forming the moisture-proofing agent into a sheet and a process of pasting the moisture-proofing agent, making the manufacturing process complicated. There is a problem,
- In the method of mixing a moisture absorber into an insulating fluid, if the EL panel is used in a stationary state for a long time, the moisture absorber will precipitate and become unevenly distributed, making it impossible to obtain a sufficient moisture-proofing effect. There's a problem.
（発明が解決しようとする課題）
本発明の目的は、簡便に作製することができ、充分にＥ
Ｌ素子が防湿され得るＥＬパネルを提供することにある
。(Problems to be Solved by the Invention) An object of the present invention is to enable easy production and to provide sufficient E.
An object of the present invention is to provide an EL panel in which L elements can be moisture-proofed.
（課題を解決するための手段）
本発明らは上記課題を解決するために鋭意検討を行った
結果、硬化型絶縁性樹脂及び平板状の背面基板を用いて
ＥＬ素子を封止することにより、簡便にＥＬパネルを作
製することができ、更に充分にＥＬ素子が防湿され得る
ＥＬパネルが得られることを見出だし本発明を完成する
に至った。すなわち本発明は、パネル基板上に形成され
たＥＬ素子の発光部全面を被覆する第１の硬化型絶縁性
樹脂層及び該樹脂層全面を被覆する第２の硬化型絶縁性
樹脂層を有し、第２の硬化型絶縁性樹脂層のパネル基板
と平行な面上に平板状の背面基板が配設され、第１及び
／又は第２の硬化型絶縁性樹脂層中に水分吸収体が含有
されていることを特徴とするＥＬパネルである。(Means for Solving the Problems) As a result of intensive studies to solve the above problems, the present inventors found that by sealing an EL element using a curable insulating resin and a flat back substrate, The present inventors have discovered that an EL panel can be easily produced, and furthermore, an EL panel can be obtained in which the EL elements can be sufficiently moisture-proofed, and the present invention has been completed. That is, the present invention has a first curable insulating resin layer that covers the entire surface of the light emitting part of the EL element formed on the panel substrate, and a second curable insulating resin layer that covers the entire surface of the resin layer. , a flat back substrate is disposed on a surface of the second curable insulating resin layer parallel to the panel substrate, and a moisture absorber is contained in the first and/or second curable insulating resin layer. This is an EL panel characterized by:
以下、図面に基づき本発明の詳細な説明する。Hereinafter, the present invention will be described in detail based on the drawings.
第１図は本発明のＥＬパネルの構造の一例を示す断面図
である。FIG. 1 is a sectional view showing an example of the structure of the EL panel of the present invention.
本発明のＥＬパネルは、パネル基板１上に形成されたＥ
Ｌ素子、該ＥＬ素子の発光部全面を被覆する第１の硬化
型絶縁性樹脂層７及び該樹脂層の全面を被覆する第２の
硬化型絶縁性樹脂層８を有し、第１の硬化型絶縁性樹脂
層７はＥＬ素子の保護層として作用し、第２の硬化型絶
縁性樹脂層８は背面基板９を接着するための層として作
用する。The EL panel of the present invention has an EL panel formed on a panel substrate 1.
The L element has a first curable insulating resin layer 7 that covers the entire surface of the light emitting part of the EL element, and a second curable insulating resin layer 8 that covers the entire surface of the resin layer. The mold insulating resin layer 7 acts as a protective layer for the EL element, and the second curable insulating resin layer 8 acts as a layer for bonding the back substrate 9.
なお、本発明における硬化型絶縁性材料とは、加熱、光
の照射などにより硬化する性質を示すものであり、第１
の硬化型絶縁性樹脂層７、第２の硬化型絶縁性樹脂層８
はスクリーン印刷法、ロールコート法などにより硬化型
絶縁性材料を塗布し、硬化させることにより形成するこ
とができる。また第１の硬化型絶縁性樹脂層７として用
いられる樹脂は、電気絶縁性に優れ、硬化の際に副産物
の発生がなく硬化後に弾性を有するものであれば特に限
定されないが、例えば硬化性のブチルゴム系樹脂、スチ
レンブタジェンゴム系樹脂、クロロブレンゴム系樹脂、
フッ素系樹脂、シリコン系樹脂などが挙げられる。また
、第２の硬化型絶縁性樹脂層８として用いられる樹脂は
、電気絶縁性、耐湿性、耐熱性、及び接着性に優れたも
のであれば特に限定されないが、硬化性のフッ素系樹脂
、シリコン系樹脂、アクリル系樹脂、エポキシ系樹脂な
どが挙げられる。このうち特にフッ素系樹脂、シリコン
系樹脂は硬化後に電気特性に優れ、広い温度範囲での使
用が可能であり、更に化学的に不活性であることから、
これらを第１の硬化型絶縁性樹脂層として用いることが
好ましく、エポキシ系樹脂は電気絶縁性、耐湿性に優れ
、また背面基板との接着性においても十分な効果を示し
、更に低コストであるという点からこれを第２の硬化型
絶縁性樹脂層として用いることが好ましい。The curable insulating material in the present invention is one that exhibits the property of being cured by heating, irradiation with light, etc.
curable insulating resin layer 7, second curable insulating resin layer 8
can be formed by applying a curable insulating material by screen printing, roll coating, etc. and curing it. Further, the resin used as the first curable insulating resin layer 7 is not particularly limited as long as it has excellent electrical insulation properties, does not generate by-products during curing, and has elasticity after curing. Butyl rubber resin, styrene butadiene rubber resin, chloroprene rubber resin,
Examples include fluorine-based resins and silicone-based resins. Further, the resin used as the second curable insulating resin layer 8 is not particularly limited as long as it has excellent electrical insulation, moisture resistance, heat resistance, and adhesiveness, but may include curable fluororesin, Examples include silicone resin, acrylic resin, and epoxy resin. Among these, fluorine-based resins and silicone-based resins in particular have excellent electrical properties after curing, can be used in a wide temperature range, and are chemically inert.
It is preferable to use these as the first curable insulating resin layer, and epoxy resins have excellent electrical insulation and moisture resistance, also exhibit sufficient adhesion to the rear substrate, and are low in cost. From this point of view, it is preferable to use this as the second curable insulating resin layer.
更に本発明のＥＬパネルは上記した第１及び／又は第２
の硬化型絶縁性樹脂層中に水分吸収体が含有されるが、
この水分吸収体としてはゼオライト、シリカゲル、活性
アルミナなどが用いられる。Furthermore, the EL panel of the present invention has the above-mentioned first and/or second
A moisture absorber is contained in the curable insulating resin layer of
Zeolite, silica gel, activated alumina, etc. are used as this water absorber.
本発明のＥＬパネルにおいて、これら水分吸収体は、硬
化型絶縁性樹脂層中に存在し、この樹脂は硬化している
ので、ＥＬパネルの使用中に水分吸収体が沈殿、偏在は
生じない。従って、ＥＬ素子の充分な防湿効果が得られ
る。In the EL panel of the present invention, these moisture absorbers are present in the curable insulating resin layer, and since this resin is cured, the moisture absorbers do not precipitate or become unevenly distributed during use of the EL panel. Therefore, a sufficient moisture-proofing effect of the EL element can be obtained.
（実施例）
以下、実施例により本発明をさらに詳細に説明するが、
本発明は何らこれらに制限されるものではない。(Example) Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these in any way.
実施例１
第１図に示すように、ガラスからなるパネル基板１上に
透明電極２を帯状に多数平行配置し、次いで透明電極２
上に酸化アルミニウムからなる第一誘電体層３を２００
０人、その上に硫化亜鉛に硫化マンガンを添加した材料
からなるＥＬ発光層４を９０００人、さらにこの上に酸
化アルミニウムからなる第二誘電体層５を２０００人、
各々スパッタリング法により形成した後、第二誘電体層
５上にアルミニウム層を厚さ６０００人蒸着し、該アル
ミニウム層を透明電極２と直交する方向へ帯状に成形配
列し、背面電極６を形成してＥＬ素子を得た。Example 1 As shown in FIG. 1, a large number of transparent electrodes 2 are arranged in parallel in strips on a panel substrate 1 made of glass.
A first dielectric layer 3 made of aluminum oxide is placed on top of the
0 people, 9000 people formed an EL light emitting layer 4 made of a material in which manganese sulfide was added to zinc sulfide, and furthermore, 2000 people formed a second dielectric layer 5 made of aluminum oxide on top of this.
After each layer is formed by sputtering, an aluminum layer is deposited to a thickness of 6000 on the second dielectric layer 5, and the aluminum layer is formed and arranged in a band shape in a direction perpendicular to the transparent electrode 2 to form the back electrode 6. An EL device was obtained.
その後、ＥＬ素子の発光部全面を被覆する第１の硬化型
絶縁性樹脂層７及び該樹脂層全面を被覆する第２の硬化
型絶縁性樹脂層８を形成した。第１の硬化型絶縁性樹脂
層７は、硬化前の液状の状態の熱硬化型シリコン樹脂（
ダウコーニング社製シリコン樹脂、シルポット５００）
に吸湿剤１０としてゼオライトを混入し、これをスクリ
ーン印刷法によりＥＬ素子の発光部全面に塗布し、オー
ブン中で１５０℃、３０分間加熱することにより形成し
た。また、第２の硬化型絶縁性樹脂層８は、硬化前の液
状の状態の加熱硬化型エポキシ樹脂（スリーボンド社製
エポキシ樹脂、ＴＢ２０６５Ｋ）に吸湿剤１０としてゼ
オライトを混入し、これをスクリーン印刷法により第１
の硬化型絶縁性樹脂層７全面を被覆するように塗布し、
これを硬化させて形成した。なお、第２の硬化型絶縁性
樹脂層８の硬化は、平板状の背面基板９を第２の硬化型
絶縁性樹脂層のパネル基板と平行な面上に配設し、これ
に背面基板を加圧するクリップを装着した後にオーブン
内で１２０℃、３時間加熱して行なった。加熱後、これ
を徐冷し、オーブンから取出し装着しであるクリップを
外してＥＬパネルを作製した。Thereafter, a first curable insulating resin layer 7 covering the entire surface of the light emitting part of the EL element and a second curable insulating resin layer 8 covering the entire surface of the resin layer were formed. The first curable insulating resin layer 7 is made of thermosetting silicone resin in a liquid state before curing (
Dow Corning silicone resin, Silpot 500)
Zeolite was mixed in as a moisture absorbent 10, and this was applied to the entire surface of the light emitting part of the EL element by screen printing, and then heated in an oven at 150° C. for 30 minutes. The second curable insulating resin layer 8 is made by mixing zeolite as a moisture absorbent 10 into a heat-curing epoxy resin (epoxy resin manufactured by Three Bond Co., Ltd., TB2065K) in a liquid state before curing, and applying this by screen printing. The first
Coat to cover the entire surface of the curable insulating resin layer 7,
This was formed by curing. The second curable insulating resin layer 8 is cured by disposing a flat back substrate 9 on a surface parallel to the panel substrate of the second curable insulating resin layer, and then attaching the back substrate to this. After attaching a pressurizing clip, the test was carried out by heating in an oven at 120° C. for 3 hours. After heating, this was slowly cooled, taken out from the oven, and the mounting clips were removed to produce an EL panel.
実施例２
第３図に示す構造のＥＬパネルを実施例１と同様の方法
により作製した。Example 2 An EL panel having the structure shown in FIG. 3 was produced in the same manner as in Example 1.
また、本実施例においては第１の硬化型絶縁性樹脂層７
は熱硬化型シリコン樹脂（ダウコーニング社製シリコン
樹脂、シルポット１８４）に、水分吸収体１７として活
性アルミナを混合したものを用いて形成し、第２の硬化
型絶縁性樹脂層８はエポキシ樹脂（スリーボンド社製エ
ポキシ樹脂、ＬＧＸ−９０８−１）を用いて形成した。Furthermore, in this embodiment, the first curable insulating resin layer 7
The second hardening type insulating resin layer 8 is formed using a thermosetting silicone resin (silicon resin manufactured by Dow Corning, Silpot 184) mixed with activated alumina as the moisture absorber 17, and the second hardening type insulating resin layer 8 is made of an epoxy resin ( It was formed using an epoxy resin manufactured by ThreeBond, LGX-908-1).
なお、第２の硬化型絶縁性樹脂層８には水分吸収体を混
合しなかった。Note that no moisture absorber was mixed in the second curable insulating resin layer 8.
実施例３
第４図に示す構造のＥＬパネルを実施例１と同様の方法
により作製した。Example 3 An EL panel having the structure shown in FIG. 4 was produced in the same manner as in Example 1.
また、本実施例においては第１の硬化型絶縁性樹脂層７
は熱硬化型シリコン樹脂７（信越化学社製シリコン樹脂
、ＫＥ１０３１）を用いて形成し、第２の硬化型絶縁性
樹脂層８はエポキシ樹脂８（チッソ株式会社製エポキシ
樹脂、リクソボンド１００１Ａ／Ｂ）に、水分吸収体１
７として活性アルミナを混合したものを用いて形成した
。Furthermore, in this embodiment, the first curable insulating resin layer 7
is formed using a thermosetting silicone resin 7 (silicon resin manufactured by Shin-Etsu Chemical Co., Ltd., KE1031), and the second hardening type insulating resin layer 8 is formed using an epoxy resin 8 (epoxy resin manufactured by Chisso Corporation, Rixobond 1001A/B). , moisture absorber 1
7 was formed using a mixture of activated alumina.
なお、第１の硬化型絶縁性樹脂層７には水分吸収体を混
合しなかった。Note that no moisture absorber was mixed in the first curable insulating resin layer 7.
評価試験
吸湿剤を゛混合しなかった以外は実施例２と同様の方法
でＥＬパネルを作製し、これを比較例１とした。実施例
２と比較例１のＥＬパネルを各１０枚ずつ作製し、これ
らを恒温恒湿槽に入れて温度７０℃、湿度８５％の雰囲
気下に５０００時間晒した。その後、ＦＬパネルを恒温
恒湿槽から取り出し、ＥＬパネルの輝度及び輝度分布を
測定した。Evaluation Test An EL panel was prepared in the same manner as in Example 2, except that no moisture absorbent was mixed, and this was used as Comparative Example 1. Ten EL panels of Example 2 and Comparative Example 1 were each produced, placed in a constant temperature and humidity chamber, and exposed to an atmosphere at a temperature of 70° C. and a humidity of 85% for 5000 hours. Thereafter, the FL panel was taken out of the constant temperature and humidity chamber, and the brightness and brightness distribution of the EL panel were measured.
その結果を表１に示す。The results are shown in Table 1.
表１
発光面での最小輝度
印加電圧は発光開始電圧から更に３０Ｖ増やした電圧で
測定した。Table 1 The minimum brightness applied voltage on the light emitting surface was measured at a voltage that was further increased by 30 V from the light emission starting voltage.
初期状態では全て３５％以下であった。In the initial state, they were all below 35%.
（発明の効果）
以上述べたとおり、本発明のＥＬパネルは、背面基板の
加工の必要性がないため、従来のＥＬパネルと比較して
簡便に作製することができ、またＥＬ素子の防湿に優れ
たものとな′る。(Effects of the Invention) As described above, the EL panel of the present invention does not require processing of the rear substrate, so it can be manufactured more easily than conventional EL panels, and it is also effective for moisture-proofing the EL elements. It becomes excellent.
第１図、第３図及び第４図は本発明のＥＬパネルの構造
の一例を示す断面図である。
第２図は従来のＥＬパネルの構造を示す断面図である。
図中、
１・・・パネル基板 ２・・・透明電極３・・・
第一誘電体層 ４・・・ＥＬ発光層５・・・第二誘
電体層 ６・・・背面電極７・・・′１ｓ１硬化型
絶縁性樹脂層
８・・・第２硬化型絶縁性樹脂層
９．１１・・・平板背面基板
１０Ｓ１７・・・吸湿剤 １２・・・絶縁性流体１３
・・・注入孔 １４・・・アルミニウム片１５
・・・封孔板 −１６・・・エポキシ樹脂を各々示
す。FIG. 1, FIG. 3, and FIG. 4 are cross-sectional views showing an example of the structure of the EL panel of the present invention. FIG. 2 is a sectional view showing the structure of a conventional EL panel. In the figure, 1... Panel substrate 2... Transparent electrode 3...
First dielectric layer 4...EL light emitting layer 5...Second dielectric layer 6...Back electrode 7...'1s1 curable insulating resin layer 8...Second curable insulating resin Layer 9.11...Flat rear substrate 10S17...Moisture absorbent 12...Insulating fluid 13
... Injection hole 14 ... Aluminum piece 15
...Sealing plate -16... Each shows an epoxy resin.
Claims (1)
の発光部全面を被覆する第１の硬化型絶縁性樹脂層及び
該樹脂層全面を被覆する第２の硬化型絶縁性樹脂層を有
し、第２の硬化型絶縁性樹脂層のパネル基板と平行な面
上に平板状の背面基板が配設され、第１及び／又は第２
の硬化型絶縁性樹脂層中に水分吸収体が含有されている
ことを特徴とするＥＬパネル。(1) An EL element formed on a panel substrate, a first curable insulating resin layer covering the entire surface of the light emitting part of the EL element, and a second curable insulating resin layer covering the entire surface of the resin layer. a flat back substrate is disposed on a surface of the second curable insulating resin layer parallel to the panel substrate;
An EL panel characterized in that a moisture absorber is contained in the curable insulating resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33627489A JPH03197994A (en) | 1989-12-27 | 1989-12-27 | El panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33627489A JPH03197994A (en) | 1989-12-27 | 1989-12-27 | El panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03197994A true JPH03197994A (en) | 1991-08-29 |
Family
ID=18297414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33627489A Pending JPH03197994A (en) | 1989-12-27 | 1989-12-27 | El panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03197994A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012003268A (en) * | 2000-02-29 | 2012-01-05 | Semiconductor Energy Lab Co Ltd | Light-emitting device and electronic apparatus |
-
1989
- 1989-12-27 JP JP33627489A patent/JPH03197994A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012003268A (en) * | 2000-02-29 | 2012-01-05 | Semiconductor Energy Lab Co Ltd | Light-emitting device and electronic apparatus |
| US9263476B2 (en) | 2000-02-29 | 2016-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for fabricating the same |
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