JPH03197686A - Method for plating die-cast product of aluminum alloy with nickel - Google Patents
Method for plating die-cast product of aluminum alloy with nickelInfo
- Publication number
- JPH03197686A JPH03197686A JP33895189A JP33895189A JPH03197686A JP H03197686 A JPH03197686 A JP H03197686A JP 33895189 A JP33895189 A JP 33895189A JP 33895189 A JP33895189 A JP 33895189A JP H03197686 A JPH03197686 A JP H03197686A
- Authority
- JP
- Japan
- Prior art keywords
- product
- aluminum alloy
- plating
- nickel plating
- alloy die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 48
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 66
- 229910052759 nickel Inorganic materials 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 10
- 238000004512 die casting Methods 0.000 claims description 12
- 239000007864 aqueous solution Substances 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- -1 fluorine ions Chemical class 0.000 claims description 5
- 238000007654 immersion Methods 0.000 abstract description 4
- 150000002500 ions Chemical class 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- 238000007788 roughening Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 239000011698 potassium fluoride Substances 0.000 description 2
- 235000003270 potassium fluoride Nutrition 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はアルミニウム合金ダイカストにニッケルめっき
を施す方法に関し、詳しくは、アルミニウム合金ダイカ
スト製品に半田付は性、耐食性等を付与するための密着
性に優れたニッケルめっき方法に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of applying nickel plating to an aluminum alloy die-cast product, and more specifically, the present invention relates to a method of applying nickel plating to an aluminum alloy die-cast product. The present invention relates to a nickel plating method with excellent properties.
従来、アルミニウムにニッケルめっきを施す方法として
、亜鉛置換法が良く知られている。この方法は亜鉛置換
処理によってアルミニウム表面に亜鉛を薄く被覆してか
らニッケルめっきを施す方法である。−船釣には、密着
性を確保するため亜鉛被覆層を一旦除去し、再度亜鉛置
換処理する、いわゆるダブルジンケート法が使われてお
り、さらにニッケルめっきについても、銅めっき処理を
した後にニッケルめっきする方法が良く知られている。Conventionally, the zinc substitution method is well known as a method for applying nickel plating to aluminum. In this method, the aluminum surface is coated with a thin layer of zinc through zinc substitution treatment, and then nickel plating is applied. - For boat fishing, the so-called double zincate method is used, in which the zinc coating layer is removed once and zinc is replaced again to ensure adhesion, and nickel plating is also performed after copper plating. The method to do this is well known.
従来法である亜鉛置換法は、アルミニウムの純度が高い
場合には適性な置換処理条件は広いが、シリコンや銅と
いった合金成分が増加してくると、置換処理条件が狭く
なり、シリコン含有量が最高１３％と多いアルミニウム
合金ダイカストに至っては、事実上、密着性の優れたニ
ッケルめっき膜を得ることができない。The conventional zinc substitution method has a wide range of suitable substitution treatment conditions when the purity of aluminum is high, but as alloy components such as silicon and copper increase, the substitution treatment conditions become narrower and the silicon content increases. When it comes to aluminum alloy die casting with a maximum of 13%, it is virtually impossible to obtain a nickel plating film with excellent adhesion.
またダブルジンケート処理後、直接、無電解ニッケルめ
っきをする方法もあるが、密着性のポイントは適性な亜
鉛置換処理が行われるか否かであり、密着性の信転性は
不充分であった。There is also a method of directly applying electroless nickel plating after double zincate treatment, but the key to adhesion is whether or not an appropriate zinc replacement treatment is performed, and the reliability of adhesion was insufficient. .
本発明者は前記従来法の問題点を解決するために、アル
ミニウム合金ダイカストを水酸化ナトリウムまたは水酸
化カリウム水溶液に浸漬して表面をレベリングし、さら
に、弗素イオンを含有する硝酸に浸漬して、アルミニウ
ム合金ダイカスト表面からニッケルめっきに有害なシリ
コンを選択的に除去して表面のシリコン濃度を低下させ
、しかる後、ニッケルめっきを施す方法を発明した。In order to solve the problems of the conventional method, the present inventor leveled the surface of an aluminum alloy die cast by immersing it in an aqueous solution of sodium hydroxide or potassium hydroxide, and then immersing it in nitric acid containing fluorine ions. We have invented a method in which silicon, which is harmful to nickel plating, is selectively removed from the surface of an aluminum alloy die-cast to lower the silicon concentration on the surface, and then nickel plating is applied.
第１工程のアルカリ水溶液への浸漬は、アルミニウム合
金ダイカスト表面の脱脂と表層の溶解によって表面をレ
ベリングし、アルミニウム合金ダイカスト表面のうねり
を軽減することを目的としている。The purpose of the immersion in the alkaline aqueous solution in the first step is to level the surface by degreasing the surface of the aluminum alloy die casting and dissolving the surface layer, thereby reducing waviness on the surface of the aluminum alloy die casting.
また、第２工程は、弗素イオンによるシリコンの選択的
除去と、その際に生ずるエツチングスマットを硝酸によ
って速やかに溶液中に溶解し、清浄な表面を得るために
実施する。この作用効果を確認するため、鋳造状態での
アルミニウム合金ダイカスト表面をＥＰＭＡで面分析し
、後述の実施例に示す第１工程と第２工程を経たアルミ
ニウム合金ダイカストを同様に面分析して比較を試みた
。The second step is carried out in order to selectively remove silicon using fluorine ions and quickly dissolve the etching smut generated at this time into a solution using nitric acid to obtain a clean surface. In order to confirm this effect, the surface of the aluminum alloy die cast in the cast state was analyzed using EPMA, and the aluminum alloy die cast that had gone through the first and second steps shown in the examples below were also analyzed and compared. I tried.
その結果、シリコンの含有量は、鋳造状態では１３．８
％であったが、第２工程後では４．３％に減少していた
。このような表面のシリコン含有量の低下は、ニッケル
めっき膜の密着力向上に極めて有効である。As a result, the silicon content in the cast state is 13.8
%, but it decreased to 4.3% after the second step. Such a reduction in the silicon content on the surface is extremely effective in improving the adhesion of the nickel plating film.
また、第１および第２工程により、アルミニウム合金ダ
イカストの表面粗さが増大するとともに、その形状が複
雑化し、めっき膜の密着性を大きく支配するアンカー効
果（めっき膜と材料の界面を複雑にしてめっき剥離に対
する物理的抵抗を生み出す；投錨効果）を得ることがで
きる。Additionally, due to the first and second steps, the surface roughness of the aluminum alloy die-casting increases, the shape becomes more complicated, and the anchor effect that greatly controls the adhesion of the plating film (complicating the interface between the plating film and the material) This creates physical resistance to plating peeling (anchoring effect).
即ち、本発明の要旨とするところは、アルミニウム合金
ダイカストにニッケルめっきを施すに際して、該アルミ
ニウム合金ダイカストを、水酸化ナトリウムまたは水酸
化カリウム水溶液に浸漬する第１工程と、弗素イオンを
含有する硝酸に浸漬する第２工程により表面調整するこ
とを特徴とするアルミニウム合金ダイカストへのニッケ
ルめっき方法である。That is, the gist of the present invention is that when applying nickel plating to an aluminum alloy die-cast, the first step is to immerse the aluminum alloy die-cast in an aqueous solution of sodium hydroxide or potassium hydroxide, and to immerse the die-cast aluminum alloy in nitric acid containing fluorine ions. This is a nickel plating method for aluminum alloy die casting, characterized in that the surface is conditioned by a second step of dipping.
第２工程で使用する処理液の弗素イオン供給源は、弗化
水素酸、弗化カリウム、弗化ナトリウム等の弗化物、弗
素と他のハロゲンとの化合物、さらに硼弗化カリウムや
硼弗化ナトリウムに代表される多くの金属および非金属
元素を中心元素とするフルオロ錯塩等である。Fluoride ion sources for the treatment liquid used in the second step include hydrofluoric acid, fluorides such as potassium fluoride and sodium fluoride, compounds of fluorine and other halogens, and potassium fluoride and fluoride. These include fluoro complex salts that have many metals and nonmetallic elements such as sodium as their central elements.
また、スマットを除去する硝酸は１５％以上の濃度であ
ればスマット除去の目的を達することができる。Further, if the concentration of nitric acid for removing smut is 15% or more, the purpose of removing smut can be achieved.
さらにシリコンの選択除去を促進するために、酢酸を加
えることも効果的である。Furthermore, it is also effective to add acetic acid to promote selective removal of silicon.
本発明のニッケルめっき方法は、従来法として多用され
ているように予め銅めっきを施す必要はなく、第２工程
後に直接、ニッケルめっきを実施する。また、アルミニ
ウム合金ダイカスト製品は一般的に形状が複雑であり、
めっきつきまわり性を確保するために、電解めっきより
も、ニッケルー燐やニッケルー硼素系の無電解ニッケル
めっきが望ましい。In the nickel plating method of the present invention, there is no need to perform copper plating in advance as is often used in conventional methods, and nickel plating is directly performed after the second step. In addition, aluminum alloy die-casting products generally have complicated shapes,
In order to ensure good plating coverage, electroless nickel plating based on nickel-phosphorus or nickel-boron is preferable to electrolytic plating.
次に本発明の特徴を実施例で明らかにする。 Next, the features of the present invention will be clarified by examples.
材質ＡＤＣ１２、厚さ３ｍｍＸ幅３０ｍｍＸ長さ５５ｍ
ｍのアルミニウム合金ダイカストを５％水酸化ナトリウ
ム水溶液に５分間浸漬し、水洗後、４０％硝酸＋８％弗
化水素酸水溶液に５分間浸漬し水洗後、無電解ニッケル
めっきを施した。無電解ニッケルめっきは燐８％を含有
するニッケルー燐合金めっきができる市販のめっき液を
使用し、めっき厚さは５μｍとした。Material ADC12, thickness 3mm x width 30mm x length 55m
An aluminum alloy die cast of No. m was immersed in a 5% aqueous sodium hydroxide solution for 5 minutes, washed with water, then immersed in a 40% nitric acid + 8% hydrofluoric acid aqueous solution for 5 minutes, washed with water, and then electroless nickel plating was applied. For electroless nickel plating, a commercially available plating solution capable of producing nickel-phosphorus alloy plating containing 8% phosphorus was used, and the plating thickness was 5 μm.
本出願人が先に出願した「剥離強度測定法およびその装
置」 （特開昭５４−６２８８７号公報）によってニッ
ケルめっき皮膜の密着力を測定した結果、剥離強度は２
．０ｋｇｆ／ｃｍであった。As a result of measuring the adhesion of the nickel plating film using the "Peel Strength Measuring Method and Apparatus" (Japanese Unexamined Patent Publication No. 54-62887) previously filed by the present applicant, the peel strength was 2.
．． It was 0 kgf/cm.
さらに、該めっき皮膜に銅製のリードビンを半田付けし
、引張試験を行ったところ、破断強度は７、 ５ ｋ
ｇ ｆ ／ｍｍｚと高く、破断場所は接合材の半田内で
あった。即ち本発明によるニッケルめっき皮膜の密着力
は半田接合強度よりも上回っていることが判明した。Furthermore, when a copper lead bottle was soldered to the plating film and a tensile test was performed, the breaking strength was 7.5 k.
The g f /mmz was high, and the fracture location was within the solder of the bonding material. That is, it was found that the adhesion strength of the nickel plating film according to the present invention exceeded the solder joint strength.
〔比較例］
前記実施例と同じ材質、寸法のアルミニウム合金ダイカ
スト試験片を、５％水酸化ナトリウム水溶液に５分間浸
漬し、水洗後、４０％硝酸水溶液に５分間浸漬し、水洗
後、実施例と同じ方法で５μｍニッケルめっきを施して
ニッケルめっき皮膜の密着力を測定した結果、剥離強度
は０．３ｋｇＥ ／ ｃ ｍ、破断強度は２． ０ ｋ
ｇ ｆ ７ｍｍ”と低いものであった。また破断場所
はニッケルめっきとアルミニウム合金ダイカストの界面
であった。[Comparative example] An aluminum alloy die-casting test piece having the same material and dimensions as the above example was immersed in a 5% aqueous sodium hydroxide solution for 5 minutes, washed with water, then immersed in a 40% nitric acid aqueous solution for 5 minutes, and after washing with water, the test piece was prepared as shown in the example. 5 μm nickel plating was applied using the same method as above, and the adhesion of the nickel plating film was measured. As a result, the peel strength was 0.3 kgE/cm, and the breaking strength was 2. 0k
g f was as low as 7 mm.The fracture location was at the interface between the nickel plating and the aluminum alloy die casting.
実施例と同じ材質、寸法のアルミニウム合金ダイカスト
試験片に、通常のダブルジンケート処理を施した後、実
施例と同じ方法で５μｍニッケルめっきを施してニッケ
ルめっき皮膜の密着力を測定した結果、剥離強度は０．
８ｋｇｆ／ｃｍ、破断強度は４． Ｏｋ ｇ ｆ ７
ｍｍ”と低いものであった。また、破断場所はニッケル
めっきとアルミニウム合金ダイカストの界面であった。An aluminum alloy die-cast specimen made of the same material and dimensions as in the example was subjected to normal double zincate treatment, and then 5 μm nickel plating was applied in the same manner as in the example, and the adhesion strength of the nickel plating film was measured. As a result, the peel strength was determined. is 0.
8kgf/cm, breaking strength is 4. Ok g f 7
The fracture location was at the interface between the nickel plating and the aluminum alloy die casting.
本発明によるアルミニウム合金ダイカストへのニッケル
めっき方法は、以上詳述したように、アルカリ水溶液浸
漬処理に引き続いて、弗素イオンを含有する硝酸浸漬処
理により、表面の粗面化とともに、表面シリコン濃度を
低減させて、密着力を大幅に向上させたアルミニウム合
金ダイカストへのニッケルめっき方法である０本発明に
よれば、従来法では、密着力に優れたニッケルめっきが
できなかったＪＩＳ；アルミニウム合金ダイカスト（Ａ
ＤＣｌ ０．ＡＤＣｌ ２等）、Ａ３９０や鍛造品のＡ
４０３２ＦＤ等にニッケルめっきが回部になった。As detailed above, the method for nickel plating aluminum alloy die castings according to the present invention involves immersion treatment in an alkaline aqueous solution followed by nitric acid immersion treatment containing fluorine ions to roughen the surface and reduce the surface silicon concentration. According to the present invention, it is a method of nickel plating aluminum alloy die-casting that has significantly improved adhesion.
DCl 0. ADCl 2 etc.), A390 and forged products
Nickel plating is now used on parts such as 4032FD.
Claims (1)
施すに際して、該アルミニウム合金ダイカストを、水酸
化ナトリウムまたは水酸化カリウム水溶液に浸漬する第
１工程と、弗素イオンを含有する硝酸に浸漬する第２工
程と、ついでニッケルめっきを施すことを特徴とするア
ルミニウム合金ダイカストへのニッケルめっき方法。When applying nickel plating to the surface of an aluminum alloy die cast, the aluminum alloy die cast is first immersed in an aqueous solution of sodium hydroxide or potassium hydroxide, a second step is immersed in nitric acid containing fluorine ions, and then nickel plating is performed. A method of nickel plating on aluminum alloy die casting, characterized by applying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33895189A JPH03197686A (en) | 1989-12-26 | 1989-12-26 | Method for plating die-cast product of aluminum alloy with nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33895189A JPH03197686A (en) | 1989-12-26 | 1989-12-26 | Method for plating die-cast product of aluminum alloy with nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03197686A true JPH03197686A (en) | 1991-08-29 |
Family
ID=18322867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33895189A Pending JPH03197686A (en) | 1989-12-26 | 1989-12-26 | Method for plating die-cast product of aluminum alloy with nickel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03197686A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011219828A (en) * | 2010-04-12 | 2011-11-04 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
| JP2012143798A (en) * | 2011-01-13 | 2012-08-02 | Hikari Keikinzoku Kogyo Kk | Plated aluminum alloy casting and method for production thereof |
| US9575216B2 (en) | 2011-05-24 | 2017-02-21 | National Institute Of Advanced Industrial Science And Technology | Infrared-transmitting film, method for producing infrared-transmitting film, infrared optical component, and infrared device |
| KR20210057496A (en) * | 2019-11-12 | 2021-05-21 | (주)신양플레이팅 | Matte plating composition containing inorganic fluoride |
-
1989
- 1989-12-26 JP JP33895189A patent/JPH03197686A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011219828A (en) * | 2010-04-12 | 2011-11-04 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
| JP2012143798A (en) * | 2011-01-13 | 2012-08-02 | Hikari Keikinzoku Kogyo Kk | Plated aluminum alloy casting and method for production thereof |
| US9575216B2 (en) | 2011-05-24 | 2017-02-21 | National Institute Of Advanced Industrial Science And Technology | Infrared-transmitting film, method for producing infrared-transmitting film, infrared optical component, and infrared device |
| KR20210057496A (en) * | 2019-11-12 | 2021-05-21 | (주)신양플레이팅 | Matte plating composition containing inorganic fluoride |
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