JPH03195790A - Material bonding method and apparatus therefor - Google Patents

Abstract

PURPOSE:To enable the application of an adhesive to an uneven surface at a time in good state and enable the bonding work in a short time by applying an adhesive to an adherend with a coil carrying an adhesive and bonding the adherends with each other. CONSTITUTION:An adhesive (preferably a hot-melt adhesive) is attached to a coil 2 and the coil is made to contact with at least one of two adherends to be bonded to transfer the adhesive from the coil 2 to the adherend 1 and the adherend bodies (g) and (f) are bonded with each other. Even if the surface of the adherend body has unevenness, the coil nearly accurately follows the uneven surface and contacts the surface by the elastic deformation of the coil. Furthermore, the adhesive is surely held between the adjacent loops of the coil.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an object bonding method and a bonding device used when bonding objects using an adhesive.

[Prior Art] Conventionally, when objects are bonded together using an adhesive, the process is generally performed as shown in FIGS. 20 to 23.

In Fig. 20, a and b are objects to be bonded, respectively, and in Fig. 21, C is a container containing adhesive d, e is a roller, and the objects are bonded to roller e as shown in the figure. Apply the agent d, and then apply the second layer using the same roller e.
As shown in FIG. 2, adhesive d is applied to at least one of objects a and b to be bonded, and then, as shown in FIG. 23, both objects a and b are brought into contact with each other and bonded.

[Problems to be Solved by the Invention] When using the conventional bonding method as described above, as shown in FIGS. 24 and 25, two objects f and g to be bonded are
Similarly, in cases such as i, the bonded portion may be bent to form unevenness. In such a case, if you try to apply the adhesive using roller e etc. as described above, the 26th
As shown in FIG. 27 and FIG. 27, it is difficult to apply adhesive to the concave portion j of the bent portion and the like.

For this reason, it was difficult to adhere objects having bent portions to each other.

This invention was made in order to solve the above-mentioned problems, and its purpose is to easily apply adhesive to the concave portions of objects to be bonded when there are concavities and convexities in the bonding area.
An object of the present invention is to provide an object bonding method and a bonding device capable of bonding both objects.

[Means for Solving Problem B] Regarding this invention that achieves the above object, we will first describe a method for bonding objects.The method involves applying adhesive to a coil, and then attaching the coil to at least one of two objects to be bonded. This is a method of bonding objects, in which the adhesive on the coil is attached to the object, and then the objects are brought into contact with each other and attached.

Further, the adhesive may be a hot melt adhesive.

Further, the object is a method of bonding the object, which is a member of a fugitive model for casting.

Next, the gluing device is an object gluing device consisting of a coil and means for supplying adhesive to the coil.

In addition, the adhesive is a hot melt adhesive and is a bonding device for the object 6. [Example] In FIG.
Made of appropriate materials such as rubber, ceramics, books, etc.
A coil 2 is provided on the base 1. The coil 2 is made of metal, but for example, it is made of steel wire. In addition, it may be formed of other brass alloys (so-called brass), stainless steel, etc., or may be plated on the metal surface to improve corrosion resistance or wettability.
The substrate may be coated with a synthetic resin, etc., and its shape may be a circular coil as shown in FIG. 5, an elliptical coil as shown in FIG. 8, a rectangular coil (not shown), etc. The method of fixing the coil 2 to the coil 1 is as follows:
As shown in FIG. 5, a part of the coil may be buried in the synthetic resin base 1 by insert molding, or a part of the coil may be buried in the base 1 made of synthetic resin.
As shown in FIG. 9 and FIG. 9, the fixing member 3 may be attached to the base body 1 using screws 4 or the like, or the fixing member 3 may be formed into a medium-wide shape as shown in FIG. Although not shown, parts may be fixed by welding, brazing, etc. 5 is an adhesive adhesion device formed in this way, 6
is the arm.

Further, the base body 1 shown in FIG. 1 is formed in a shape corresponding to the shape of f of objects f and g to be bonded shown in FIG. 24, for example. In this way, the base 1 is formed into a shape corresponding to the shape of the object to which the adhesive is attached.

Note that as shown in FIGS. 10, 11, and 13, the base 1 may be provided at both ends of the coil 2, and in such a case, the base 1 may not correspond to the shape of the object to be bonded. In this case, the adhesive application device 5 formed in this way may be used.
As shown in FIGS. 11 and 13, adhesive can be attached to objects of virtually any shape. This is because the coil 2 deforms almost faithfully following the shape of the unevenness, deforms elastically so as to be in contact with the unevenness, and also allows the adhesive to be held well between adjacent wire rings of the coil. It is from.

Note that FIGS. 12 and 13 show other embodiments of the present invention, in which the base 1 has a shape different from that shown in FIG. 1.

Further, the amount of adhesive retained by the coil 2 can be changed by changing the spacing between its individual wire rings and by changing the diameter or width.

Next, as for the adhesive, a normal adhesive as shown in FIG. 21 may be used, but in this invention, a hot melt adhesive was used as an example. The hot melt adhesive is a solid at room temperature, and is approximately 100'
It is a type of adhesive that becomes liquid at a temperature of C or higher. In FIG. 2, reference numeral 7 denotes a heater, which is used to melt the hot melt adhesive 9 in the container 8. To describe the operation of this embodiment, the arm of the adhesive dispensing device 5 shown in FIG. 6 and have a robot (not shown) hold it, place it in a container 8 containing melted hot melt adhesive 9 as shown in FIG. As shown in FIG. 3, this is pressed against at least one of the objects f to be bonded, and while the coil 2 is elastically deformed, the adhesive 9 is adhered from the coil 2 to the surface of the object f. In this case, as an example of the object f, a fugitive model member made of expanded polystyrene used in casting castings was used. The members are then joined as shown in FIG. Also, Figures 12 and 13
What is shown in the figure is the object h, 1 shown in FIG.
FIG. 14 shows a case in which the bonding is performed well, as shown in FIG.

The coil 2 has durability because it is made of metal, and its elasticity has a long life.

Further, the base body 1 may be formed as shown in FIG. 15, in which 1 is a base body made of rubber, flexible synthetic resin, etc., and 13 is a holding portion. By forming it this way.

The coil 2 can be flexibly reinforced. Further, as shown in FIG. 16, the base 1 is a flexible or hard porous body, such as a filter-like body made of cloth, nonwoven fabric, felt, fiber, or thread, or an ordinary string, rubber, or various synthetic resin rings. The coil ring is made of sponge, various sintered metals, porous bodies made of metal or ceramics, metal, synthetic resin, rubber, etc., and the adhesive is adsorbed to the base 1, so that the coil 2 comes into contact with the object. The adhesive may be additionally supplied from the base body 1 when the adhesive is applied.

Further, the base body 1 may be formed as shown in FIGS. 17 and 18. In the figures, the base body 1 is formed as a hollow cylinder with a closed end, and a large number of small holes 14 are formed in the cylinder. is formed, and the substrate l is communicated with a pressure device 15 through a pipe 16, and the pressure device 15 is connected to a hot melt adhesive tank 1.
It is connected to 7. Reference numeral 7 indicates a heater, and reference numeral 18 indicates a heat-retaining heater.The pressure device 15 is capable of applying pressure to the adhesive within the base 1 either constantly or intermittently. The coil 2 is fitted around the outer periphery of the base 1, the hot melt adhesive is melted, and the pressure device 1
5 to the base 1, is supplied to the coil 2 through the small hole 14, and is attached from the coil 2 to an object (not shown). 15a is a controller, and 19 is a pedestal.

Note that the various porous bodies described with reference to FIG. 16 may be interposed between the coil 2 and the substrate 1 of this device, and the adhesive may be a normal adhesive instead of a hot melt adhesive. In that case, it goes without saying that the heater 7, the heat-retaining heater 18, etc. are omitted.

Further, the base 1 may be formed as shown in FIG. 19, in which 20 is a spacer, and this spacer 2
By changing the thickness of 0, the distance between each wire ring of the coil 2
1 can also be changed.

[Effects of the Invention] The present invention is configured as described above, and includes applying an adhesive to a coil, bringing the coil into contact with at least one of the objects to be bonded, and causing the adhesive of the coil to adhere to the object. ,
Next, by attaching the EN objects in contact with each other, even if the objects to be bonded have irregularities, the coils will almost faithfully follow the irregularities, elastically deform and come into contact, and the individual adjacent coils will Since the adhesive can be held well between the wire rings, the adhesive can be well adhered to the uneven portions, and the object can be well bonded.

In addition, those using hot melt adhesive as adhesive,
Since the coil can apply the same adhesive to the uneven portions of the object at once, the adhesive can be applied in a short time, and the subsequent attachment of the objects to each other can also be done with extra time. can.

In addition, when a fugitive model member for casting is used as the m-body to be bonded, the coil does not damage the model member, which is relatively fragile, and the coil itself almost faithfully follows the shape of the model member. It can be elastically deformed and adhesive can be attached to it.

[Brief explanation of drawings]

1 to 4 show embodiments of the present invention, FIG. 1 is a perspective view of the object bonding device, FIG. 2 is a partial sectional view of the object bonding device in use, and FIG. 3 is a perspective view of the object bonding device. 4 is a perspective view showing a bonded object, FIG. 5 is a side view of a part of a bonding device showing another embodiment of the present invention, and FIG. A side view of the device shown in FIG. 1, FIG. 7 shows another embodiment, a diagram corresponding to FIG. 5, FIG. 8 shows still another embodiment, a diagram corresponding to FIG. 5, 9 is a partial perspective view of the device shown in FIG. 6, No. 101J is a perspective view of a portion of the bonding device showing a further embodiment of the present invention, FIG. 11 is a view showing the operating state of the same device, and No. 12 Figure 13 is a diagram showing a state in which an adhesive device according to another embodiment of the present invention is used.
The figure shows the device shown in Fig. 1θ in a different usage state from Fig. 11, Fig. 14 shows an object bonded by the gluing operation shown in Fig. 12 or Fig. 13, and Fig. 15 shows the device in use as shown in Fig. 1θ. A perspective view of a part of a bonding device showing a further embodiment of the present invention, No. 1
6 is a diagram corresponding to FIG. 15 showing still another embodiment, FIG. 17 is a sectional view of a part of the bonding device showing still another embodiment, and FIG. 18 is a diagram of the part of the device shown in FIG. 17. Detail # diagram, 1st
FIG. 9 is a partial view of the bonding device showing an embodiment of the pond, No. 20.
23 to 23 are diagrams showing the steps of a conventional method for bonding objects, FIGS. 24 and 25 are perspective views of objects to be bonded using the conventional method and the present invention, respectively.
The figure is an explanatory diagram of the conventional method of bonding objects.
FIG. 2 is an explanatory diagram of a conventional bonding method for objects different from those shown in the figure. l...Base 2...Coil 9...Hot melt adhesive Figure 1

Claims (1)

[Claims] 1. Apply adhesive to a coil, bring the coil into contact with at least one of two objects to be bonded, and attach the adhesive on the coil to the object; A method for bonding objects, which is characterized by attaching objects so that they are in contact with each other. 2. The method for bonding objects according to claim 1, wherein the adhesive is a hot melt adhesive. 3. The method for bonding objects according to claim 1 or 2, wherein the object is a member of a fugitive model for casting. 4. An object bonding device comprising a coil and means for supplying adhesive to the coil. 5. The object bonding device according to claim 4, wherein the adhesive is a hot melt adhesive.