JPH03195790A - Material bonding method and apparatus therefor - Google Patents
Material bonding method and apparatus thereforInfo
- Publication number
- JPH03195790A JPH03195790A JP33549089A JP33549089A JPH03195790A JP H03195790 A JPH03195790 A JP H03195790A JP 33549089 A JP33549089 A JP 33549089A JP 33549089 A JP33549089 A JP 33549089A JP H03195790 A JPH03195790 A JP H03195790A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- coil
- objects
- bonding
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000000463 material Substances 0.000 title description 2
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- 239000004831 Hot glue Substances 0.000 claims abstract description 14
- 238000005266 casting Methods 0.000 claims description 5
- 230000005489 elastic deformation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004794 expanded polystyrene Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- -1 felt Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は接着剤を用いて物体を接着する場合に用いら
れる、物体の接着方法及び接着装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an object bonding method and a bonding device used when bonding objects using an adhesive.
［従来の技術］
従来、接着剤を用いて物体と物体を接着させる場合、一
般にほぼ第２０図〜第２３図に示すようにして行われる
。[Prior Art] Conventionally, when objects are bonded together using an adhesive, the process is generally performed as shown in FIGS. 20 to 23.
第２０図において、ａ、ｂはそれぞれ接着すべき物体で
あり、第２１図において、Ｃは接着剤ｄを収容した容器
、ｅはローラを示す、そして同図に示すようにしてロー
ラｅに接着剤ｄを付着させ、次に同ローラｅにより第２
２図に示すように、接着すべき物体ａ、ｂの少なくとも
一方に接着剤ｄを付着させ、次に第２３図に示すように
、前記両物体ａ、ｂを互いに接し合せて接着させる。In Fig. 20, a and b are objects to be bonded, respectively, and in Fig. 21, C is a container containing adhesive d, e is a roller, and the objects are bonded to roller e as shown in the figure. Apply the agent d, and then apply the second layer using the same roller e.
As shown in FIG. 2, adhesive d is applied to at least one of objects a and b to be bonded, and then, as shown in FIG. 23, both objects a and b are brought into contact with each other and bonded.
［発明が解決しようとする課題］
上記のような従来の接着方法を用いる場合、第２４図及
び第２５図に示すように、接着すべき二つの物体ｆ、ｇ
及び同り、ｉ等において、接着部分が屈曲して凹凸を形
成している場合がある。このような場合、上記のように
ローラｅ等を用いて接着剤を着けようとすると、第２６
図及び第２７図に示すようになり、屈曲部の凹部ｊ及び
同に等に接着剤を着けることは困難である。[Problems to be Solved by the Invention] When using the conventional bonding method as described above, as shown in FIGS. 24 and 25, two objects f and g to be bonded are
Similarly, in cases such as i, the bonded portion may be bent to form unevenness. In such a case, if you try to apply the adhesive using roller e etc. as described above, the 26th
As shown in FIG. 27 and FIG. 27, it is difficult to apply adhesive to the concave portion j of the bent portion and the like.
このため屈曲部を有する物体相互の接着け困難であった
。For this reason, it was difficult to adhere objects having bent portions to each other.
この発明は、上記のような課題を解決するためになされ
たもので、その目的は、接着すべき物体の、接着部に凹
凸がある場合に、その凹部にも容易に接着剤を着けて１
両物体を接着することのできる、物体の接着方法及び接
着装置を提供することである。This invention was made in order to solve the above-mentioned problems, and its purpose is to easily apply adhesive to the concave portions of objects to be bonded when there are concavities and convexities in the bonding area.
An object of the present invention is to provide an object bonding method and a bonding device capable of bonding both objects.
［Ｂ題を解決するための手段］
上記の目的を達成するこの発明について、まず物体の接
着方法について述べるとそれは、コイルに接着剤を着け
、該コイルを、接着すべき二つの物体の少なくとも一方
に接しさせて、該コイル上の接着剤を該物体に付着させ
１次に該物体相互を互いに接しさせて着け合わせる、物
体の接着方法である。[Means for Solving Problem B] Regarding this invention that achieves the above object, we will first describe a method for bonding objects.The method involves applying adhesive to a coil, and then attaching the coil to at least one of two objects to be bonded. This is a method of bonding objects, in which the adhesive on the coil is attached to the object, and then the objects are brought into contact with each other and attached.
又、前記接着剤はホットメルト接着剤である前記物体の
接着方法である。Further, the adhesive may be a hot melt adhesive.
又、前記物体は鋳物鋳造用の消失性模型の部材である前
記物体の接着方法である。Further, the object is a method of bonding the object, which is a member of a fugitive model for casting.
次に接着装置について述べるとそれは、コイルと該コイ
ルに接着剤を供給する手段とから成る、物体の接着装置
である。Next, the gluing device is an object gluing device consisting of a coil and means for supplying adhesive to the coil.
又、上記接着剤はホットメルト接着剤である上記物体の
接着装置である６
［実施例］
第１図において、１は基体であり、合成樹脂又は金属、
ゴム、セラミックス、本等適宜の材質により形成され、
同基体１にコイル２が設けられている。同コイル２は金
属によって形成されるが一例として鋼線により形成され
た。なおその他黄銅合金（いわゆる真鍮）ステンレスス
チール等により形成されてもよく、又金属の表面に耐食
又は濡れ性を良好にするメツキを行ったものでもよく、
ス合成樹脂被覆等を行ったものでもよく、その形状も第
５図に示すような円形コイル、第８図に示すような楕円
形コイル、図示しない角形コイル等を任意に用いてよい
、そして基体１に対するコイル２の固定方法としては、
第５図に示すように合成樹脂製の基体１中にインサート
成型等によりコイルの一部を埋設してもよく、又は第６
図及び第９図に示すように固定部材３により、ねじ４等
を用いて基体１に取付けてもよい、なお第７図に示すよ
うに固定部材３を中広に形成してもよい、又図示は省略
するが部分的に溶接、ろうけけ等をして固定してもよい
、なお、５はこうして形成された接着剤の付着装置、６
はアームである。In addition, the adhesive is a hot melt adhesive and is a bonding device for the object 6. [Example] In FIG.
Made of appropriate materials such as rubber, ceramics, books, etc.
A coil 2 is provided on the base 1. The coil 2 is made of metal, but for example, it is made of steel wire. In addition, it may be formed of other brass alloys (so-called brass), stainless steel, etc., or may be plated on the metal surface to improve corrosion resistance or wettability.
The substrate may be coated with a synthetic resin, etc., and its shape may be a circular coil as shown in FIG. 5, an elliptical coil as shown in FIG. 8, a rectangular coil (not shown), etc. The method of fixing the coil 2 to the coil 1 is as follows:
As shown in FIG. 5, a part of the coil may be buried in the synthetic resin base 1 by insert molding, or a part of the coil may be buried in the base 1 made of synthetic resin.
As shown in FIG. 9 and FIG. 9, the fixing member 3 may be attached to the base body 1 using screws 4 or the like, or the fixing member 3 may be formed into a medium-wide shape as shown in FIG. Although not shown, parts may be fixed by welding, brazing, etc. 5 is an adhesive adhesion device formed in this way, 6
is the arm.
又、第１図に示す前記基体１は、−例として第２４図に
示す接着すべき物体ｆ、ｇのうち、同ｆの形状に対応し
た形状に形成されている。このように基体１は、接着剤
を付着させる物体の形状に対応した形状に形成される。Further, the base body 1 shown in FIG. 1 is formed in a shape corresponding to the shape of f of objects f and g to be bonded shown in FIG. 24, for example. In this way, the base 1 is formed into a shape corresponding to the shape of the object to which the adhesive is attached.
なお第１０図、第１１図、第１３図に示すように、コイ
ル２の両端に基体１を設けてもよく、このような場合に
は同基体１は接着すべき物体の形状に対応させなくても
よい、この場合このように形成した接着剤の付着装置５
は第１１図、第１３図に示すように、はぼ任意の形状の
物体に接着剤を付着させることができる。これはコイル
２が凹凸の形状にほぼ忠実に追随して変形し、その凹凸
部に接するように弾性変形するからであり、かつ又コイ
ルの隣合う線輪の間に接着剤を良好に保持できるからで
ある。Note that as shown in FIGS. 10, 11, and 13, the base 1 may be provided at both ends of the coil 2, and in such a case, the base 1 may not correspond to the shape of the object to be bonded. In this case, the adhesive application device 5 formed in this way may be used.
As shown in FIGS. 11 and 13, adhesive can be attached to objects of virtually any shape. This is because the coil 2 deforms almost faithfully following the shape of the unevenness, deforms elastically so as to be in contact with the unevenness, and also allows the adhesive to be held well between adjacent wire rings of the coil. It is from.
なお、第１２図、第１３図に示すものはこの発明の他の
実施例であり、基体１の、第１図に示すものと異っ形状
のものを示す。Note that FIGS. 12 and 13 show other embodiments of the present invention, in which the base 1 has a shape different from that shown in FIG. 1.
又、前記コイル２は、その個々の線輪の間隔を変えるこ
とにより、及び直径又はさしわたしを変えることにより
、接着剤の保持量を変更することができる。Further, the amount of adhesive retained by the coil 2 can be changed by changing the spacing between its individual wire rings and by changing the diameter or width.
次に前記接着剤については、第２１図に示すような通常
の接着剤を用いて差し支えないが、この発明においては
、−例としてホットメルト接着剤が用いられた。同ホッ
トメルト接着剤は常温では個体であり、はぼ１００ ’
Ｃ以上の温度で液状となる形式の接着剤である。第２図
において７はヒータを示し、容器８中のホットメルト接
着剤９を溶解させている場合を示す、実施例の作用につ
いて述べると、第１図に示す接着剤のけ着装置５のアー
ム６を持ち、又、図示しないロボットに持たせ、第２図
に示すように溶解したホットメルト接着剤９を収容した
容器８中に入れ、回付着装ｒＩ１５のコイル２に接着剤
９を付け、これを第３図に示すように、接着すべき両物
体の少なくとも一方ｆに押しつけて、同コイル２を弾性
変形させつつ、接着剤９をコイル２から物体ｆの表面に
付着させる。なおこの場合物体ｆは、物体の一例として
鋳物の鋳造の際に用いられる発泡ポリスチレンにより形
成された消失性模型の部材が用いられた。そして同部材
は第４図に示すように接合される。又第１２図、第１３
図に示されるものは、前記第２５図に示した物体ｈ、１
を接着する場合であり、それが第１４図に示すように良
好に接着される場合を示している。Next, as for the adhesive, a normal adhesive as shown in FIG. 21 may be used, but in this invention, a hot melt adhesive was used as an example. The hot melt adhesive is a solid at room temperature, and is approximately 100'
It is a type of adhesive that becomes liquid at a temperature of C or higher. In FIG. 2, reference numeral 7 denotes a heater, which is used to melt the hot melt adhesive 9 in the container 8. To describe the operation of this embodiment, the arm of the adhesive dispensing device 5 shown in FIG. 6 and have a robot (not shown) hold it, place it in a container 8 containing melted hot melt adhesive 9 as shown in FIG. As shown in FIG. 3, this is pressed against at least one of the objects f to be bonded, and while the coil 2 is elastically deformed, the adhesive 9 is adhered from the coil 2 to the surface of the object f. In this case, as an example of the object f, a fugitive model member made of expanded polystyrene used in casting castings was used. The members are then joined as shown in FIG. Also, Figures 12 and 13
What is shown in the figure is the object h, 1 shown in FIG.
FIG. 14 shows a case in which the bonding is performed well, as shown in FIG.
なお前記コイル２は金属により形成されることにより耐
久性を有し、その弾性は長い寿命を有する。The coil 2 has durability because it is made of metal, and its elasticity has a long life.
又、前記基体１については第１５図に示すように形成さ
れてもよい、同図において１はゴム、柔軟な合成樹脂等
により形成された基体、１３は保持部である。このよう
に形成することにより。Further, the base body 1 may be formed as shown in FIG. 15, in which 1 is a base body made of rubber, flexible synthetic resin, etc., and 13 is a holding portion. By forming it this way.
コイル２を柔軟に補強することができる。又、前記基体
ｌは第１６図に示すように柔軟な又は硬質の多孔体、例
えば布、不織布、フェルト、繊維又は糸条等から成るフ
ィルタ状体、又は通常の紐、ゴム又は各種合成樹脂環装
のスポンジ、各種焼結金属、金属製又はセラミックス製
多孔体、又は金属、合成樹脂又はゴム等により形成され
たコイル環装とし、この基体１に接着剤を吸着させ、コ
イル２が物体に接した際にこの基体１から接着剤が、追
加して供給されるように形成されてもよい。The coil 2 can be flexibly reinforced. Further, as shown in FIG. 16, the base 1 is a flexible or hard porous body, such as a filter-like body made of cloth, nonwoven fabric, felt, fiber, or thread, or an ordinary string, rubber, or various synthetic resin rings. The coil ring is made of sponge, various sintered metals, porous bodies made of metal or ceramics, metal, synthetic resin, rubber, etc., and the adhesive is adsorbed to the base 1, so that the coil 2 comes into contact with the object. The adhesive may be additionally supplied from the base body 1 when the adhesive is applied.
又、前記基体１は第１７図及び第１８図に示すように形
成されてもよい、同図において基体１は末端の閉止した
中空の筒体に形成され、同筒体に多数の小孔１４が形成
され、同基体ｌは加圧装置１５に、パイプ１６によって
連通され、又同加圧装置１５はホットメルト接着剤槽１
７に連通されている。７はヒータ、１８は保温ヒータを
示す、又前記加圧装置１５は、常時又は間欠的に、基体
１内の接着剤に圧力を及ぼすことができるようになって
いる。そしてコイル２は前記基体１の外周に嵌合されて
おり、ホットメルト接着剤は溶解させられ、加圧装置１
５により基本１に送られ、前記小孔１４からコイル２に
供給され、コイル２から図示しない物体に付着させられ
るようになっている。１５ａはコントローラ、１９は台
座を示す。Further, the base body 1 may be formed as shown in FIGS. 17 and 18. In the figures, the base body 1 is formed as a hollow cylinder with a closed end, and a large number of small holes 14 are formed in the cylinder. is formed, and the substrate l is communicated with a pressure device 15 through a pipe 16, and the pressure device 15 is connected to a hot melt adhesive tank 1.
It is connected to 7. Reference numeral 7 indicates a heater, and reference numeral 18 indicates a heat-retaining heater.The pressure device 15 is capable of applying pressure to the adhesive within the base 1 either constantly or intermittently. The coil 2 is fitted around the outer periphery of the base 1, the hot melt adhesive is melted, and the pressure device 1
5 to the base 1, is supplied to the coil 2 through the small hole 14, and is attached from the coil 2 to an object (not shown). 15a is a controller, and 19 is a pedestal.
なお第１６図について述べた各種の多孔体を、この装置
のコイル２と基体１間に介在させてもよい、又接着剤は
ホットメルト接着剤でなく１通常の接着剤を用いてもよ
い、なおその場合、ヒータ７、保温ヒータ１８等は省略
されることは勿論である。Note that the various porous bodies described with reference to FIG. 16 may be interposed between the coil 2 and the substrate 1 of this device, and the adhesive may be a normal adhesive instead of a hot melt adhesive. In that case, it goes without saying that the heater 7, the heat-retaining heater 18, etc. are omitted.
又前記基本１は第１９図に示すように形成されてもよい
、同図において２０はスペーサであり、このスペーサ２
０の厚みを変えることにより、コイルの各線輪の間隔２
１も変更することができる。Further, the base 1 may be formed as shown in FIG. 19, in which 20 is a spacer, and this spacer 2
By changing the thickness of 0, the distance between each wire ring of the coil 2
1 can also be changed.
［発明の効果］
この発明は前記のように構成され、コイルに接着剤を着
け、このコイルを、接着すべき物体の少なくとも一方に
接しさせて、該コイルの接着剤を該物体にｆ付着させ、
次にＥＮ物体相互を接しさせて着け合わせることにより
、接着すべき物体に凹凸があっても前記コイルはその凹
凸にほぼ忠実に追随し、弾性変形して接し、かつ同コイ
ルの隣り合う個々の線輪間に良好に接着剤を保持できる
から、前記凹凸部に良好に接着剤を付着させることがで
き、前記物体を良好に接着することができる。[Effects of the Invention] The present invention is configured as described above, and includes applying an adhesive to a coil, bringing the coil into contact with at least one of the objects to be bonded, and causing the adhesive of the coil to adhere to the object. ,
Next, by attaching the EN objects in contact with each other, even if the objects to be bonded have irregularities, the coils will almost faithfully follow the irregularities, elastically deform and come into contact, and the individual adjacent coils will Since the adhesive can be held well between the wire rings, the adhesive can be well adhered to the uneven portions, and the object can be well bonded.
又、接着剤としてホットメルト接着剤を用いたものは、
前記コイルが前記物体の凹凸部に同接着剤を一度に付着
させることができるから、接着剤の付着を短時間にでき
、その後の、物体相互の付は合せに時間的余裕をもなら
すことができる。In addition, those using hot melt adhesive as adhesive,
Since the coil can apply the same adhesive to the uneven portions of the object at once, the adhesive can be applied in a short time, and the subsequent attachment of the objects to each other can also be done with extra time. can.
又接着するｍ体として鋳物鋳造用の消失性模型の部材を
用いたものは、比較的脆弱な同模型部材に対してもコイ
ルはそれを破損することなくコイル自体が同部材の形状
にほぼ忠実に追随して弾性変形して、これに接着剤を着
けることができる。In addition, when a fugitive model member for casting is used as the m-body to be bonded, the coil does not damage the model member, which is relatively fragile, and the coil itself almost faithfully follows the shape of the model member. It can be elastically deformed and adhesive can be attached to it.
第１図〜第４図はこの発明の実施例を示し、第１図は物
体の接着装置の部分の斜視図、第２図は物体の接着装置
の使用状態の一部断面図、第３図は接着作業の工程の一
部を示す図、第４図は接着された物体を示す斜視図、第
５図はこの発明の他の実施例を示す接着装置の部分の側
面図、第６図は第１図に示す装置の側面図、第７図は更
に他の実施例を示し、第５図に相当する図、第８図は更
に他の実施例を示し、第５図に相当する図、第９図は第
６図の装置の部分斜視図、第１０１Ｊはこの発明の更に
池の実施例を示す接着装置の部分の斜視図、第１１図は
同装置の作用状態を示す図、第１２図はこの発明の更に
他の実施例を示す接着装置の使用状態を示す図、第１３
図は第１θ図に示す装置の、第１１図と異る使用状態を
示す図、第１４図は第１２図又は第１３図に示す接着作
業により接着された物体を示す図、第１５図はこの発明
の更に池の実施例を示す接着装置の部分の斜視図、第１
６図は更に他の実施例を示す第１５図に相当する図、第
１７図は更に他の実施例を示す接着装置の部分の断面図
、第１８図は第１７図に示す装置の部分の詳＃図、第１
９図は更に池の実施例を示す接着装置の部分図、第２０
図〜第２３図はそれぞれ従来の、物体の接着方法の工程
を示す図、第２４図及び第２５図はそれぞれ従来の、及
びこの発明に用いられた接着する物体の斜視図、第２６
図は従来の物体の接着方法の説明図、第２７図は第２６
図に示すものと異る物体の、従来の接着方法の説明図で
ある。
ｌ・・・基体
２・・・コイル
９・・・ホットメルト接着剤
第１図1 to 4 show embodiments of the present invention, FIG. 1 is a perspective view of the object bonding device, FIG. 2 is a partial sectional view of the object bonding device in use, and FIG. 3 is a perspective view of the object bonding device. 4 is a perspective view showing a bonded object, FIG. 5 is a side view of a part of a bonding device showing another embodiment of the present invention, and FIG. A side view of the device shown in FIG. 1, FIG. 7 shows another embodiment, a diagram corresponding to FIG. 5, FIG. 8 shows still another embodiment, a diagram corresponding to FIG. 5, 9 is a partial perspective view of the device shown in FIG. 6, No. 101J is a perspective view of a portion of the bonding device showing a further embodiment of the present invention, FIG. 11 is a view showing the operating state of the same device, and No. 12 Figure 13 is a diagram showing a state in which an adhesive device according to another embodiment of the present invention is used.
The figure shows the device shown in Fig. 1θ in a different usage state from Fig. 11, Fig. 14 shows an object bonded by the gluing operation shown in Fig. 12 or Fig. 13, and Fig. 15 shows the device in use as shown in Fig. 1θ. A perspective view of a part of a bonding device showing a further embodiment of the present invention, No. 1
6 is a diagram corresponding to FIG. 15 showing still another embodiment, FIG. 17 is a sectional view of a part of the bonding device showing still another embodiment, and FIG. 18 is a diagram of the part of the device shown in FIG. 17. Detail # diagram, 1st
FIG. 9 is a partial view of the bonding device showing an embodiment of the pond, No. 20.
23 to 23 are diagrams showing the steps of a conventional method for bonding objects, FIGS. 24 and 25 are perspective views of objects to be bonded using the conventional method and the present invention, respectively.
The figure is an explanatory diagram of the conventional method of bonding objects.
FIG. 2 is an explanatory diagram of a conventional bonding method for objects different from those shown in the figure. l...Base 2...Coil 9...Hot melt adhesive Figure 1
Claims (1)
つの物体の、少なくとも一方に接しさせて、該コイル上
の接着剤を該物体に付着させ、次に該物体相互を互いに
接しさせて着け合せることを特徴とする物体の接着方法
。 ２、接着剤はホットメルト接着剤である請求項１記載の
物体の接着方法。 ３、物体は鋳物鋳造用の消失性模型の部材である請求項
１、又は２記載の物体の接着方法。 ４、コイルと該コイルに接着剤を供給する手段とから成
ることを特徴とする、物体の接着装置。 ５、接着剤はホットメルト接着剤である請求項４記載の
物体の接着装置。[Claims] 1. Apply adhesive to a coil, bring the coil into contact with at least one of two objects to be bonded, and attach the adhesive on the coil to the object; A method for bonding objects, which is characterized by attaching objects so that they are in contact with each other. 2. The method for bonding objects according to claim 1, wherein the adhesive is a hot melt adhesive. 3. The method for bonding objects according to claim 1 or 2, wherein the object is a member of a fugitive model for casting. 4. An object bonding device comprising a coil and means for supplying adhesive to the coil. 5. The object bonding device according to claim 4, wherein the adhesive is a hot melt adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33549089A JPH03195790A (en) | 1989-12-25 | 1989-12-25 | Material bonding method and apparatus therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33549089A JPH03195790A (en) | 1989-12-25 | 1989-12-25 | Material bonding method and apparatus therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03195790A true JPH03195790A (en) | 1991-08-27 |
Family
ID=18289157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33549089A Pending JPH03195790A (en) | 1989-12-25 | 1989-12-25 | Material bonding method and apparatus therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03195790A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104736256A (en) * | 2012-06-25 | 2015-06-24 | 3M创新有限公司 | Devices for coating contoured surfaces |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61118174A (en) * | 1984-11-13 | 1986-06-05 | Masao Nomi | Method for coating hot melt |
| JPH01301780A (en) * | 1988-05-30 | 1989-12-05 | Morikawa Sangyo Kk | Adhering method of article and device therefor |
| JPH01301779A (en) * | 1988-05-31 | 1989-12-05 | Fuji Xerox Co Ltd | Coating method of adhesive |
-
1989
- 1989-12-25 JP JP33549089A patent/JPH03195790A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61118174A (en) * | 1984-11-13 | 1986-06-05 | Masao Nomi | Method for coating hot melt |
| JPH01301780A (en) * | 1988-05-30 | 1989-12-05 | Morikawa Sangyo Kk | Adhering method of article and device therefor |
| JPH01301779A (en) * | 1988-05-31 | 1989-12-05 | Fuji Xerox Co Ltd | Coating method of adhesive |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104736256A (en) * | 2012-06-25 | 2015-06-24 | 3M创新有限公司 | Devices for coating contoured surfaces |
| US11235349B2 (en) | 2012-06-25 | 2022-02-01 | 3M Innovative Properties Company | Devices for coating contoured surfaces |
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