JPH03187297A - High frequency apparatus - Google Patents

High frequency apparatus

Info

Publication number
JPH03187297A
JPH03187297A JP32704389A JP32704389A JPH03187297A JP H03187297 A JPH03187297 A JP H03187297A JP 32704389 A JP32704389 A JP 32704389A JP 32704389 A JP32704389 A JP 32704389A JP H03187297 A JPH03187297 A JP H03187297A
Authority
JP
Japan
Prior art keywords
case body
case
lid
opening
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32704389A
Other languages
Japanese (ja)
Other versions
JP2802659B2 (en
Inventor
Nobutaka Inoue
井上 信敬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maspro Denkoh Corp
Original Assignee
Maspro Denkoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maspro Denkoh Corp filed Critical Maspro Denkoh Corp
Priority to JP1327043A priority Critical patent/JP2802659B2/en
Publication of JPH03187297A publication Critical patent/JPH03187297A/en
Application granted granted Critical
Publication of JP2802659B2 publication Critical patent/JP2802659B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE:To excellently shield a circuit board in a case body from outside a case by bringing a connection wall provided at the mounting part of the body at a soft cover into surface-contact with a reception wall. CONSTITUTION:A case body 1 is formed of conductive and hard metal, and has an opening 17. A cover 2 is so formed of the metal as to mount at a mounting part 21 formed at the peripheral edge of the opening 17 of the body 1. The part 21 of the body 1 is composed of a step formed at the peripheral edge of the opening 17, and the peripheral edge 26 of the cover 2 is mechanically brought into pressure contact with both a rising reception wall 23 of the part 21 and a connection wall 22 as a receiver to be electrically connected in a state that the cover 2 is mounted at the part 21 of the body 1. Thus, a circuit board in the body is excellently shielded from outside the case.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はテレビVHFやUHF信号、あるいはSHF信
号を取り扱う高周波機器に関し、更に詳しくは、自体の
ケース内部とケースの外部とを電磁気的にシールドでき
る様にした高周波機器に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a high frequency device that handles television VHF, UHF signals, or SHF signals, and more specifically, electromagnetically shields the inside of its case and the outside of the case. Regarding high frequency equipment that has been made possible.

(従来の技術) 従来からこの種の高周波機器のケースは、夫々導電性の
材料により成るケース本体と蓋体とから構成されている
。そしてケース本体内部には増幅回路や分配回路等の回
路基板が取付けられ、ケース本体の開口部は蓋体により
閉じられる。
(Prior Art) The case of this type of high-frequency equipment has conventionally been composed of a case body and a lid body, each of which is made of an electrically conductive material. Circuit boards such as an amplifier circuit and a distribution circuit are installed inside the case body, and the opening of the case body is closed by a lid.

(発明が解決しようとする課題) 上記従来の高周波機器は、ケース本体の開口部に蓋体を
取付ける場合、蓋体と本体との電気的導通を良くしてケ
ース本体内部の回路とケース外部とを良好にシールドす
る為、ケース本体の開口部を一旦金属製のメツシュや柔
軟性のある薄い銅板等で覆った後、その上から蓋体を被
せている。しかしこの様な従来の高周波機器は、蓋体と
ケース本体とが多接点で接触するから上記のシールドが
良好に得られる反面、メツシュでケース本体の開口部を
覆う作業が大変困難で、蓋体をケース本体に取付ける迄
に時間がかかり過ぎるという組立て能率上の問題がある
(Problems to be Solved by the Invention) In the conventional high-frequency equipment described above, when a lid is attached to the opening of the case body, electrical conduction between the lid and the main body is improved to connect the circuit inside the case body and the outside of the case. In order to provide good shielding, the opening of the case body is first covered with a metal mesh or a flexible thin copper plate, and then a lid is placed over it. However, in such conventional high-frequency equipment, the lid and the case body come into contact with each other at multiple points of contact, so while the above-mentioned shielding can be achieved well, it is very difficult to cover the opening of the case body with a mesh, and the lid body There is a problem with assembly efficiency in that it takes too much time to attach the case to the case body.

本発明は上記従来の問題点を解決すべくなされたもので
、蓋体とケース本体とが蓋体の全周縁で面接触する為ケ
ース内部の回路をケース外部と良好にシールドでき、し
かもケースの組立ても簡単に行える優れた高周波機器を
提供することを目的とする。
The present invention has been made to solve the above-mentioned conventional problems.Since the lid body and the case body are in surface contact with each other around the entire periphery of the lid body, the circuit inside the case can be well shielded from the outside of the case. The purpose is to provide excellent high-frequency equipment that can be easily assembled.

(課題を解決する為の手段) 本願発明は上記目的を達成させる為に前記請求の範囲記
載の通りの手段を講じたものであって、その作用は次の
通りである。
(Means for Solving the Problems) In order to achieve the above object, the present invention takes the measures as described in the claims above, and its effects are as follows.

(作用) ケース本体の開口部周縁の装着部に釦ける係着壁と受止
壁には、蓋体を被せ着ける。蓋体の周縁部が上記のケー
ス本体の係着壁と受止壁の両方に圧接する。即ちケース
本体の装着部と蓋体の周縁部とが面的に接触する。従っ
てケース本体の内部に収納されている回路基板どケース
外部とのシールドは良好である。
(Function) A lid body is attached to the retaining wall and the receiving wall that are attached to the mounting portion on the periphery of the opening of the case body. The peripheral edge of the lid comes into pressure contact with both the locking wall and the receiving wall of the case body. That is, the mounting portion of the case body and the peripheral edge of the lid come into surface contact with each other. Therefore, the circuit board housed inside the case body is well shielded from the outside of the case.

(実施例) 以下本願の実施例を示す図面について説明する。(Example) The drawings showing the embodiments of the present application will be described below.

第1図乃至第5図は高周波機器として例示するテレビ共
同受信用分配器を示すものである。1はケース本体で、
導電性の良−硬質の亜鉛合金等の金属をダイカスト成形
してつくられている。プリネルかたさ(H,B)は91
である。尚ケース本体1の材料としては亜鉛合金の他に
第1表に示す様な堅さのものが種々用しられる。2は蓋
体で、アルミニウム板等の導電性の良い軟質の金属板を
プレス加工により打ち抜いて形成される。本例では厚さ
1.5WrIRで材質名1050−0のアルミニウム板
が用いであるが、その他第2表に示された種々のものが
利用できる。3は回路基板で、プリント基板4に分配ト
ランス等の電子部品5を搭載してつくられている。
FIGS. 1 to 5 show a television communal reception distributor as an example of high-frequency equipment. 1 is the case body,
It is made by die-casting a hard and conductive metal such as zinc alloy. Purinel hardness (H, B) is 91
It is. As for the material of the case body 1, in addition to zinc alloy, various materials having hardness as shown in Table 1 can be used. Reference numeral 2 denotes a lid body, which is formed by punching out a soft metal plate with good conductivity, such as an aluminum plate, by press working. In this example, an aluminum plate with a thickness of 1.5WrIR and a material name of 1050-0 is used, but various other materials shown in Table 2 can be used. 3 is a circuit board, which is made by mounting electronic components 5 such as a distribution transformer on a printed circuit board 4.

第1表 第2表 次−にケース本体1について詳しく説明する。6は止付
片で、ケース本体1の両側壁から夫々突設させである。
The case body 1 will be explained in detail in Table 1, Table 2, and Table 2 below. Reference numeral 6 denotes fastening pieces that protrude from both side walls of the case body 1, respectively.

これら止付片6は夫々ケース本体1の成形時に同時に形
成されるもので、中央部にはねじ孔7が備えられている
。尚夫々のねじ孔7には木ネジ8が螺合させてあって、
分配器を板壁面等に固定する為に利用される。9はアー
ス片で、これらもケース本体1の両側壁から夫々突設さ
せてあり、ケース本体1の成形時に同時に形成されてい
る。尚これらアース片9には、第3図に明示される様に
ねじ孔10が設けられており、このねじ孔10に螺合さ
れた締付ねじ11でもって、透孔12から導入されたI
V線等の接地用導線13を締付は固定できる様になって
いる。次に14は入力端子、15は出力端子で、夫々同
軸接栓座が用いられている。
These fixing pieces 6 are formed at the same time when the case body 1 is molded, and each has a screw hole 7 in its center. Furthermore, a wood screw 8 is screwed into each screw hole 7,
Used to fix the distributor to a plate wall surface, etc. Reference numeral 9 denotes ground pieces, which are also protruded from both side walls of the case body 1, and are formed at the same time as the case body 1 is molded. These grounding pieces 9 are provided with screw holes 10 as clearly shown in FIG.
The ground conductor 13 such as a V wire can be tightened and fixed. Next, 14 is an input terminal, and 15 is an output terminal, each of which uses a coaxial connector seat.

各端子1.4.15の外部導体16は、ケース本体1の
成形時に一体的に形成される。17はケース本体1の開
口部、18はケース本体1の底壁、19はこの底壁18
から突設された回路基板止付座を夫々示す。尚各回路基
板止付座19の先端部には、ケース本体1と回路基板3
のアース導体とを半田付けにより接続ふ・よび固定でき
る様に、突片20が設けられている。次に21は蓋体2
の装着部で、開口部17の内周縁に設けられた段部35
で形成されている。装着部2】に釦いて、22は係着壁
、23は受止壁を夫々示す。
The outer conductor 16 of each terminal 1.4.15 is integrally formed when the case body 1 is molded. 17 is the opening of the case body 1, 18 is the bottom wall of the case body 1, and 19 is the bottom wall 18.
The circuit board fixing seats protruding from the bottom are shown. The case body 1 and the circuit board 3 are attached to the tip of each circuit board retaining seat 19.
A protruding piece 20 is provided so that it can be connected and fixed to a ground conductor by soldering. Next, 21 is the lid body 2
A stepped portion 35 provided on the inner peripheral edge of the opening 17 in the mounting portion of the
It is formed of. Attaching part 2], 22 indicates a retaining wall, and 23 indicates a receiving wall.

次に蓋体2について説明すると、24は蓋体2の表面、
25は裏面を夫々示す。26は蓋体2の四周の周縁部で
ある。
Next, to explain the lid body 2, 24 is the surface of the lid body 2,
25 indicates the back side. Reference numeral 26 indicates the four circumferential edges of the lid body 2.

次に上記構成の分配器の組立てについて説明するO (イ)軟質の金属板をプレス加工によう四角形に打抜き
形成した蓋体2を用意する。この蓋体2は周囲にパリが
突き出る面が表面24にされる。
Next, the assembly of the distributor having the above configuration will be explained. (a) A lid body 2 is prepared by stamping a soft metal plate into a rectangular shape by press working. This lid body 2 has a surface 24 from which the edges protrude around the periphery.

(ロ)ダイカスト成形によりケース本体1を形成する。(b) Form the case body 1 by die-casting.

この際底壁18、回路基板止付座19、係着壁22、受
止壁23も同時に形成される。
At this time, the bottom wall 18, the circuit board fixing seat 19, the retaining wall 22, and the receiving wall 23 are also formed at the same time.

(ハ)ケース本体の各端子14.15の外部導体16を
なす筒体にタップを切り、雄ねじを形成する。また止付
片6やアース片9に穿設された透孔にタップを切り、ね
じ孔7やねじ孔10を形成する0(二゛)ケース本体1
の各外部導体16の内側に、端子の中心導体27を保持
する絶縁体銘を、ケース本体1の内側から夫々嵌入する
(c) Taps are cut in the cylindrical body forming the outer conductor 16 of each terminal 14, 15 of the case body to form a male thread. In addition, taps are cut in the through holes drilled in the fixing piece 6 and the grounding piece 9 to form the screw hole 7 and the screw hole 10 in the case body 1.
Insulator markings that hold the center conductor 27 of the terminal are inserted into the inside of each outer conductor 16 from the inside of the case body 1.

(ホ)プリント基板4に分配トランス等の電子部品5を
組付け、回路基板3を完成する。尚この(ホ)の工程は
、(ニ)の工程の後とは限らず、前もって行っておいて
もよい。
(e) Electronic components 5 such as a distribution transformer are assembled on the printed circuit board 4 to complete the circuit board 3. Note that this step (e) is not necessarily performed after the step (d), but may be performed in advance.

(へ)回路基板3を、開口部17の側からケース本体1
に組付け、回路基板止付座19の突片20を利用して半
田付は固定する。また入力端子14や出力端子15の各
中心導体27と回路基板3とを半田付は等により接続す
る。
(to) Insert the circuit board 3 into the case body 1 from the opening 17 side.
and fix the soldering using the protruding piece 20 of the circuit board fixing seat 19. Further, each center conductor 27 of the input terminal 14 and output terminal 15 and the circuit board 3 are connected by soldering or the like.

(ト)蓋体2をケース本体1の開口部17の周縁に設け
られた装着部21に装着する。この場合、先ず第5図(
A)に示す様に、図示外の下型の上にのせられたケース
本体1の開口部17に蓋体2をのせる。図から明らかな
様に、係着壁22の開放端側に設けられたテーパ一部2
9に蓋体2がのった状態になる。次に上型30で上方か
ら蓋体2を下方のケース本体1の側へ押し進める。する
と第5図(B)に示す様に、蓋体2の周縁部26の裏面
25が受止壁23の突出部31に接触する状態になる。
(g) The lid 2 is attached to the attachment part 21 provided at the periphery of the opening 17 of the case body 1. In this case, first of all, see Figure 5 (
As shown in A), the lid 2 is placed on the opening 17 of the case body 1 placed on a lower mold (not shown). As is clear from the figure, the tapered portion 2 provided on the open end side of the retaining wall 22
The lid body 2 is now placed on 9. Next, the lid body 2 is pushed downward toward the case body 1 from above using the upper mold 30. Then, as shown in FIG. 5(B), the back surface 25 of the peripheral edge 26 of the lid 2 comes into contact with the protrusion 31 of the receiving wall 23.

そして第5図(B)の状態から更に上型30を下方へ押
し進めると、立壁36が開口部I7の開口面に垂直に設
けられていることにより、蓋体2の裏面25に突出部3
1がくい込むと共に軟質の蓋体2の周縁部26が受止壁
23の斜面に沿って第5図(C)のX方向に進み、蓋体
2の端部32が係着壁22に圧接する。この蓋体2の係
着壁22と受止壁23への圧接は、蓋体2が軟(チ)最
後に木ネジ8や締付ねじ11を取付は分配器は完成する
When the upper mold 30 is further pushed downward from the state shown in FIG.
1 bites in, the peripheral edge 26 of the soft lid 2 advances along the slope of the receiving wall 23 in the X direction in FIG. do. The lid body 2 is pressed against the locking wall 22 and the receiving wall 23 so that the lid body 2 is soft.Finally, the wood screws 8 and the tightening screws 11 are attached to complete the distributor.

尚第5図(A)に表される各寸法を示すと、受止壁23
の幅W1は1.05鱈、突出部31の高さHlはQ、8
m、係着壁22の高さH2は2.1顧、上型30の幅W
2は2.Offである。
In addition, when each dimension shown in FIG. 5(A) is shown, the receiving wall 23
The width W1 is 1.05 mm, and the height Hl of the protrusion 31 is Q, 8
m, the height H2 of the retaining wall 22 is 2.1cm, the width W of the upper die 30 is
2 is 2. Off.

上記の様にして組立てられた分配器は蓋体2の周縁部2
6がケース本体1の係着壁22にも受止壁おにも完全に
面接触することになる。このことはケース本体1の内部
に収納された回路と外部とを広帯域の周波数にわたb良
好にシールドできるコトを意味する。ちなみに本分配器
の場合、シールドの効果を表す信号漏洩特性でいう損失
が、90〜770 MHzの周波数帯域にわたって13
0 dB以上という良い結果が得られた。
The distributor assembled in the above manner has the peripheral edge 2 of the lid 2.
6 comes into complete surface contact with both the retaining wall 22 of the case body 1 and the receiving wall. This means that the circuit housed inside the case body 1 and the outside can be well shielded over a wide frequency band. By the way, in the case of this distributor, the loss in terms of signal leakage characteristics, which represents the shielding effect, is 13% over the frequency band of 90 to 770 MHz.
A good result of 0 dB or more was obtained.

次に第6図は蓋体2をケース本体1に取付ける際に使用
される上型の異なる例を示すものである。
Next, FIG. 6 shows different examples of upper molds used when attaching the lid body 2 to the case body 1.

尚前回と同一あるいは均等機能のものには同一の符号に
アルファベットのeを付して示し重複する説明は省略す
る(筐た以下も同様の考えで、異なる例にはアルファベ
ットのfを付して示す)。本例の場合の上型30 eを
用いると、蓋体2とケース本体1との電気的および機械
的接続をより密接にすることができる。
Items with the same or equivalent functions as the previous time will be indicated with the same reference numeral and the letter e, and redundant explanations will be omitted. show). By using the upper die 30e in this example, the electrical and mechanical connection between the lid body 2 and the case body 1 can be made closer.

次に第7図は高周波機器として例示するBSコンバータ
を示すものである。この例では装着部がケース本体1f
の両面に設けられ、夫々に同じ形状の蓋体2fが装着さ
れる。33は一次放射器が接続されるフランジ、34は
信号入力用の導波管を示す。
Next, FIG. 7 shows a BS converter exemplified as a high frequency device. In this example, the mounting part is on the case body 1f.
are provided on both sides, and a lid body 2f of the same shape is attached to each side. 33 is a flange to which a primary radiator is connected, and 34 is a waveguide for signal input.

(発明の効果) 以上のように本願にあっては、軟質の蓋体に対しケース
本体の装着部に設けられた係着壁と受止壁が面接触して
いるから、テレビVHFやUHF信号、更にSHF信号
等の高周波を取り扱う高周波機器であっても、ケース本
体内の高周波回路とケース外部とを良好にシールドでき
るという特長がある。
(Effects of the Invention) As described above, in the present application, since the retaining wall and the receiving wall provided at the attachment part of the case body are in surface contact with the soft lid body, television VHF and UHF signals can be transmitted. Furthermore, even in high-frequency equipment that handles high-frequency waves such as SHF signals, the high-frequency circuit inside the case body can be effectively shielded from the outside of the case.

しかもその様にシールド特性が良好なものであっても、
そのシールドの為にケース本体と蓋体以外の別の部材を
用意する必要が無いので安価に提供できるという効果も
ある。
Moreover, even if the shielding characteristics are good,
Since there is no need to prepare any other members other than the case body and the lid for the shield, there is also the effect that it can be provided at low cost.

更に機器の組立てにあっては、ケース本体の開口部周縁
の装着部に蓋体を嵌着させるだけの簡単なものであるか
ら、量産性に富み、これも安価な高周波機器が提供でき
ることを意味している。
Furthermore, assembling the device is as simple as fitting the lid into the mounting area around the opening of the case body, making it highly suitable for mass production, which also means that inexpensive high-frequency devices can be provided. are doing.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本願の実施例に関するもので、第1図は高周波機
器として例示する分配器の正面図、第2図は第4図にお
いて蓋体を組付けた状態の■−■線部分断面図、第3図
は第1図の■−曲線部分断面図、第4図は分配器の分解
斜視図、第5図(A)。 (B)、  (C)は蓋体をケース本体に取付ける工程
を示す断面図、第6図は上型の異なる例を示す図、第7
図は高周波機器として例示するBSコンバータの分解斜
視図。 1・・・ケース本体、2・・・蓋体、3・・・回路基板
、17・・・開口部、21・・・装着部、22・・・係
着壁、23・・・受止壁、24・・・表面、25・・・
裏面、26・・・周縁部。
The drawings relate to embodiments of the present application, and FIG. 1 is a front view of a distributor exemplified as a high-frequency device, FIG. 2 is a partial sectional view taken along the line ■-■ of FIG. 3 is a partial cross-sectional view of the line 1 in FIG. 1, FIG. 4 is an exploded perspective view of the distributor, and FIG. 5(A). (B) and (C) are cross-sectional views showing the process of attaching the lid to the case body, Fig. 6 is a view showing different examples of the upper mold, and Fig. 7
The figure is an exploded perspective view of a BS converter exemplified as a high-frequency device. DESCRIPTION OF SYMBOLS 1... Case body, 2... Lid body, 3... Circuit board, 17... Opening part, 21... Mounting part, 22... Latching wall, 23... Reception wall , 24... surface, 25...
Back side, 26...periphery.

Claims (1)

【特許請求の範囲】[Claims]  導電性の良い硬質の金属で形成されていて開口部を有
するケース本体と、このケース本体の上記開口部周縁に
設けられた装着部に装着されるべく導電性の良い軟質の
金属で形成された蓋体とを備え、しかも上記ケース本体
の装着部は、上記開口部内周縁に周設した段部で構成さ
れ、上記蓋体が上記ケース本体の装着部に装着された状
態では、上記装着部の立上り状の受止壁と受止め部とな
る係着壁の両方に上記蓋体の周縁部が機械的に圧接され
て電気的にも両者が接続されていることを特徴とする高
周波機器。
A case body made of a hard metal with good conductivity and having an opening, and a soft metal with good conductivity to be attached to a mounting part provided around the opening of the case body. The mounting portion of the case body is comprised of a stepped portion provided around the inner periphery of the opening, and when the lid body is mounted on the mounting portion of the case body, the mounting portion of the case body is A high frequency device characterized in that a peripheral edge of the lid body is mechanically pressed against both a rising receiving wall and a retaining wall serving as a receiving portion, and the two are also electrically connected.
JP1327043A 1989-12-15 1989-12-15 High frequency equipment Expired - Lifetime JP2802659B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1327043A JP2802659B2 (en) 1989-12-15 1989-12-15 High frequency equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1327043A JP2802659B2 (en) 1989-12-15 1989-12-15 High frequency equipment

Publications (2)

Publication Number Publication Date
JPH03187297A true JPH03187297A (en) 1991-08-15
JP2802659B2 JP2802659B2 (en) 1998-09-24

Family

ID=18194673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1327043A Expired - Lifetime JP2802659B2 (en) 1989-12-15 1989-12-15 High frequency equipment

Country Status (1)

Country Link
JP (1) JP2802659B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8244203B2 (en) 1996-12-06 2012-08-14 Atx Networks Corp. RF circuit module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153594U (en) * 1984-03-21 1985-10-12 宇呂電子工業株式会社 Television signal splitter shield case

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153594U (en) * 1984-03-21 1985-10-12 宇呂電子工業株式会社 Television signal splitter shield case

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8244203B2 (en) 1996-12-06 2012-08-14 Atx Networks Corp. RF circuit module

Also Published As

Publication number Publication date
JP2802659B2 (en) 1998-09-24

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