JPH03185079A - Cationic electrodepositing paint - Google Patents
Cationic electrodepositing paintInfo
- Publication number
- JPH03185079A JPH03185079A JP32264389A JP32264389A JPH03185079A JP H03185079 A JPH03185079 A JP H03185079A JP 32264389 A JP32264389 A JP 32264389A JP 32264389 A JP32264389 A JP 32264389A JP H03185079 A JPH03185079 A JP H03185079A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- acid
- parts
- resin
- cationic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000002091 cationic group Chemical group 0.000 title claims abstract description 51
- 239000003973 paint Substances 0.000 title claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 75
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims abstract description 26
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000007787 solid Substances 0.000 claims abstract description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 238000004070 electrodeposition Methods 0.000 claims description 45
- 239000004593 Epoxy Substances 0.000 claims description 15
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000000049 pigment Substances 0.000 abstract description 7
- 238000004132 cross linking Methods 0.000 abstract description 6
- 239000002270 dispersing agent Substances 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 38
- 239000011248 coating agent Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 24
- -1 inorganic acid lead compounds Chemical class 0.000 description 24
- 239000002585 base Substances 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 239000002253 acid Substances 0.000 description 16
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 16
- 239000000243 solution Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 125000003700 epoxy group Chemical group 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 150000002611 lead compounds Chemical class 0.000 description 9
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 235000019253 formic acid Nutrition 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 150000003141 primary amines Chemical class 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 235000011054 acetic acid Nutrition 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 238000006735 epoxidation reaction Methods 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 150000004965 peroxy acids Chemical class 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ZGHFDIIVVIFNPS-UHFFFAOYSA-N 3-Methyl-3-buten-2-one Chemical compound CC(=C)C(C)=O ZGHFDIIVVIFNPS-UHFFFAOYSA-N 0.000 description 2
- DPTGFYXXFXSRIR-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl prop-2-enoate Chemical compound C1C(COC(=O)C=C)CCC2OC21 DPTGFYXXFXSRIR-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- HUTDDBSSHVOYJR-UHFFFAOYSA-H bis[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphaplumbetan-2-yl)oxy]lead Chemical compound [Pb+2].[Pb+2].[Pb+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O HUTDDBSSHVOYJR-UHFFFAOYSA-H 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- LJSQFQKUNVCTIA-UHFFFAOYSA-N diethyl sulfide Chemical compound CCSCC LJSQFQKUNVCTIA-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000002432 hydroperoxides Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- 229940046892 lead acetate Drugs 0.000 description 2
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 2
- 229910000464 lead oxide Inorganic materials 0.000 description 2
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 150000004668 long chain fatty acids Chemical class 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- 150000003568 thioethers Chemical group 0.000 description 2
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- DEQUKPCANKRTPZ-UHFFFAOYSA-N (2,3-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1O DEQUKPCANKRTPZ-UHFFFAOYSA-N 0.000 description 1
- DTCCVIYSGXONHU-CJHDCQNGSA-N (z)-2-(2-phenylethenyl)but-2-enedioic acid Chemical compound OC(=O)\C=C(C(O)=O)\C=CC1=CC=CC=C1 DTCCVIYSGXONHU-CJHDCQNGSA-N 0.000 description 1
- XJYDIOOQMIRSSY-UHFFFAOYSA-N 1,3,2-dioxathiepane 2-oxide Chemical compound O=S1OCCCCO1 XJYDIOOQMIRSSY-UHFFFAOYSA-N 0.000 description 1
- ZPANWZBSGMDWON-UHFFFAOYSA-N 1-[(2-hydroxynaphthalen-1-yl)methyl]naphthalen-2-ol Chemical compound C1=CC=C2C(CC3=C4C=CC=CC4=CC=C3O)=C(O)C=CC2=C1 ZPANWZBSGMDWON-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- UZIBPOIXTCIHBH-UHFFFAOYSA-N 1-chlorohex-1-ene Chemical compound CCCCC=CCl UZIBPOIXTCIHBH-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- XYPISWUKQGWYGX-UHFFFAOYSA-N 2,2,2-trifluoroethaneperoxoic acid Chemical compound OOC(=O)C(F)(F)F XYPISWUKQGWYGX-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- AFSSYGZIYMAAOC-UHFFFAOYSA-N 2-butylperoxy-2-ethylhexanoic acid Chemical compound CCCCOOC(CC)(C(O)=O)CCCC AFSSYGZIYMAAOC-UHFFFAOYSA-N 0.000 description 1
- GBHCABUWWQUMAJ-UHFFFAOYSA-N 2-hydrazinoethanol Chemical compound NNCCO GBHCABUWWQUMAJ-UHFFFAOYSA-N 0.000 description 1
- YXYJVFYWCLAXHO-UHFFFAOYSA-N 2-methoxyethyl 2-methylprop-2-enoate Chemical compound COCCOC(=O)C(C)=C YXYJVFYWCLAXHO-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- YNJSNEKCXVFDKW-UHFFFAOYSA-N 3-(5-amino-1h-indol-3-yl)-2-azaniumylpropanoate Chemical compound C1=C(N)C=C2C(CC(N)C(O)=O)=CNC2=C1 YNJSNEKCXVFDKW-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- FNFYXIMJKWENNK-UHFFFAOYSA-N 4-[(2,4-dihydroxyphenyl)methyl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1CC1=CC=C(O)C=C1O FNFYXIMJKWENNK-UHFFFAOYSA-N 0.000 description 1
- VXASQTMYWZHWMX-UHFFFAOYSA-N 4-ethoxybutyl 2-methylprop-2-enoate Chemical compound CCOCCCCOC(=O)C(C)=C VXASQTMYWZHWMX-UHFFFAOYSA-N 0.000 description 1
- OYFJWLSZXKXLAT-UHFFFAOYSA-N 4-ethoxybutyl prop-2-enoate Chemical compound CCOCCCCOC(=O)C=C OYFJWLSZXKXLAT-UHFFFAOYSA-N 0.000 description 1
- GAKWESOCALHOKH-UHFFFAOYSA-N 4-methoxybutyl prop-2-enoate Chemical compound COCCCCOC(=O)C=C GAKWESOCALHOKH-UHFFFAOYSA-N 0.000 description 1
- ZWAPMFBHEQZLGK-UHFFFAOYSA-N 5-(dimethylamino)-2-methylidenepentanamide Chemical compound CN(C)CCCC(=C)C(N)=O ZWAPMFBHEQZLGK-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
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- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
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- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
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- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000010775 animal oil Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- HASCQPSFPAKVEK-UHFFFAOYSA-N dimethyl(phenyl)phosphine Chemical compound CP(C)C1=CC=CC=C1 HASCQPSFPAKVEK-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- YCUBDDIKWLELPD-UHFFFAOYSA-N ethenyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC=C YCUBDDIKWLELPD-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- SCZVXVGZMZRGRU-UHFFFAOYSA-N n'-ethylethane-1,2-diamine Chemical compound CCNCCN SCZVXVGZMZRGRU-UHFFFAOYSA-N 0.000 description 1
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical compound CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- WXNYILVTTOXAFR-UHFFFAOYSA-N prop-2-en-1-ol;styrene Chemical compound OCC=C.C=CC1=CC=CC=C1 WXNYILVTTOXAFR-UHFFFAOYSA-N 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229940076279 serotonin Drugs 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- JLGUDDVSJCOLTN-UHFFFAOYSA-N strontium;oxido-(oxido(dioxo)chromio)oxy-dioxochromium Chemical compound [Sr+2].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O JLGUDDVSJCOLTN-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はカチオン電着塗料組成物に関する。[Detailed description of the invention] Industrial applications The present invention relates to cationic electrodeposition coating compositions.
従来の技術とその課題
従来、カチオン電着塗料塗膜の硬化反応形式の主なもの
としては、例えば、イソシアネート基と活性水素基とに
よるウレタン硬化反応好よび末端活性二重結合による自
己架橋硬化などが知られている。そして、これらの硬化
反応を促進させるために鉛化合物が触媒として有効であ
ることも広く認識されている。Conventional technologies and their problems Conventionally, the main types of curing reactions for cationic electrodeposition paint films include, for example, urethane curing reaction by isocyanate groups and active hydrogen groups, self-crosslinking curing by terminal activated double bonds, etc. It has been known. It is also widely recognized that lead compounds are effective as catalysts to promote these curing reactions.
これまでにカチオン電着塗料に配合されている鉛化合物
の具体例とその配合方法としては、■塩基性けい酸鉛、
塩基性硫酸鉛、リン酸鉛、クロム酸鉛などの水不溶性無
機酸鉛化合物を顔料分散樹脂であらかじめ分散してから
電着塗料に配合する:■酢酸鉛のような水溶性鉛を水に
溶解してから電着塗料に添加する;■セカノイツク鉛、
オフチック鉛やナフチツク鉛などの油溶性の長鎖脂肪酸
の鉛塩を分散用樹脂と共に水分散して電着塗料に使用す
る;などがあげられる。Specific examples of lead compounds that have been blended into cationic electrodeposition paints and their blending methods include: ■Basic lead silicate;
Water-insoluble inorganic acid lead compounds such as basic lead sulfate, lead phosphate, and lead chromate are dispersed in advance with a pigment dispersion resin and then incorporated into the electrodeposition paint: ■ Dissolving water-soluble lead such as lead acetate in water. and then add it to the electrodeposition paint;
Examples include dispersing lead salts of oil-soluble long-chain fatty acids such as offtic lead and naphtic lead in water together with a dispersing resin for use in electrodeposition paints.
しかしながら、これらの方法では種々の欠陥があり、そ
の解決が強く望まれている。すなわち、上記■の方法で
は、鉛化合物を微粒子状に分散することが難しく、シか
も比重が大きいため電着塗料中で沈降し易く、被塗物の
水平面へのふりかかりによるブツの発生原因となるなど
に基いて鉛化合物の使用量を少くせざるを得ない。しか
も粒状固形物であるがために電着塗料中の樹脂との焼付
時の接触頻度(表面積)が小さく、多くのものは触媒作
用が弱い。上記■の方法では、水溶性鉛は酸との塩の形
態をとるため、多くの低分子電解質がそうであるように
、電着塗膜形成時に水の電気分解を促進して塗膜破壊電
圧を低下させると共にウェット膜に多量のガス穴を残し
易い。これは焼付後の平滑性不良やガス穴発生等の重大
な欠陥を与えるため該鉛化合物の使用量が制限される。However, these methods have various deficiencies, and solutions to these problems are strongly desired. In other words, with the method (2) above, it is difficult to disperse the lead compound into fine particles, and because the lead compound has a high specific gravity, it tends to settle in the electrocoating paint, and the lead compound is likely to be sprinkled on the horizontal surface of the object to be coated, causing lumps. Therefore, we have no choice but to reduce the amount of lead compounds used. Moreover, since it is a granular solid substance, the frequency of contact (surface area) with the resin in the electrodeposition paint during baking is small, and most of them have a weak catalytic effect. In method (■) above, water-soluble lead takes the form of a salt with an acid, so like many low-molecular electrolytes, it promotes the electrolysis of water during the formation of an electrodeposited film, increasing the breakdown voltage of the film. This reduces the gas flow rate and tends to leave a large number of gas holes in the wet film. This causes serious defects such as poor smoothness after baking and gas holes, so the amount of the lead compound used is limited.
そして、上記■の方法では、該鉛化合物における長鎖脂
肪酸含有率が高いために該化合物を多量使用すると、耐
食性等に悪影響を与えると共に水分散性を著しく低下さ
せるため、やはり使用量が制限される。In addition, in the method (2) above, since the lead compound has a high long-chain fatty acid content, if a large amount of this compound is used, it will have a negative effect on corrosion resistance and significantly reduce water dispersibility, so the amount used is still limited. Ru.
さらに上記■〜■の方法以外に、■β−ヒドロキシアミ
ノ構造を有する化合物と酸化鉛(II)とのキレート化
反応生成物を使用する方法が最近開示された(特開昭6
3−152676号公報)。Furthermore, in addition to the above-mentioned methods 1 to 2, a method using a chelation reaction product of a compound having a β-hydroxyamino structure and lead (II) oxide has recently been disclosed (JP-A-6
3-152676).
しかし、この方法も、鉛含有量を高めるためには、酸化
鉛と反応させるアルカノールアミン濃度を高くする必要
があり、その結果、低分子量のβ−ヒドロキシアミノ構
造を有する化合物を使用せざるを得なくなって、前記■
の方法の水溶性鉛を用いる場合と本質的に同じ欠陥であ
る低分子量電解質による塗膜破壊電圧の低下、及び前記
■の方法における油溶解性鉛と同様に耐食性の低下等を
招く。However, in this method, in order to increase the lead content, it is necessary to increase the concentration of alkanolamine reacted with lead oxide, and as a result, it is necessary to use a compound with a low molecular weight β-hydroxyamino structure. Gone, the above ■
The low molecular weight electrolyte, which is essentially the same defect as when water-soluble lead is used in method (2), causes a decrease in coating breakdown voltage, and similarly to the oil-soluble lead in method (2), a decrease in corrosion resistance is caused.
課題を解決するための手段
本発明者らは、上記従来の■〜■の方法における欠陥を
すべて解消し、塗膜の架橋硬化をすみやかにしかも容易
に行なうことが可能なカチオン電着塗料を開発すべく研
究を行なった結果、今回、鉛化合物としてマレイン酸鉛
を使用することにより、上記の目的を達成しうろことを
見い出し、本発明を完成した。Means for Solving the Problems The present inventors have developed a cationic electrodeposition paint that eliminates all of the deficiencies in the conventional methods ① to ① above and can quickly and easily cross-link and cure the coating film. As a result of conducting research to achieve this goal, we have now discovered that the above objectives can be achieved by using lead maleate as a lead compound, and have completed the present invention.
かくして、本発明によれば、マレイン酸鉛含有すること
を特徴とするカチオン電着塗料が提供される。Thus, according to the present invention, a cationic electrodeposition paint characterized by containing lead maleate is provided.
本発明の特徴は、カチオン電着塗料にマレイン酸鉛を含
有せしめたところにある。その結果、本発明の電着塗料
を用いれば、マレイン酸鉛によるすぐれた触媒効果、つ
まり、カチオン電着塗膜をすみやかに架橋硬化させるこ
とが可能となった。A feature of the present invention is that lead maleate is contained in the cationic electrodeposition paint. As a result, when the electrodeposition paint of the present invention is used, it has become possible to use the excellent catalytic effect of lead maleate, that is, to quickly crosslink and cure the cationic electrodeposition coating film.
マレイン酸鉛は、該電着塗料中で微粒子状に容易に分散
することができる。さらに、マレイン酸鉛を含有させる
ことによって、電着塗装時の塗膜破壊電圧を低下させた
り、塗膜の平滑性を損なったすすることもなく、また、
貯蔵安定性が劣化することがない等積々の利点を達成す
ることができたものである。Lead maleate can be easily dispersed in the form of fine particles in the electrodeposition paint. Furthermore, by containing lead maleate, it does not reduce the breakdown voltage of the coating film during electrodeposition coating, does not impair the smoothness of the coating film, and does not cause smearing.
It has been possible to achieve numerous advantages such as no deterioration in storage stability.
上記の高触媒能及び易分散性は、マレイン酸鉛が有機酸
鉛で、かつキレート化物であるためと思われ、また非水
溶性であるために塗膜の平滑性や安定性にすぐれている
ものと推定される。The above-mentioned high catalytic ability and easy dispersibility are thought to be due to the fact that lead maleate is an organic lead acid and is a chelate, and because it is water-insoluble, the coating film has excellent smoothness and stability. It is estimated that
本発明で用いるマレイン酸鉛はいくつかの形態をとりう
るが、特に下記式
で示されるものが好ましく、試薬や工業薬品として市販
のものが使用できる。これらは室温において粒状もしく
は粉末状の固体であることが好ましい。Lead maleate used in the present invention can take several forms, but those represented by the following formula are particularly preferred, and those commercially available as reagents and industrial chemicals can be used. These are preferably granular or powdery solids at room temperature.
本発明において、上記マレイン酸鉛を含有せしめるため
のカチオン電着塗料は特に制限されるものではなく、当
業界において知られているものが用いられる。具体的に
は、塗膜の架橋硬化反応形式に基いて例示すれば、アミ
ノ基や水酸基を有する基体樹脂とブロックポリイソシア
ネート化合物(硬化剤)とのウレタン交換反応を利用し
たもの;基体樹脂の末端若しくは側鎖に有せしめた重合
性二重結合による自己架橋反応を利用したもの;などが
あげられる。さらにこれら以外にエチレンカーボネート
硬化方式やエステルアミド交換方式のカチオン電着塗料
に対しても適用できる。In the present invention, the cationic electrodeposition coating material for containing lead maleate is not particularly limited, and those known in the art can be used. Specifically, based on the type of crosslinking and curing reaction of the coating film, examples are those that utilize a urethane exchange reaction between a base resin having an amino group or a hydroxyl group and a blocked polyisocyanate compound (curing agent); Alternatively, one that utilizes a self-crosslinking reaction due to a polymerizable double bond in a side chain; etc. Furthermore, in addition to these, it can also be applied to cationic electrodeposition paints using an ethylene carbonate curing method or an ester amide exchange method.
本発明者等がカチオン電着塗料の電着塗膜の架橋硬化反
応におけるマレイン酸鉛の触媒硬化作用について詳細に
研究を行なった結果、マレイン酸鉛を上記に例示した如
きカチオン電着塗料に配合することによって前記した種
々の欠陥が解消されるばかりでなく、本発明者等が先に
提案した第1級水酸基ならびにカチオン性基を有する基
体樹脂とエポキシ基含有硬化用樹脂とを主成分とするカ
チオン電着塗料(以下、「エポキシ硬化CHD塗料」と
略称することがある)(特願昭63−213660号及
び特願昭63−323591号参照)に適用すると、さ
らに−層すぐれた技術的効果を得られることが判明した
。As a result of detailed research by the present inventors on the catalytic curing effect of lead maleate in the cross-linking curing reaction of the electrodeposited film of cationic electrodeposition paints, lead maleate was incorporated into the cationic electrodeposition paints as exemplified above. By doing so, the various defects described above are not only eliminated, but also the present inventors have previously proposed a base resin having a primary hydroxyl group and a cationic group, and a curing resin containing an epoxy group as the main components. When applied to cationic electrodeposition paints (hereinafter sometimes abbreviated as "epoxy cured CHD paints") (see Japanese Patent Application No. 63-213660 and Japanese Patent Application No. 63-323591), further superior technical effects can be obtained. It turns out that you can get .
このエポキシ硬化CHD塗料において使用される第1級
水酸基及びカチオン性基を有する基体樹脂には、エポキ
シ基と反応しうる第1級水酸基を含有し且つ安定な水性
分散物を形成するのに十分な数のカチオン性基を有する
任意の樹脂が包含される。しかして、該基体樹脂として
は例えば次のものが挙げられる。The base resin having primary hydroxyl groups and cationic groups used in this epoxy-cured CHD coating contains primary hydroxyl groups capable of reacting with epoxy groups and sufficient amount to form a stable aqueous dispersion. Any resin having a number of cationic groups is included. Examples of the base resin include the following.
(i) ポリエポキシド化合物とカチオン化剤とを反
応せしめて得られる反応生成物;
(i)ポリカルボン酸とポリアミンとの重縮合物(米国
特許第2.450.940号明細書参照)を酸でプロト
ン化したもの:
(ij) ポリイソシアネート及びポリオールとモノ
又はポリアミンとの重付加物を酸でプロトン化したもの
:
(iv) 水酸基ならびにアミノ基含有アクリル系又
はビニル系モノマーの共重合物を酸でプロトン化したも
の(特公昭45−12395号公報、特公昭45−12
396号公報);
(V) ポリカルボン酸樹脂とアルキレンイミンとの
付加物を酸でプロトン化したもの(米国特許第3,40
3,088号明細書参照);等。(i) A reaction product obtained by reacting a polyepoxide compound and a cationizing agent; (i) A polycondensate of a polycarboxylic acid and a polyamine (see U.S. Pat. No. 2,450,940) with an acid. Protonated products: (ij) Polyadducts of polyisocyanates and polyols with mono- or polyamines, which are protonated with acids: (iv) Copolymers of acrylic or vinyl monomers containing hydroxyl groups and amino groups, which are protonated with acids. Protonated (Japanese Patent Publication No. 12395/1988, Japanese Patent Publication No. 12395/1983)
(V) Adduct of polycarboxylic acid resin and alkylene imine protonated with acid (US Patent No. 3,40)
3,088); etc.
これらの基体樹脂の具体例及び製造方法については、例
えば特公昭45−12395号公報、特公昭45−12
396号公報、特公昭49−23087号公報、米国特
許第2.450.940号明細書、米国特許第3,40
3.088号明細書、米国特許第3.891,529号
明細書、米国特許第3.963.663号明細書等に記
載されているので、ここではこれらの引用を以って詳細
な記述に代える。For specific examples and manufacturing methods of these base resins, see, for example, Japanese Patent Publications No. 45-12395 and Japanese Patent Publication No. 45-12.
No. 396, Japanese Patent Publication No. 49-23087, U.S. Patent No. 2.450.940, U.S. Patent No. 3,40
3.088 specification, U.S. Patent No. 3.891,529, U.S. Patent No. 3.963.663, etc., so the detailed description will be referred to here. replace it with
基体樹脂として特に望ましいのは前記したものの中でも
殊に、防食性に優れている点からポリフェノール化合物
とエピクロルヒドリンとから得られる上記(1)のポリ
エポキシド化合物のエポキシ基にカチオン化剤を反応せ
しめて得られる反応生成物である。Particularly desirable as the base resin are those obtained by reacting a cationizing agent with the epoxy groups of the polyepoxide compound of (1) above, which is obtained from a polyphenol compound and epichlorohydrin, because of its excellent anticorrosion properties. It is a reaction product.
前記ポリエポキシド化合物は、エポキシ基化合物で、一
般に少くとも200.好ましくは400〜4,000、
さらに好ましくは800〜2゜000の範囲内の数平均
分子量を有するものが適している。そのようなポリエポ
キシド化合物としてはそれ自体既知のものを使用するこ
とができ、例えば、ポリフェノール化合物をアルカリの
存在下にエピクロルヒドリンと反応させることにより製
造することができるポリフェノールのポリグリシジルエ
ーテルが包含される。ここで使用しうるポリフェノール
化合物としては、例えばビス(4−ヒドロキシフェニル
)−2,2−プロパン、4.4’ジヒドロキシベンゾフ
ェノン、ビス(4−ヒドロキシフェニル)−1,1−エ
タン、ビス−(4−ヒドロキシフェニル)−1,1−イ
ソブタン、ビス(4−ヒドロキシ−tert−ブチル−
フェニル)−2,2−プロパン、ビス(2−ヒドロキシ
ナフチル)メタン、l、5−ジヒドロキシナフタレン、
ビス(2,4−ジヒドロキシフェニル)メタン、テトラ
(4−ヒドロキシフェニル)−1,1,2゜2−エタン
、4.4’−ジヒドロキシジフェニルエーテル、4.4
′−ジヒドロキシジフェニルスルホン、フェノールノボ
ラック、タレゾールノボラック等が挙げられる。The polyepoxide compound is an epoxy group compound and generally has a molecular weight of at least 200. Preferably 400 to 4,000,
More preferably, those having a number average molecular weight within the range of 800 to 2,000 are suitable. As such polyepoxide compounds, those known per se can be used, and include, for example, polyglycidyl ethers of polyphenols that can be produced by reacting a polyphenol compound with epichlorohydrin in the presence of an alkali. Examples of polyphenol compounds that can be used here include bis(4-hydroxyphenyl)-2,2-propane, 4,4' dihydroxybenzophenone, bis(4-hydroxyphenyl)-1,1-ethane, bis-(4-hydroxyphenyl)-1,1-ethane, and bis(4-hydroxyphenyl)-1,1-ethane. -hydroxyphenyl)-1,1-isobutane, bis(4-hydroxy-tert-butyl-
phenyl)-2,2-propane, bis(2-hydroxynaphthyl)methane, l,5-dihydroxynaphthalene,
Bis(2,4-dihydroxyphenyl)methane, tetra(4-hydroxyphenyl)-1,1,2゜2-ethane, 4.4'-dihydroxydiphenyl ether, 4.4
'-dihydroxydiphenylsulfone, phenol novolac, talesol novolac, etc. are mentioned.
上記したポリエポキシド化合物の中で、基体樹脂の製造
に特に好適なものは、数平均分子量が少くとも約380
、好適には約800−2.000、及びエポキシ当量が
190〜2,000、好適には400−1,000の範
囲のポリフェノールのポリグリシジルエーテルであり、
殊に下記−数式%式%)
で表わされるビスフェノールAタイプのエポキシ樹脂で
ある。該ポリエポキシド化合物をポリオール、ポリエー
テルポリオール、ポリエステルポリオール、ポリアミド
アミン、ポリカルボン酸、ポリイソシアネートなどと一
部゛反応させてもよく、さらに、δ−4カプロラクトン
、アクリルモノマーなどをグラフト重合させてもよい。Among the polyepoxide compounds described above, those particularly suitable for producing the base resin have a number average molecular weight of at least about 380.
, preferably about 800-2,000, and an epoxy equivalent weight in the range of 190-2,000, preferably 400-1,000;
In particular, it is a bisphenol A type epoxy resin represented by the following formula (%). The polyepoxide compound may be partially reacted with a polyol, polyether polyol, polyester polyol, polyamide amine, polycarboxylic acid, polyisocyanate, etc., and may also be graft-polymerized with δ-4 caprolactone, acrylic monomer, etc. .
一方、ポリエポキシド化合物に反応させるカチオン化剤
としては、脂肪族または脂環族または芳香−脂肪族の第
1級もしくは第2級アミン、第3級アミン塩、第2級ス
ルフィド塩、第3級ホスフィン塩などが挙げられる。こ
れらはエポキシ基と反応してカチオン性基を形成する。On the other hand, examples of the cationizing agent reacted with the polyepoxide compound include aliphatic, alicyclic, or aromatic-aliphatic primary or secondary amines, tertiary amine salts, secondary sulfide salts, and tertiary phosphine salts. Examples include salt. These react with epoxy groups to form cationic groups.
さらに第3級アミノアルコールとジイソシアネートの反
応によって得られる第3級アミノモノイソシアネートを
エポキシ樹脂の水酸基と反応させてカチオン性基とする
こともできる。Furthermore, a tertiary amino monoisocyanate obtained by the reaction of a tertiary amino alcohol and a diisocyanate can be reacted with a hydroxyl group of an epoxy resin to form a cationic group.
前記カチオン化剤におけるアミノ化合物の例としては、
例えば次のものを例示することができる。Examples of the amino compound in the cationizing agent include:
For example, the following can be exemplified.
(1) メチルアミン、エチルアミン、n−又は1s
o−7’ロピルアミン、モノエタノールアミン、n −
又ハ1so−プロパツールアミンなどの第1級アミン
(2) ジエチルアミン、ジェタノールアミン、ジn−
又は1so−プロパツールアミン、N−メチルエタノー
ルアミン、N−エチルエタノールアミンなどの第2級ア
ミン。(1) Methylamine, ethylamine, n- or 1s
o-7'lopylamine, monoethanolamine, n-
Also, primary amines (2) such as 1so-propanolamine, diethylamine, jetanolamine, di-n-
or secondary amines such as 1so-propertoolamine, N-methylethanolamine, and N-ethylethanolamine.
(3)エチレンジアミン、ジエチレントリアミン、ヒド
ロキシエチルアミノエチルアミン、エチルアミノエチル
アミン、メチルアミノプロピルアミン、ジメチルアミノ
エチルアミン
ミノプロピルアミンなどのポリアミン。(3) Polyamines such as ethylene diamine, diethylene triamine, hydroxyethylaminoethylamine, ethylaminoethylamine, methylaminopropylamine, dimethylaminoethylamine minopropylamine.
これらの中で水酸基を有するアルカノールアミン類が好
ましい。第1級アミ7基を予めケトンと反応させてブロ
ックした後、残りの活性水素でエポキシ基と反応させて
もよい。Among these, alkanolamines having a hydroxyl group are preferred. The primary amine 7 group may be blocked by reacting with a ketone in advance, and then the remaining active hydrogen may be reacted with an epoxy group.
さらに、上記アミン化合物以外にアンモニア、ヒドロキ
シルアミン、ヒドラジン、ヒドロキシエチルヒドラジン
、N−ヒドロキシエチルイミダシリン化合物などの塩基
性化合物も同様に使用できる。これらの化合物を用いて
形成される塩基性基は酸、特に好ましくはギ酸、酢酸、
乳酸などの水溶性有機カルボン酸でプロトン化してカチ
オン性基とすることができる。Furthermore, in addition to the above-mentioned amine compounds, basic compounds such as ammonia, hydroxylamine, hydrazine, hydroxyethylhydrazine, and N-hydroxyethylimidacillin compounds can also be used. The basic groups formed using these compounds are acids, particularly preferably formic acid, acetic acid,
It can be protonated with a water-soluble organic carboxylic acid such as lactic acid to form a cationic group.
さらに、トリエチルアミン、トリエタノールアミン、N
,N−ジメチルエタノールアミン、N−メチルジェタノ
ールアミン、N,N’−ジエチルエタノールアミン、N
−エチルジェタノールアミンなどの第3級アミンなどを
も使用でき、これらは酸で予めプロトン化し、エポキシ
基と反応させて第4級塩にすることができる。Furthermore, triethylamine, triethanolamine, N
, N-dimethylethanolamine, N-methyljetanolamine, N,N'-diethylethanolamine, N
Tertiary amines such as -ethyljetanolamine can also be used, which can be preprotonated with acid and reacted with epoxy groups to form quaternary salts.
また、アミノ化合物以外に、ジエチルスルフィド、ジフ
ェニルスルフィド、テトラメチレンスルフィト、チオジ
ェタノールなどのスルフィド類とホウ酸、炭酸、有機モ
ノカルボン酸などとの塩をエポキシ基と反応させて第3
級スルホニウム塩としてもよい。In addition to amino compounds, salts of sulfides such as diethyl sulfide, diphenyl sulfide, tetramethylene sulfite, and thiogetanol with boric acid, carbonic acid, organic monocarboxylic acids, etc. can be reacted with epoxy groups to form a tertiary compound.
It may also be used as a class sulfonium salt.
更に、トリエチルホスフィン、フエニルジメチルホスフ
ィン、ジフェニルメチルホスフィン、トリエチルホスフ
ィンなどのホスフィン類と上記の如き酸との塩をエポキ
シ基と反応させて、第4級ホスホニウム塩としてもよい
。Furthermore, a salt of a phosphine such as triethylphosphine, phenyldimethylphosphine, diphenylmethylphosphine, or triethylphosphine and the above-mentioned acid may be reacted with an epoxy group to form a quaternary phosphonium salt.
基体樹脂の第1級水酸基の含有量は、後記硬化樹脂中の
エポキシ基との反応性の点から、水酸基価で一般に約l
O〜400、特に20〜200の範囲が好ましい。また
、カチオン性基の含有量は、基体樹脂を水に安定に分散
しうる程度の少ない量が望ましく、KOH(mg/g固
形分)換算数で一般に3〜100、特に8〜80の範囲
が好ましい。しかし、カチオン性基の含有量が3以下の
場合であっても、界面活性剤などを使用して水性分散化
して使用することも可能であるが、この場合には、水分
散化物のpHが4〜9、好ましくは6〜7になるように
カチオン性基を調整するのが望ましい。The content of primary hydroxyl groups in the base resin is generally about 1 in terms of hydroxyl value from the viewpoint of reactivity with the epoxy groups in the cured resin described later.
A range of 0 to 400, particularly 20 to 200, is preferred. The content of the cationic group is preferably as small as possible to stably disperse the base resin in water, and is generally in the range of 3 to 100, particularly 8 to 80 in terms of KOH (mg/g solid content). preferable. However, even if the content of cationic groups is 3 or less, it is possible to use aqueous dispersion using a surfactant, but in this case, the pH of the aqueous dispersion is It is desirable to adjust the cationic group to 4-9, preferably 6-7.
エポキシ硬化CHD塗料で用いる基体樹脂は、第1級水
酸基及びカチオン性基を有しており、遊離のエポキシ基
は原則として含まないことが望ましい。The base resin used in the epoxy cured CHD paint has a primary hydroxyl group and a cationic group, and as a general rule, it is desirable that it does not contain free epoxy groups.
次に上記基体樹脂と混合して使用されるエポキシ基含有
硬化用樹脂としては、例えば、下記式()
で示される繰り返し単位を2〜30個含有するエポキシ
樹脂(以下、「硬化用樹脂(A)」と略称することがあ
る)および下記式(II)CH。Next, as the epoxy group-containing curing resin used in combination with the above-mentioned base resin, for example, an epoxy resin containing 2 to 30 repeating units represented by the following formula () (hereinafter referred to as "curing resin (A )" and the following formula (II) CH.
C繻O
(ff)
式中、Rは水素原子又はメチル基である、で示される繰
り返し単位を有する数平均分子量が200.000以下
の重合体(以下、「硬化用樹脂(B)」と略称すること
がある)をあげることができる。A polymer with a number average molecular weight of 200.000 or less (hereinafter abbreviated as "curing resin (B)") having a repeating unit represented by C 繻O (ff), where R is a hydrogen atom or a methyl group. ) can be given.
さらに具体的には、まず硬化用樹脂(A)としては、例
えば、特開昭60−170620号公報、特開昭(32
−135467号公報、特開昭60−166675号公
報、特開昭60−161973号公報などに記載されて
いるそれ自体既知のものを使用することができる、
上記硬化用樹脂(A)は、下記式(I[I)に示す如く
、末端に重合開始成分の残基Xをもつことができる。More specifically, first of all, as the curing resin (A), for example, JP-A No. 60-170620, JP-A No. 32
The above-mentioned curing resin (A) is as follows. As shown in formula (I[I), it can have a polymerization initiating component residue X at the terminal.
式中、nは2〜30の整数である、
ここで、Xは活性水素を有する有機物残基であり、その
前駆体である活性水素を有する有機物としてハ、例エバ
、アルコール類、フェノール類、カルボン酸類、アミン
類、チオール類等があげられる。In the formula, n is an integer of 2 to 30. Here, X is an organic residue having active hydrogen, and examples of the organic substance having active hydrogen, which is a precursor thereof, include EVA, alcohols, phenols, Examples include carboxylic acids, amines, thiols, and the like.
コノウチ、アルコール類としては、1価アルコールなら
びに2価以上の多価アルコールのいずれであってもよく
、具体的にはメタノール、エタノール、プロパツール、
ブタノール、ペンタノール、ヘキサノール、オクタツー
ル等の脂肪族1価アルコール;ベンジルアルコールのよ
うな芳香族1価アルコール:エチレングリコール、ジエ
チレングリコール、トリエチレングリコール、ポリエチ
レングリコール、フロピレンゲリコール、シフロピレン
グリコール、1.3−ブタンジオール、1.4−ブタン
ジオール、ベンタンジオール、l、6−ヘキサンジオー
ル、ネオペンチルグリコール、オキシピバリン酸ネオペ
ンチルグリコールエステルシクロヘキサンジメタツール
、グリセリン、ジグリセリン、ポリグリセリン、トリメ
チロールプロパン、トリメチロールエタン、ペンタエリ
スリトール、ペンタエリスリトールなどの多価アルコー
ル等が例示される。Alcohols may be monohydric alcohols or polyhydric alcohols of dihydric or higher hydrity, specifically methanol, ethanol, propatool,
Aliphatic monohydric alcohols such as butanol, pentanol, hexanol, octatool; Aromatic monohydric alcohols such as benzyl alcohol: ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, phlopylene gelicol, cyfropylene glycol, 1 .3-butanediol, 1,4-butanediol, bentanediol, l,6-hexanediol, neopentyl glycol, oxypivalic acid neopentyl glycol ester cyclohexane dimetatool, glycerin, diglycerin, polyglycerin, trimethylolpropane , trimethylolethane, pentaerythritol, and polyhydric alcohols such as pentaerythritol.
フェノール類としては、例えば、フェノール、クレゾー
ル、カテコール、プロガロール、ハイドロキノン、ハイ
ドロキノン七ツメチルエーテル、ビスフェノールA1
ビスフェノールF,4.4’ジヒドロキシベンゾフエノ
ン、ビスフェノールs1フェノール樹脂、クレゾールノ
ボラック樹脂等が挙げられる。Examples of phenols include phenol, cresol, catechol, progallol, hydroquinone, hydroquinone 7-methyl ether, and bisphenol A1.
Examples include bisphenol F, 4.4' dihydroxybenzophenone, bisphenol s1 phenol resin, and cresol novolak resin.
カルボン酸類としてはギ酸、酢酸、プロピオン酸、酪酸
、動植物油の脂肪酸;7マル酸、マレイン酸、アジピン
酸、ドデカン2酸、トリメリット酸、ピロメリット酸、
ポリアクリル酸、7タール酸、イソフタル酸、テレフタ
ル酸等が例示でき、また、乳酸、クエン酸、オキシカプ
ロン酸等の水酸基とカルボン酸を共に有する化合物も使
用できる。Carboxylic acids include formic acid, acetic acid, propionic acid, butyric acid, fatty acids from animal and vegetable oils; 7-malic acid, maleic acid, adipic acid, dodecanoic acid, trimellitic acid, pyromellitic acid,
Examples include polyacrylic acid, 7-thalic acid, isophthalic acid, and terephthalic acid, and compounds having both a hydroxyl group and a carboxylic acid such as lactic acid, citric acid, and oxycaproic acid can also be used.
さらにその他、活性水素を有する化合物として、ポリビ
ニルアルコール、ポリ酢酸ビニル部分加水分解物、デン
プン、セルロース、セルロースアセテート、セルロース
アセテートブチレート、ヒドロキシエチルセルロース、
アリルポリオール樹脂、スチレン−アリルアルコール共
重合樹脂、スチレン−マレイン酸共重合樹脂、アルキッ
ド樹脂、ポリエステルポリオール樹脂、ポリカプロラク
トンポリオール樹脂等も使用することができる。また、
活性水素を有する化合物は、活性水素と共にその骨格中
に不飽和二重結合を有していてもよく、さらに該不飽和
二重結合がエポキシ化された構造のものであってもさし
つかえない。In addition, as compounds having active hydrogen, polyvinyl alcohol, polyvinyl acetate partial hydrolyzate, starch, cellulose, cellulose acetate, cellulose acetate butyrate, hydroxyethyl cellulose,
Allyl polyol resin, styrene-allyl alcohol copolymer resin, styrene-maleic acid copolymer resin, alkyd resin, polyester polyol resin, polycaprolactone polyol resin, etc. can also be used. Also,
The compound having active hydrogen may have an unsaturated double bond in its skeleton together with active hydrogen, and may also have a structure in which the unsaturated double bond is epoxidized.
前記(I)式において繰り返し単位の数を表わすnは2
〜30であるが、nが30を越えると一般に融点の高い
樹脂となり取扱困難となる。In the formula (I), n, which represents the number of repeating units, is 2.
-30, but when n exceeds 30, the resin generally has a high melting point and is difficult to handle.
硬化用樹脂(A)は、具体的には通常、上記活性水素を
有する有機化合物を開始剤にし、4−ビニルシクロヘキ
セン−l−オキサイドを開環重合させることによって得
られるポリエーテル樹脂、すなわち、ビニル基側鎖を有
するポリシクロヘキセンオキサイド開環重合体を過酸等
の酸化剤でエポキシ化することによって製造することが
できる。Specifically, the curing resin (A) is usually a polyether resin obtained by ring-opening polymerization of 4-vinylcyclohexene-l-oxide using the above-mentioned active hydrogen-containing organic compound as an initiator, that is, vinyl It can be produced by epoxidizing a ring-opened polycyclohexene oxide polymer having a group side chain with an oxidizing agent such as a peracid.
4−ビニルシクロヘキセン−1−オキサイドは例えば、
ブタジェンの2量化反応によって得られるビニルシクロ
ヘキセンを過酢酸によって部分エポキシ化することによ
って得ることができる。4−ヒニルンクロヘキセンーl
ーオキサイドを活性水素存在下に開環重合させる場合に
は一般に触媒を使用することが好ましく、使用しうる触
媒としては、例えば、メチルアミン、エチルアミン、プ
ロピルアミン、ピペラジン等のアミン類、ピリジン類;
イミダゾール類等の有機塩基酸;ギ酸、酢酸、プロピオ
ン酸等の有機酸類;硫酸、塩酸等の無機酸;ナトリウム
メチラート等のアルカリ金属アルコラード類;KOH,
NaOH等のアルカリ類;BF3ZnCQ2、AQCQ
s、SnCQ.等のルイス酸又はそのコンプレックス類
、トリエチルアルミニウム、ジエチル亜鉛等の有機金属
化合物を掲げることができる。4-vinylcyclohexene-1-oxide is, for example,
It can be obtained by partially epoxidizing vinylcyclohexene obtained by a dimerization reaction of butadiene with peracetic acid. 4-hinyl chlorohexene
- When carrying out ring-opening polymerization of oxide in the presence of active hydrogen, it is generally preferable to use a catalyst, and examples of catalysts that can be used include amines such as methylamine, ethylamine, propylamine, and piperazine, and pyridines;
Organic basic acids such as imidazoles; Organic acids such as formic acid, acetic acid, and propionic acid; Inorganic acids such as sulfuric acid and hydrochloric acid; Alkali metal alcoholades such as sodium methylate; KOH,
Alkali such as NaOH; BF3ZnCQ2, AQCQ
s, SnCQ. Lewis acids such as or complexes thereof, and organometallic compounds such as triethylaluminum and diethylzinc.
これらの触媒は反応物に対して0.001〜lO重量%
、好ましくは0.1〜5重量%の範囲で使用することが
できる。開環重合反応温度は一般に一70〜200℃、
好ましくは一30℃〜100℃である。反応は溶媒を用
いて行なうことができ、溶媒としては活性水素を有して
いない通常の溶媒を使用することが好ましい。また場合
により、4−ビニルシクロヘキセンオキサイドの他にσ
ーオレフィンのエポキシ化物のようなモノエポキシド等
を共重合させてもよい。These catalysts contain 0.001 to 10% by weight of the reactants.
, preferably in a range of 0.1 to 5% by weight. The ring-opening polymerization reaction temperature is generally -70 to 200°C,
Preferably the temperature is -30°C to 100°C. The reaction can be carried out using a solvent, and it is preferable to use a conventional solvent that does not contain active hydrogen. In some cases, in addition to 4-vinylcyclohexene oxide, σ
- Monoepoxides such as epoxides of olefins may be copolymerized.
このようにして合皮されるビニル基側鎖を有するポリシ
クロヘキセンオキサイド開環重合体が有するビニル基側
鎖をエポキシ化すれば、式(I)の硬化用樹脂(A)が
得られ、そのエポキシ化は、過酸類、ハイドロパーオキ
サイド類等を用いて行なうことができる。過酸類として
は、例えば過ギ酸、過酢酸、過安息香酸、トリフルオロ
過酢酸等を用いることができ、また、ハイドロパーオキ
サイド類としては、例えば過酸化水素、tart−ブチ
ルパーオキサイド、クメンパーオキサイド等を用いるこ
とができる。エポキシ化反応は必要に応じて触媒を用い
て行なうことができる。エポキシ化反応の際の溶媒使用
の有無や反応温度は、用いる装置や原料物性に応じて適
宜調整することができる。エポキシ化反応の条件によっ
て、原料重合体中のビニル基のエポキシ化と同時に原料
中の下記式(TV)で示される置換基及び/又は生皮し
てくる下記式(V)で示される置換基がエポキシ化剤等
と副反応を起こした結果、変成された置換基が生じ、硬
化用樹脂(A)中に含まれることがある。By epoxidizing the vinyl group side chain of the polycyclohexene oxide ring-opened polymer having a vinyl group side chain to be synthesized in this way, a curing resin (A) of formula (I) is obtained, and the epoxy The conversion can be carried out using peracids, hydroperoxides, and the like. As peracids, for example, performic acid, peracetic acid, perbenzoic acid, trifluoroperacetic acid, etc. can be used, and as hydroperoxides, for example, hydrogen peroxide, tart-butyl peroxide, cumene peroxide, etc. can be used. etc. can be used. The epoxidation reaction can be carried out using a catalyst if necessary. Whether or not a solvent is used during the epoxidation reaction and the reaction temperature can be adjusted as appropriate depending on the equipment used and the physical properties of the raw materials. Depending on the conditions of the epoxidation reaction, the substituent represented by the following formula (TV) in the raw material and/or the substituent represented by the following formula (V) that comes from the raw material at the same time as the epoxidation of the vinyl group in the raw material polymer. As a result of a side reaction with an epoxidizing agent or the like, modified substituents may be generated and may be included in the curing resin (A).
これらの変成された置換基が含まれる比率はエポキシ化
剤の種類、エポキシ化剤とビニル基のモル比、反応条件
によって定まる。The proportion of these modified substituents is determined by the type of epoxidizing agent, the molar ratio of the epoxidizing agent to the vinyl group, and the reaction conditions.
硬化用樹脂(A)として市販品も使用可能であり、例え
ばEHPE3150 (ダイセル化学工業(株)製商品
名)があげられる。Commercially available products can also be used as the curing resin (A), such as EHPE3150 (trade name, manufactured by Daicel Chemical Industries, Ltd.).
次に、硬化用樹脂(B)としては、下記式%式%
式中、Rは水素原子又はメチル基である、で示される繰
り返し単位を有する数平均分子量2oo、ooo以下の
重合体が使用される。Next, as the curing resin (B), a polymer having a number average molecular weight of 2oo, ooo or less and having a repeating unit represented by the following formula % formula % where R is a hydrogen atom or a methyl group is used. Ru.
硬化用樹脂(B)は通常、下記−数式(Vl)式中、R
は水素又はメチル基である、
で示される七ツマ−から選ばれる1種以上、又は該モノ
マーの少なくとも1種と他の重合性モノマーとを重合せ
しめることによって製造することができる。上記式(V
l)で示される七ツマ−として具体的Jこは例えば、3
.4−エポキシシクロヘキシルメチルアクリレート、3
.4−エポキシシクロヘキシルメチルアクリレートなど
があげられる。The curing resin (B) is usually represented by the following formula (Vl), R
is hydrogen or a methyl group, or it can be produced by polymerizing at least one of these monomers with another polymerizable monomer. The above formula (V
For example, the seven points shown in l) are 3
.. 4-Epoxycyclohexylmethyl acrylate, 3
.. Examples include 4-epoxycyclohexylmethyl acrylate.
これらの市販品として、例えば、ダイセル化学工業製M
ETHB、AETHB(いずれも商品名)があげられる
。As these commercially available products, for example, M manufactured by Daicel Chemical Industries, Ltd.
Examples include ETHB and AETHB (both product names).
また、上記式(Vl)で示される七ツマ−と共重合しう
る他の重合性モノマーとしては、望まれる性能に応じて
広範に選択することができ、その代表例を示せば次の通
りである。In addition, other polymerizable monomers that can be copolymerized with the hexamer represented by the above formula (Vl) can be selected from a wide range depending on the desired performance, and representative examples are as follows. be.
(a) アクリル酸又はメタクリル酸のエステル;例
えば、アクリル酸メチル、アクリル酸エチル、アクリル
酸プロピル、アクリル酸イソプロピル、アクリル酸ブチ
ル、アクリル酸ヘキシル、アクリル酸オクチル、アクリ
ル酸ラウリル、メタクリル酸メチル、メタクリル酸エチ
ル、メタクリル酸プロピル、メタクリル酸イソプロピル
、メタクリル酸ブチル、メタクリル酸ヘキシル、メタク
リル酸オクチル、メタクリル酸ラウリル等のアクリル酸
又はメタクリル酸の炭素数1〜18のアルキルエステル
;アクリル酸メトキシブチル、メタクリル酸メトキシブ
チル、アクリル酸メトキシエチル、メタクリル酸メトキ
シエチル、アクリル酸エトキシブチル、メタクリル酸エ
トキシブチル等のアクリル酸又はメタクリル酸の炭素数
2〜18のアルコキシアルキルエステル;アリルアクリ
レート、アリルメタクリレート等のアクリル酸又はメタ
クリル酸の炭素数2〜8のアルケニルエステル;ヒドキ
ロシエチルアクリレート、ヒトキロジエチルメタクリレ
ート、ヒトキロジプロピルアクリレート、ヒトキロジプ
ロピルメタクリレート等のアクリル酸又はメタクリル酸
の炭素数2〜8のヒドロキシアルキルエステル;アリル
オキシエチルアクリレート、アリルオキシメタクリレー
ト等のアクリル酸又はメタクリル酸の炭素数3〜18の
アルケニルオキシアルキルエステル。(a) Esters of acrylic acid or methacrylic acid; for example, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, hexyl acrylate, octyl acrylate, lauryl acrylate, methyl methacrylate, methacrylate C1-18 alkyl esters of acrylic acid or methacrylic acid such as ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, hexyl methacrylate, octyl methacrylate, lauryl methacrylate; methoxybutyl acrylate, methacrylic acid C2-18 alkoxyalkyl esters of acrylic acid or methacrylic acid such as methoxybutyl, methoxyethyl acrylate, methoxyethyl methacrylate, ethoxybutyl acrylate, and ethoxybutyl methacrylate; acrylic acid such as allyl acrylate and allyl methacrylate; C2-8 alkenyl ester of methacrylic acid; C2-8 hydroxyalkyl of acrylic acid or methacrylic acid such as hydroxyloethyl acrylate, human kilodiethyl methacrylate, human kilodipropyl acrylate, human kilodipropyl methacrylate Ester: C3-18 alkenyloxyalkyl ester of acrylic acid or methacrylic acid such as allyloxyethyl acrylate and allyloxymethacrylate.
(b) ビニル芳香族化合物:例えば、スチレン、α
−メチルスチレン、ビニルトルエン、p−クロルスチレ
ン。(b) Vinyl aromatic compounds: for example, styrene, α
-Methylstyrene, vinyltoluene, p-chlorostyrene.
(c)ポリオレフィン系化合物:例えば、ブタジェン、
イソプレン、クロロプレン。(c) Polyolefin compound: For example, butadiene,
Isoprene, chloroprene.
(d) その他:アクリロニトリル、メタクリロニト
リル、メチルイソプロペニルケトン、酢酸ビニルベオバ
モノマー(シェル化学製品)、ヒニルグロピオネート、
ビニルピバレート、ポリカプロラクトン鎖をもつビニル
化合物(例えば、FM−3Xモノマー:ダイセル化学工
業製商品名)等。(d) Others: acrylonitrile, methacrylonitrile, methyl isopropenyl ketone, vinyl acetate beoba monomer (Shell Chemicals), hinylgropionate,
Vinyl pivalate, a vinyl compound having a polycaprolactone chain (for example, FM-3X monomer: trade name manufactured by Daicel Chemical Industries, Ltd.), and the like.
硬化用樹脂(B)において、前記式(Vl)で示される
モノマーの使用量は、該樹脂(B)の1分子中に少なく
とも2個含有されていればよく、硬化した塗膜の架橋密
度や硬化速度などに基づいて、硬化用樹脂(B)の固形
分中少なくとも50重量%以上となるようにするのが好
ましい。In the curing resin (B), the amount of monomers represented by the formula (Vl) used is such that at least two monomers are contained in one molecule of the resin (B), and the amount of monomers represented by the formula (Vl) is determined based on the crosslinking density of the cured coating film. Based on the curing speed and the like, it is preferable that the solid content of the curing resin (B) be at least 50% by weight.
上記硬化用樹脂(B)は、通常のアクリル樹脂やビニル
樹脂等の合成反応と同様の方法、条件で製造することが
できる。このような合成反応の一例として、各単量体成
分を有機溶剤に溶解もしくは分散せしめ、ラジカル重合
開始剤の存在下で60〜180°C程度の温度で撹拌し
ながら加熱する方法を示すことができる。反応時間は通
常l〜10時間程度とすることができる。また、有機溶
剤としては、アルコール系溶媒、エーテル系溶媒、エス
テル系溶媒、炭化水素系溶媒等を使用できる。The above-mentioned curing resin (B) can be produced by the same method and under the same conditions as those for general synthesis reactions of acrylic resins, vinyl resins, and the like. An example of such a synthesis reaction is a method in which each monomer component is dissolved or dispersed in an organic solvent, and heated with stirring at a temperature of about 60 to 180°C in the presence of a radical polymerization initiator. can. The reaction time can generally be about 1 to 10 hours. Further, as the organic solvent, alcohol solvents, ether solvents, ester solvents, hydrocarbon solvents, etc. can be used.
炭化水素系溶媒を用いる場合には、溶解性の点がら他の
溶媒を併用することが好ましい。さらに、ラジカル開始
剤としては通常用いられているものをいずれも用いるこ
とができ、その具体例として、過酸化ベンゾイル、七−
プチルパーオキシ−2−エチルヘキサノエート等の過酸
化物;アゾインブチルニトリル、アソヒスジメチルバレ
ロニトリル等のアゾ化合物等を示すことができる。When using a hydrocarbon solvent, it is preferable to use other solvents in view of solubility. Further, as the radical initiator, any commonly used radical initiator can be used, and specific examples thereof include benzoyl peroxide, 7-
Peroxides such as butylperoxy-2-ethylhexanoate; azo compounds such as azoinbutylnitrile and asohisdimethylvaleronitrile; and the like.
上記硬化用樹脂(B)は、数平均分子量3,000〜2
00.000程度のものが好ましく、特に4.000〜
10.000程度のものがより好ましい。The curing resin (B) has a number average molecular weight of 3,000 to 2.
About 00.000 is preferable, especially 4.000 to
A value of about 10,000 is more preferable.
エポキシ硬化CED塗料において、上記の基体樹脂と硬
化用樹脂(A)および/または(B)との構成率は、用
いる基体樹脂の種類に応じて、また得られる塗膜が熱硬
化するのに必要な最少量乃至カチオン電着塗料の安定性
をそこなわない最大量の範囲内で適宜変えることができ
るが、一般には硬化用樹脂の基体樹脂に対する固形分の
重量比が0.2〜1.5の範囲となるように選択するの
が好ましい。また、硬化用樹脂の一部が基体樹脂にあら
かじめ付加したものが含まれていてもさしつかえない。In the epoxy cured CED paint, the composition ratio of the above base resin and the curing resin (A) and/or (B) depends on the type of base resin used and is necessary for the resulting coating film to be thermally cured. Although the amount can be changed as appropriate within the range of the minimum amount to the maximum amount that does not impair the stability of the cationic electrodeposition paint, generally the weight ratio of the solid content of the curing resin to the base resin is 0.2 to 1.5. It is preferable to select it so that it falls within the range of . Further, a part of the curing resin may include a resin added in advance to the base resin.
上記基体樹脂と硬化用樹脂(A)および/又は(B)と
を主成分とする組成物は本発明におけるマレイン酸鉛を
配合するカチオン電着塗料として使用することができる
。A composition containing the above-mentioned base resin and curing resin (A) and/or (B) as main components can be used as a cationic electrodeposition paint containing lead maleate in the present invention.
本発明において、マレイン酸鉛をカチオン電着塗料に配
合する方法は特に制限されず、粉末状もしくは粒状のも
のをそのまま配合してさしつがえない。例えば、顔料分
散樹脂などによりマレイン酸鉛を単独または他の顔料と
共にボールミルで分散した後、カチオン電着塗料に配合
することができる。In the present invention, the method of blending lead maleate into the cationic electrodeposition paint is not particularly limited, and powdered or granular forms may be blended as they are. For example, lead maleate alone or together with other pigments can be dispersed in a ball mill using a pigment dispersion resin, and then incorporated into a cationic electrodeposition paint.
カチオン電着塗料へのマレイン酸の配合量は目的に応じ
て任意に選択できるが、一般には、前者の樹脂固型分に
対して金属鉛として0.05〜15重量%、好ましくは
0.5〜10重量%の鉛を含むように調整するのが好ま
しい。The amount of maleic acid added to the cationic electrodeposition paint can be arbitrarily selected depending on the purpose, but in general, it is 0.05 to 15% by weight as metallic lead, preferably 0.5% by weight, based on the solid content of the former resin. It is preferable to adjust the lead content to 10% by weight.
さらに、本発明のカチオン電着塗料には、必要に応じて
、カーボンブラック、チタン白、鉛白、ベンガラのよう
な着色顔料;クレー、タルクのような体質顔料ニクロム
酸ストロンチウム、クロム酸鉛、リサージ、鉛丹、塩基
性ケイ酸鉛、リン酸鉛、塩基性硫酸鉛、ケイクロム酸鉛
などの防食顔料;或いはさらに他の添加剤を混練しても
よい。Furthermore, the cationic electrodeposition paint of the present invention may optionally contain color pigments such as carbon black, titanium white, lead white, and red iron; extender pigments such as clay and talc; strontium dichromate, lead chromate, and litharge. , anticorrosive pigments such as red lead, basic lead silicate, lead phosphate, basic lead sulfate, and lead silicate; or other additives may be further kneaded.
配合しうる他の添加剤としては、例えば分散剤又は塗面
のハジキ防止剤としての少量の非イオン系界面活性剤や
硬化促進剤等が挙げられる。Other additives that may be blended include, for example, small amounts of nonionic surfactants and curing accelerators as dispersants or anti-repellents on coated surfaces.
本発明のカチオン電着塗料は通常の方法でカチオン電着
塗装をすることができ、その電着塗膜は、例えば、80
〜250’C!、好ましくは120〜160°Cの範囲
の温度で加熱硬化させることができる。The cationic electrodeposition paint of the present invention can be cationically electrodeposited by a normal method, and the electrodeposition coating film is, for example, 80%
~250'C! , preferably at a temperature in the range of 120 to 160°C.
次に実施例により本発明を更に具体的に説明する。実施
例中「部」はいずれも「重量部」であり、「%」は「重
量%」である。Next, the present invention will be explained in more detail with reference to Examples. In the Examples, all "parts" are "parts by weight" and "%" are "% by weight".
実施例1
モノエタノールアミン39部を反応容器中で60°Cに
保ち、N、N−ジメチルアミノプロピルアクリルアミ1
100部を滴下し、60’Oで5時間反応させ、N、N
−ジメチルアミノプロピルアクリルアミドのモノエタノ
ールアミン付加物を得た。Example 1 39 parts of monoethanolamine were kept at 60°C in a reaction vessel, and 1 part of N,N-dimethylaminopropylacrylamine was added.
100 parts was added dropwise, reacted at 60'O for 5 hours, and N,N
- A monoethanolamine adduct of dimethylaminopropylacrylamide was obtained.
別にエポキシ当量190のビスフェノールAジグリシジ
ルエーテル950部、エポキシ当量約330のエポキシ
樹脂XB−4122(チバガイギー社製、商品名)約3
30部、ビスフェノールA456部及びジェタノールア
ミン21部を仕込み、120℃まで昇温し、エポキシ価
が1.02ミ!Jモル1gになるまで反応させた後、エ
チレングリコールモノブチルエーテル476部で希釈、
冷却したのち、温度を100°Cに保ちながら、ジェタ
ノールアミン158部及び上記N、N−ジメチルアミノ
プロピルアクリルアミドのモノエタノールアミン付加物
43部を加え、粘度上昇が止まるまで反応させ、樹脂固
形分80%の基体樹脂溶液■を得た。Separately, 950 parts of bisphenol A diglycidyl ether with an epoxy equivalent of 190, and epoxy resin XB-4122 (manufactured by Ciba Geigy, trade name) with an epoxy equivalent of about 330, about 3
30 parts of bisphenol A, 456 parts of bisphenol A, and 21 parts of jetanolamine were charged, the temperature was raised to 120°C, and the epoxy value was 1.02 mi! After reacting to 1 g of J mole, dilute with 476 parts of ethylene glycol monobutyl ether,
After cooling, while maintaining the temperature at 100°C, 158 parts of jetanolamine and 43 parts of the monoethanolamine adduct of the above N,N-dimethylaminopropylacrylamide were added, and the reaction was carried out until the viscosity stopped increasing, and the resin solid content was reduced. An 80% base resin solution (2) was obtained.
一方、EHPE3150 [エポキシ当量175〜19
5、ダイセル化学工業(株)製エポキシ樹脂]32.6
部とプロピレングリコールモノメチルエーテル8.2部
とを100℃で加熱溶解し、固形分80%、エポキシ当
量190の硬化用樹脂溶液(A−1)40.8部を得た
。このものと上記基体樹脂溶液■84.2部と10%ギ
酸水溶液11部を混合し、撹拌しながら脱イオン水36
4部と共に加え、固型分含有率20%のカチオン電着塗
料500部を得る。On the other hand, EHPE3150 [epoxy equivalent 175-19
5. Epoxy resin manufactured by Daicel Chemical Industries, Ltd.] 32.6
and 8.2 parts of propylene glycol monomethyl ether were heated and dissolved at 100°C to obtain 40.8 parts of a curing resin solution (A-1) having a solid content of 80% and an epoxy equivalent of 190. Mix this with 84.2 parts of the above base resin solution (■) and 11 parts of a 10% formic acid aqueous solution, and while stirring, add 36 parts of deionized water.
4 parts to obtain 500 parts of a cationic electrodeposition paint with a solids content of 20%.
次に、上記基体樹脂溶液■14.7部と10%ギ酸水溶
液2.5部と混合し、撹拌しながら脱イオン水25部を
加えた後、マレイン酸鉛(関東化学(株)社製試薬1級
)7.8部を配合しボールミルで24時間分散して固形
分40%、金属鉛含有量8%のマレイン酸鉛ペースト5
0部を得る。このペースト50部と上記20%カチオン
電着塗料500部と脱イオン氷37.5部とを混合して
pt−i5.4のカチオン電着浴を得る。金属鉛の含有
率は樹脂固型分に対し約3.6%である。Next, 14.7 parts of the above base resin solution (1) and 2.5 parts of a 10% formic acid aqueous solution were mixed, 25 parts of deionized water was added while stirring, and lead maleate (Kanto Kagaku Co., Ltd. reagent) was mixed. Lead maleate paste 5 with a solid content of 40% and a metallic lead content of 8% was prepared by blending 7.8 parts of grade 1) and dispersing it in a ball mill for 24 hours.
Get 0 copies. Fifty parts of this paste, 500 parts of the above 20% cationic electrodeposition paint, and 37.5 parts of deionized ice are mixed to obtain a cationic electrodeposition bath of pt-i5.4. The content of metallic lead is about 3.6% based on the resin solid content.
実施例2
エポキシ当量950のビスフェノールAタイプエポキシ
樹脂[商品名「エピコート1004、シェル化学(株)
製] 1900部をブチルセロソルブ993部に溶解
し、ジェタノールアミン(カチオン化剤)21部部を8
0〜100°Cで滴下後100°Cで2時間保持して固
形分68%、アミン価53をもつエポキシ樹脂−アミン
付加物(基体樹脂溶液■を得た。この基体樹脂溶液■1
00部に88%ギ酸3.2部を加えて中和する。第1級
水酸基価106、カチオン性基53KOH(mg/g固
形分)で、遊離のエポキシ基を殆ど含まない。Example 2 Bisphenol A type epoxy resin with an epoxy equivalent of 950 [trade name "Epicote 1004," manufactured by Shell Chemical Co., Ltd.
1,900 parts of butyl cellosolve was dissolved in 993 parts of butyl cellosolve, and 21 parts of jetanolamine (cationizing agent) was dissolved in 8 parts of
After dropwise addition at 0 to 100°C, the mixture was kept at 100°C for 2 hours to obtain an epoxy resin-amine adduct (base resin solution ■) having a solid content of 68% and an amine value of 53. This base resin solution ■1
00 parts by adding 3.2 parts of 88% formic acid to neutralize. It has a primary hydroxyl value of 106, a cationic group of 53 KOH (mg/g solid content), and contains almost no free epoxy groups.
METHB (3,4−エポキシシクロヘキシルメチル
メタクリレ−1−)33.4部にアゾビスジメチルバレ
ロニトリル2部を溶解したものを、loo’cに加熱し
たメチルインブチル71710部とブチルセロツル11
0部との混合溶剤に2時間かけて滴下し、1時間熟成後
、125°Cに昇温して更に1時間熟成し、固形分60
%、エポキシ当量196の硬化用樹脂溶液(B−1)5
4部を得る。A solution of 2 parts of azobisdimethylvaleronitrile in 33.4 parts of METHB (3,4-epoxycyclohexylmethyl methacrylate-1-) was heated to loo'c to add 71,710 parts of methyl inbutyl and 11 parts of butyl serotonin.
It was added dropwise over 2 hours to a mixed solvent with 0 parts of
%, epoxy equivalent: 196 curing resin solution (B-1) 5
Get 4 copies.
上記基体樹脂溶液■のギ酸中和物103部に脱イオン水
343部と共に硬化用樹脂溶液(B−1)54部を加え
、20%カチオン電着塗料を得た。343 parts of deionized water and 54 parts of the curing resin solution (B-1) were added to 103 parts of the formic acid neutralized product of the base resin solution (1) to obtain a 20% cationic electrodeposition paint.
この電着塗料500部に、上記実施例1におけるマレイ
ン酸鉛のペースト60部、脱イオン水40部とを混合し
、p H5,4のカチオン電着浴を得る、金属鉛として
の含有率は樹脂固形分に対し4.2%である。500 parts of this electrodeposition paint is mixed with 60 parts of the lead maleate paste in Example 1 and 40 parts of deionized water to obtain a cationic electrodeposition bath with a pH of 5.4.The content as metallic lead is It is 4.2% based on the resin solid content.
実施例3
実施例1における80%硬化用樹脂溶液(A−1)40
.8部を実施例2の60%硬化用樹脂溶液(B−1)5
4部に代替した。Example 3 80% curing resin solution (A-1) in Example 1 40
.. 8 parts of the 60% curing resin solution (B-1) of Example 2
It was replaced with 4th part.
実施例 4
イソホロンジイソシアネート222部にメチルエチルケ
トキシム174部を50°Cで滴下して3時間後にプロ
ピレングリコールモノメチルエーテル264部で希釈し
、固形分60%のブロックイソシアネートを作威し、こ
れを硬化用樹脂溶液(C−1)とする。Example 4 174 parts of methyl ethyl ketoxime was added dropwise to 222 parts of isophorone diisocyanate at 50°C, and after 3 hours it was diluted with 264 parts of propylene glycol monomethyl ether to form a blocked isocyanate with a solid content of 60%, which was used as a curing resin. This will be referred to as solution (C-1).
実施例1の基体樹脂溶液■100部と上記硬化用樹脂溶
液(C−1)34部とギ酸1.8部を混合し、脱イオン
水364部で希釈して20%のエマルションヲ作戊する
。Mix 100 parts of the base resin solution (1) of Example 1, 34 parts of the above curing resin solution (C-1), and 1.8 parts of formic acid, and dilute with 364 parts of deionized water to prepare a 20% emulsion. .
このエマルション400部と実施例1のヘースト71部
と脱イオン水124部とを混合してpH6,1のカチオ
ン電着浴を得る。金属鉛の含有率は樹脂固型分に対して
5.8%である。400 parts of this emulsion, 71 parts of the haste of Example 1, and 124 parts of deionized water are mixed to obtain a cationic electrodeposition bath having a pH of 6.1. The content of metallic lead was 5.8% based on the resin solid content.
比較例1〜2
実施例Iにおいて、マレイン酸鉛に代えて、酢酸鉛(比
較例1)およびセカノイック鉛(比較例2)をそれぞれ
金属鉛として実施例1と同量配合してカチオン電着浴を
得る。Comparative Examples 1 to 2 In Example I, instead of lead maleate, lead acetate (Comparative Example 1) and secanoic lead (Comparative Example 2) were each mixed as metallic lead in the same amounts as in Example 1 to create a cationic electrodeposition bath. get.
比較例3
実施例3において、マレイン酸鉛に代えて、塩基性けい
酸鉛を金属鉛として実施例4と同量配合してカチオン電
着浴を得る
比較例4
エポキシ当量190のビスフェノールAジグリシジルエ
ーテル380部にプロピレングリコールモノメチルエー
テル512部の存在下60°Cでジェタノールアミン2
10部を4時間反応させる。Comparative Example 3 In Example 3, a cationic electrodeposition bath is obtained by adding basic lead silicate as metallic lead in place of lead maleate in the same amount as in Example 4. Comparative Example 4 Bisphenol A diglycidyl with an epoxy equivalent of 190 Jetanolamine 2 was added to 380 parts of ether at 60°C in the presence of 512 parts of propylene glycol monomethyl ether.
10 parts are allowed to react for 4 hours.
120°Cに昇温し、酸化鉛223部を少量ずつ添加し
、6時間反応させる。更に酢酸20部を加え、脱イオン
水3955部で希釈し、鉛金属を3.9%含む15%の
キレート鉛水分散物を作成する。The temperature was raised to 120°C, 223 parts of lead oxide was added little by little, and the mixture was allowed to react for 6 hours. An additional 20 parts of acetic acid is added and diluted with 3955 parts of deionized water to create a 15% chelated lead aqueous dispersion containing 3.9% lead metal.
このキレート鉛水分散物を実施例3においてマレイン鉛
ペーストtこ代えて、金属鉛としての含有率が実施例3
と同量になるように配合する。This chelate lead aqueous dispersion was replaced with maleic lead paste t in Example 3, and the content as metallic lead was changed to Example 3.
Mix to make the same amount.
比較例5
実施例4において、マレイン酸鉛に代えて、オクチツク
ス鉛を金属鉛として実施例4と同量配合してカチオン電
着浴を得る。Comparative Example 5 In Example 4, a cationic electrodeposition bath is obtained by adding Octyx lead as a metal lead in the same amount as in Example 4 instead of lead maleate.
[性能試験及びその結果1
実施例1〜4および比較例1〜5で得たカチオン電着塗
料およびその塗膜性能について以下の方法で調べる。[Performance Test and Results 1 The cationic electrodeposition paints obtained in Examples 1 to 4 and Comparative Examples 1 to 5 and their coating film performance were investigated by the following method.
試験方法
(1) 塗膜破壊電圧:
カチオン電着塗料を30°Cでリン酸亜鉛処理板に電着
し、塗膜破壊により塗装不能になった電圧(V)を塗膜
破壊電圧(V)とする。Test method (1) Film breakdown voltage: Cationic electrodeposition paint is electrodeposited on a zinc phosphate-treated board at 30°C, and the voltage (V) at which the coating becomes unpaintable due to coating breakdown is determined as the coating film breakdown voltage (V). shall be.
(2)塗膜の硬化性:
+50°Cで30分焼付けた塗膜を、アセトンとメタノ
ールとの混合溶剤(重量比でl/l)中に60°Cで5
時間浸漬し、浸漬前後の重量減少量を浸漬前の塗膜重量
で割り、l OO@L、た値を硬化塗膜のゲル分率とし
、95%以上を○、90%以上95%未満を△、90%
未満を×とする。(2) Curability of coating film: The coating film baked at +50°C for 30 minutes was cured at 60°C in a mixed solvent of acetone and methanol (l/l by weight).
The weight loss before and after dipping is divided by the weight of the coating film before dipping, and the resulting value is taken as the gel fraction of the cured coating film. △, 90%
Less than is marked as ×.
(3)平滑性:
目視評価により、良好なものを○、それに対し「しわ状
の細かい凹凸」等により平滑性が損なわれている塗膜を
×とする。(3) Smoothness: Based on visual evaluation, a good coating film is marked as ○, whereas a coating film whose smoothness is impaired due to "fine wrinkle-like irregularities" or the like is marked as poor.
(4) 耐衝撃性(デュポン式):
試験板を温度20:I:l’0%湿度75±2%の恒温
恒湿に24時間装いたのち、デュポン衝撃試験器に規定
の大きさの受台と撃心を取り付け、試験板の塗面を上向
きにして、その間に挟み次に規定のおもりと規定の高さ
から撃心の上に落し、塗膜の衝撃によるワレ、ハガレが
認められないときを○、少し認められるものを△、著し
いものをXとし Iこ 。(4) Impact resistance (Dupont method): After placing the test plate in a constant temperature and humidity environment for 24 hours at a temperature of 20:I:0% and humidity of 75±2%, a test plate of the specified size was placed in a DuPont impact tester. Attach the stand and the impact center, place the test plate between them with the painted surface facing upward, and then drop a specified weight onto the impact center from the specified height. No cracking or peeling of the paint film due to impact is observed. The time is ○, the one that is slightly noticeable is △, and the one that is noticeable is X.
(5) 耐ツルトスプレー性:
JIS Z2871に従って試験し、カット(線状切
さず)部からのクリープ出片側2.Omm以内及びカッ
ト部以外の塗膜の7タレが8F(ASTM)以下のとき
合格とする。合格を○、不合格を×とする。(5) Spray resistance: Tested in accordance with JIS Z2871, and the creep from the cut (not linearly cut) portion was measured on the side 2. It is considered to be passed when the 7 sag of the coating film other than the cut part is within 0 mm and 8F (ASTM) or less. Passing the test is marked with ○, and failing is marked with ×.
結果 結果を下記の表にまとめて示す。result The results are summarized in the table below.
Claims (5)
ン電着塗料。(1) A cationic electrodeposition paint characterized by containing lead maleate.
脂とエポキシ硬化剤とを主成分とする請求項(1)記載
のカチオン電着塗料。(2) The cationic electrodeposition paint according to claim (1), which contains as main components a base resin having a primary hydroxyl group and a cationic group and an epoxy curing agent.
樹脂である請求項(2)記載のカチオン電着塗料。(3) The cationic electrodeposition paint according to claim (2), wherein the curing agent is an epoxy resin containing 2 to 30 repeating units represented by the following formula ▲ Numerical formula, chemical formula, table, etc. ▼ (I).
00〜200,000の重合体である請求項(2)記載
のカチオン電着塗料。(4) The curing agent has the following formula ▲ Numerical formula, chemical formula, table, etc. ▼ (II) In the formula, R is a hydrogen atom or a methyl group, and has a number average molecular weight of 3.0
The cationic electrodeposition paint according to claim 2, which is a polymer having a molecular weight of 00 to 200,000.
て0.5〜10重量%含有することを特徴とする請求項
(1)記載のカチオン電着塗料。(5) The cationic electrodeposition paint according to claim (1), characterized in that lead maleate is contained as metallic lead in an amount of 0.5 to 10% by weight based on the resin solid content.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32264389A JPH03185079A (en) | 1989-12-14 | 1989-12-14 | Cationic electrodepositing paint |
DE90103243T DE69002476T2 (en) | 1989-02-21 | 1990-02-20 | Cationic electrodepositable paint. |
EP90103243A EP0384398B1 (en) | 1989-02-21 | 1990-02-20 | Cationically electrodepositable paint composition |
CA002010394A CA2010394A1 (en) | 1989-02-21 | 1990-02-20 | Cationically electrodepositable paint composition |
US07/481,567 US5096984A (en) | 1989-02-21 | 1990-02-20 | Cationic and hydroxyl group-containing resin with alicyclic epoxy resin |
ES90103243T ES2058629T3 (en) | 1989-02-21 | 1990-02-20 | PAINTING COMPOSITION CATIONALLY ELECTRODEPOSABLE. |
US07/780,835 US5189119A (en) | 1989-02-21 | 1991-10-21 | Article coated with cationic and hydroxyl group-containing resin and epoxy resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32264389A JPH03185079A (en) | 1989-12-14 | 1989-12-14 | Cationic electrodepositing paint |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03185079A true JPH03185079A (en) | 1991-08-13 |
Family
ID=18145994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32264389A Pending JPH03185079A (en) | 1989-02-21 | 1989-12-14 | Cationic electrodepositing paint |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03185079A (en) |
-
1989
- 1989-12-14 JP JP32264389A patent/JPH03185079A/en active Pending
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