JPH0318494A - Laser processing head - Google Patents
Laser processing headInfo
- Publication number
- JPH0318494A JPH0318494A JP1150894A JP15089489A JPH0318494A JP H0318494 A JPH0318494 A JP H0318494A JP 1150894 A JP1150894 A JP 1150894A JP 15089489 A JP15089489 A JP 15089489A JP H0318494 A JPH0318494 A JP H0318494A
- Authority
- JP
- Japan
- Prior art keywords
- optical axis
- mirror
- laser beam
- light
- processing head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 38
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 238000003466 welding Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はレーザの保有エネルギにより溶接,熱処理等を
行う場合に使用されるレーザ加工ヘッドに関し、更に詳
述すれば、被加工物上での照射位置を直線上に走査する
ことを可能とする光走査機構を内蔵するレーザ加工ヘッ
ドに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laser processing head used for welding, heat treatment, etc. using the energy possessed by a laser. The present invention relates to a laser processing head that includes a built-in optical scanning mechanism that enables linear scanning of an irradiation position.
レーザ加工ヘッドは、レーザ発振器からその内部に導入
されるレーザ光を集光して外部に出射するものであり、
レーザが保有する光エネルギを利用する溶接.熱処理等
の各種の加工を行う際に用いられる。The laser processing head focuses the laser light introduced into it from the laser oscillator and emits it to the outside.
Welding that uses the optical energy possessed by a laser. Used when performing various processing such as heat treatment.
例えば、レーザによる溶接は、被溶接物上に所定の間隔
を隔てて対向せしめたレーザ加工ヘッドを所定の溶接線
に沿って移動させ、該溶接線近傍に集光されるレーザ光
のエネルギにより被溶接物を加熱,?8融せしめて行わ
れる。この溶接は、レーザ光の照射が極めて局所的に行
われるために、高精度な溶接が可能となる反面、熔融部
からの気泡の放出が阻害され、また溶融部が急冷される
難点があり、溶接の結果として現出する溶接ビードに、
前記気泡の残存に伴う空洞(ポロシティ)及び前記急冷
に伴う割れ等、溶接欠陥が発生する虞がある。そこで従
来から、被溶接物上におけるレ一ザ光の照射位置を前記
溶接線と略直交する方向に往復走査させ得る光走査機構
を内蔵してなり、溶融部の掻き混ぜにより気泡の放出を
促進し、ビード内でのボロシティの発生を未然に防止す
ると共に、溶接線近傍に所定幅の溶融部を生ぜしめ、該
溶融部の徐冷を行わせて前記割れの発生を防止する構戒
としたレーザ加工ヘッドが従来から実用化されている。For example, in laser welding, a laser processing head that faces the workpiece at a predetermined distance is moved along a predetermined welding line, and the area near the welding line is exposed to the energy of the laser beam. Heating the welded object? 8. It is done by melting. In this welding, the laser beam is irradiated extremely locally, so while it is possible to perform highly precise welding, it has the disadvantage that the release of bubbles from the molten part is inhibited and the molten part is rapidly cooled. In the weld bead that appears as a result of welding,
There is a possibility that welding defects such as cavities (porosity) caused by the remaining air bubbles and cracks caused by the rapid cooling may occur. Therefore, conventionally, a built-in optical scanning mechanism that can reciprocate the irradiation position of the laser beam on the workpiece in a direction substantially perpendicular to the welding line is built in, which promotes the release of air bubbles by stirring the molten part. In addition to preventing the occurrence of volocity within the bead, a fusion zone of a predetermined width is generated near the weld line, and the fusion zone is slowly cooled to prevent the occurrence of cracks. Laser processing heads have been put into practical use for some time.
なお、前記熱処理の際にもまた、所定の幅を有する熱処
理部を連続的に生せしめるために好便なものとして、前
述の如き光走査機構を内蔵するレーザ加工ヘッドが用い
られている。Also during the heat treatment, a laser processing head having a built-in optical scanning mechanism as described above is conveniently used to continuously produce a heat treatment portion having a predetermined width.
第2図は光走査機構を内蔵する従来のレーザ加工ヘッド
の構或を示す模式的斜視図である。FIG. 2 is a schematic perspective view showing the structure of a conventional laser processing head incorporating an optical scanning mechanism.
図示しないレーザ発振器にて発振されたレーザ光1は、
適宜の光学系を経てレーザ加工ヘッド内に導入され、集
光レンズ5にて集光される。従来の光走査機構6は、集
光レンズ5の下流側にレーザ光1の光軸に対して所定の
傾きを有して固設された第1の反射鏡61と、これによ
る反射光の光軸に対し所定傾きを有して配設された第2
の反射鏡62と、該反射鏡62を前記反射光の光軸廻り
に微小な角度範囲内にて高速揺動させる駆動手段63と
を備えてなる。而してレーザ光1は、集光レンズ5を通
過した後、ビーム径を縮小しつつ第1の反射鏡61に達
し、該反射鏡61にて第2の反射鏡62に向けて反射さ
れ、次いで第2の反射鏡62にて導入光と略同方向に反
射されて外部に出射され、図示しない被加工物表面上の
所定のスポッ}S上に集光する。このとき第2の反射鏡
62は、駆動千段63の動作により揺動しており、この
揺動に伴って、第2の反射鏡62による反射方向が微小
な角度範囲内にて変化するため、前記スポッ}Sは、前
記揺動角度に相当する微小幅内にて略直線的に往復走査
される。Laser light 1 oscillated by a laser oscillator (not shown) is
The light is introduced into the laser processing head through a suitable optical system, and is focused by the condenser lens 5. The conventional optical scanning mechanism 6 includes a first reflecting mirror 61 fixedly installed downstream of a condensing lens 5 at a predetermined inclination with respect to the optical axis of the laser beam 1, and a light beam reflected by the first reflecting mirror 61. A second plate arranged at a predetermined inclination with respect to the axis.
and a driving means 63 for swinging the reflecting mirror 62 at high speed within a small angular range around the optical axis of the reflected light. After passing through the condensing lens 5, the laser beam 1 reaches the first reflecting mirror 61 while reducing the beam diameter, and is reflected by the reflecting mirror 61 toward the second reflecting mirror 62. Next, the light is reflected by the second reflecting mirror 62 in substantially the same direction as the introduced light, is emitted to the outside, and is focused on a predetermined spot S on the surface of the workpiece (not shown). At this time, the second reflecting mirror 62 is oscillating due to the operation of the drive stage 63, and with this oscillation, the direction of reflection by the second reflecting mirror 62 changes within a small angular range. , the spot}S is reciprocated approximately linearly within a minute width corresponding to the swing angle.
さてレーザ加工ヘッドは、被加工物上を移動せしめられ
つつレーザ照射を行うため、全体形状の小型,軽量化が
切望されるが、光走査を可能とする従来のレーザ加工ヘ
ッドにおいては、レーザ光1を集光するための集光レン
ズ5、並びに、光走査を実現するための第1,第2の反
射鏡6L62及び駆動手段63を、相互に所定の位置関
係を保った状態にて配置する必要があるために、小型,
軽量化の要求に十分に応えることができないという問題
があった。Since laser processing heads perform laser irradiation while moving over the workpiece, there is a strong need for a smaller and lighter overall shape, but in conventional laser processing heads that are capable of optical scanning, the laser beam A condensing lens 5 for condensing light, a first and second reflecting mirror 6L62 for realizing optical scanning, and a driving means 63 are arranged so as to maintain a predetermined positional relationship with each other. Small size, as needed
There was a problem in that it could not fully meet the demand for weight reduction.
また、従来のレーザ加工ヘッド内部に導入されたレーザ
光lは、外部に出射されるまでの間、少なくとも、集光
レンズ5の透過に伴う伝送ロス、及び第1,第2の反射
鏡61.62での反射に伴う伝送ロスを受けることにな
り、全体的な伝送ロスの低減に限界があり、加工に用い
得る光エネルギの低下を招来するという難点があった。Further, the laser beam l introduced into the conventional laser processing head suffers at least a transmission loss due to transmission through the condenser lens 5 and the first and second reflecting mirrors 61 . There is a problem that there is a transmission loss due to reflection at 62, and there is a limit to the reduction of the overall transmission loss, resulting in a reduction in the optical energy that can be used for processing.
本発明は斯かる事情に鑑みてなされたものであり、小型
,軽量化と、内部における伝送ロスの低減とを実現する
光走査可能なレーザ加工ヘッドを提供することを目的と
する。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a laser processing head capable of optical scanning, which is compact and lightweight, and reduces internal transmission loss.
本発明に係るレーザ加工ヘッドは、内部に導入されるレ
ーザ光の光軸上に、この光軸迫りの揺動又はこの光軸に
沿っての往復動を行う放物面鏡を設けたものである。The laser processing head according to the present invention is provided with a parabolic mirror that swings close to the optical axis or reciprocates along the optical axis on the optical axis of the laser beam introduced into the head. be.
本発明においては、レーザ加工ヘッド内部に導入される
レーザ光を、放物面鏡での反射により集光すると共に、
該放物面鏡の揺動又は往復動により反射方向を変えて外
部に出射し、被加工物上に、所定幅内にて往復走査され
る微小スポソトを生せしめる。In the present invention, the laser beam introduced into the laser processing head is focused by reflection on a parabolic mirror, and
By swinging or reciprocating the parabolic mirror, the reflection direction is changed and the light is emitted to the outside, producing a minute spot on the workpiece that is reciprocated within a predetermined width.
以下本発明をその実施例を示す図面に基づいて詳述する
。第1図は本発明に係るレーザ加工ヘソドの模式的縦断
面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on drawings showing embodiments thereof. FIG. 1 is a schematic vertical cross-sectional view of a laser processing head according to the present invention.
図中1は、図示しないレーザ発振器にて発振されたレー
ザ光であり、該レーザ光1は、適宜の光学系を経てレー
ザ加工ヘソドの内部に導入される。In the figure, reference numeral 1 indicates a laser beam oscillated by a laser oscillator (not shown), and the laser beam 1 is introduced into the interior of the laser processing head via an appropriate optical system.
本発明に係るレーザ加工ヘッドは、このように導入され
るレーザ光1の光軸上に、該光軸に対して所定の傾きを
有して固設された反射鏡2と、該反射鏡2による反射光
の光軸上に位置し、該光軸を中心としての回動自在に枢
支された放物面鏡3と、該放物面鏡3を所定の角度範囲
内にて揺動せしめるべく駆動する駆動千段4とを備えて
なる。駆動手段4は、例えば、駆動源となるモータ40
の回転軸端に嵌着された小歯車41を放物面鏡3の軸心
位置に嵌着された大歯車42に噛合せしめてなり、前記
モータ40を短周期にて正逆転させることにより、小歯
車41及び大歯車42を介してこの回転を伝達される放
物面鏡3が、所定の角度範囲にて揺動ずるように構威さ
れている。なお、放物面鏡3の}2動角度は微小な角度
であるから、前記小歯車4l及び大歯車42は、全周に
亘って歯を有する図示の如き全歯車である必要はな<、
描動角度に相当する部分にのみ歯を形或してなる部分歯
車であってもよい。また、前記モータ40に換えて、他
の電気的アクチュエー夕、例えば、ソレノイドを駆動源
として用いることもでき、この場合、ランク・ピニオン
等の運動変換機構により、前記ソレノイドの進退動作を
放物面鏡3の揺動に変換する構或とすればよい。The laser processing head according to the present invention includes a reflecting mirror 2 fixed on the optical axis of the laser beam 1 introduced in this way and having a predetermined inclination with respect to the optical axis, and the reflecting mirror 2. A parabolic mirror 3 is located on the optical axis of the reflected light and is rotatably supported around the optical axis, and the parabolic mirror 3 is swung within a predetermined angular range. 1,000 drive stages 4 to be driven as desired. The driving means 4 is, for example, a motor 40 serving as a driving source.
A small gear 41 fitted to the end of the rotating shaft is meshed with a large gear 42 fitted to the axial center position of the parabolic mirror 3, and by rotating the motor 40 forward and backward in short cycles, The parabolic mirror 3, to which this rotation is transmitted via the small gear 41 and the large gear 42, is configured to swing within a predetermined angular range. It should be noted that since the }2 motion angle of the parabolic mirror 3 is a minute angle, the small gear 4l and the large gear 42 do not need to be full gears as shown in the figure, which have teeth over the entire circumference.
It may also be a partial gear in which teeth are formed only in the portion corresponding to the drawing angle. Further, instead of the motor 40, another electric actuator, for example, a solenoid, can be used as the drive source. In this case, a movement conversion mechanism such as a rank and pinion is used to change the forward and backward movement of the solenoid into a parabolic shape. It is sufficient to adopt a structure in which the movement is converted into the rocking motion of the mirror 3.
以上の如く構或された本発明に係るレーザ加工ヘッドに
おいては、前述の如く導入されるレーザ光1は、反射鏡
2にて反射され、略直角に方向転換して放物面鏡3に達
し、該放物面鏡3にて反打−され、再度、略直角に方向
転換して前記導入の方向と略同方向に出射せしめられる
。放物面鏡3は、光の反射機能と共,に、反射光の集光
機能をも有するから、前記出射光は、ビーム径を縮小し
つつ進行し、出射端に対向し・て配された図示しない被
加工物表面上の所定のスポソ+−S上に集光する。この
とき放物面鏡3は、駆動手段4の前述した如き動作によ
り揺動しており、この揺動に伴って放物面鏡3による反
射方向が微小な角度範囲にて変化するため、前記スポッ
トSは、図中に矢符にて示す如く、放物面鏡3の揺動角
度に相当する微小幅内にて略直線的に往復走査される。In the laser processing head according to the present invention constructed as described above, the laser beam 1 introduced as described above is reflected by the reflecting mirror 2, changes direction approximately at right angles, and reaches the parabolic mirror 3. , the light is counterattacked by the parabolic mirror 3, and the direction is changed again at a substantially right angle, and the light is emitted in substantially the same direction as the direction of introduction. Since the parabolic mirror 3 has a light reflecting function and a reflected light condensing function, the emitted light travels while reducing the beam diameter and is arranged opposite to the emitting end. The light is focused on a predetermined spot +-S on the surface of the workpiece (not shown). At this time, the parabolic mirror 3 is oscillated by the above-described operation of the driving means 4, and the direction of reflection by the parabolic mirror 3 changes in a small angular range due to this oscillation. The spot S is reciprocated approximately linearly within a minute width corresponding to the swing angle of the parabolic mirror 3, as shown by arrows in the figure.
即ち、本発明に係るレーザ加工ヘソドにおいては、駆動
手段4の動作により揺動する放物面鏡3が、レーザ光1
の集光機能を果たしつつ、該レーザ光1を被加工物上に
て直線走査せしめる作用をなし、第2図に示す従来のレ
ーヂ加工ヘッドにおける集光レンズ5及び第2の反射鏡
62の機能を同時的に果たす。従って、レーザ光lを被
加工物上の微小なスポットSに照射することと、該スポ
ットSを直線状に走査せしめることとが、2個の光学要
素、即ち、反射鏡2と放物面鏡3とにて実現され、要素
の減少により、小型,軽量化が実現される上、内部にお
けるレーザ光lの伝送ロスが低減されることは明らかで
ある。That is, in the laser processing hesode according to the present invention, the parabolic mirror 3, which is oscillated by the operation of the driving means 4, receives the laser beam 1.
The functions of the condensing lens 5 and the second reflecting mirror 62 in the conventional laser processing head shown in FIG. simultaneously. Therefore, irradiating the laser beam l onto a minute spot S on the workpiece and scanning the spot S in a straight line are performed using two optical elements, namely the reflecting mirror 2 and the parabolic mirror. It is clear that by reducing the number of elements, it is possible to realize a smaller size and lighter weight, and also to reduce the transmission loss of the laser beam l inside.
なお本実施例においては、放物面鏡3を揺動させる場合
について述べたが、該放物面鏡3をこれへの入射光の光
軸方向、即ち、第l図における左右方向に、高速度にて
往復動せしめることによっても光走査を行わせることは
可能である。但しこの場合の光走査の方向は、放物面鏡
3を揺動させる場合のそれと、被加工物の表面上におい
て直交する方向となる。In this embodiment, a case has been described in which the parabolic mirror 3 is swung; It is also possible to perform optical scanning by reciprocating at a high speed. However, the direction of light scanning in this case is perpendicular to that in the case of swinging the parabolic mirror 3 on the surface of the workpiece.
以上詳述した如く本発明に係るレーザ加工へソドにおい
ては、内部に導入されるレーザ光は、これの光軸上に配
された放物面鏡での反射により集光されると共に、この
放物面鏡の前記光軸廻りの揺動又は該光軸に沿っての往
復動により走査されるから、集光及び光走査に要する光
学要素の数が少なく、これらの配設位置の確保が容易と
なり、小型,軽量化が実現されると共に、内部における
レーザ光の伝送ロスが低減し、加工に用い得る光エネル
ギの低下を最小限に抑え得る等、本発明は優れた効果を
奏する。As described in detail above, in the laser processing chamber according to the present invention, the laser beam introduced into the interior is focused by reflection on the parabolic mirror arranged on the optical axis of the laser beam, and this radiation Since scanning is performed by swinging the object mirror around the optical axis or reciprocating along the optical axis, the number of optical elements required for focusing and scanning the light is small, and it is easy to secure their placement positions. Therefore, the present invention has excellent effects, such as realizing a smaller size and lighter weight, reducing internal transmission loss of laser light, and minimizing a decrease in optical energy that can be used for processing.
第1図は本発明に係るレーザ加工ヘッドの模式的縦断面
図、第2図は従来のレーザ加工ヘッドの構或を示す模式
的斜視図である。
1・・・レーザ光 3・・・放物面鏡 4・・・駆
動手段
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a schematic vertical sectional view of a laser processing head according to the present invention, and FIG. 2 is a schematic perspective view showing the structure of a conventional laser processing head. DESCRIPTION OF SYMBOLS 1... Laser light 3... Parabolic mirror 4... Driving means Note that in the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
照射するに際し、該被加工物上の照射位置を直線状に走
査せしめる光走査機構を内蔵するレーザ加工ヘッドにお
いて、 前記光走査機構は、 前記レーザ光の光軸上に、該光軸廻りの揺動又は該光軸
に沿っての往復動自在に配設された放物面鏡と、 該放物面鏡を、前記揺動又は前記往復動せしめるべく駆
動する駆動手段と を具備することを特徴とするレーザ加工ヘッド。(1) A laser processing head that includes a built-in optical scanning mechanism that linearly scans the irradiation position on the workpiece when condensing the laser light introduced into the workpiece and irradiating the workpiece, The scanning mechanism includes: a parabolic mirror disposed on the optical axis of the laser beam so as to be able to swing around the optical axis or reciprocate along the optical axis; A laser processing head characterized by comprising: a driving means for driving to swing or reciprocate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1150894A JPH0318494A (en) | 1989-06-13 | 1989-06-13 | Laser processing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1150894A JPH0318494A (en) | 1989-06-13 | 1989-06-13 | Laser processing head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0318494A true JPH0318494A (en) | 1991-01-28 |
Family
ID=15506704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1150894A Pending JPH0318494A (en) | 1989-06-13 | 1989-06-13 | Laser processing head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0318494A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0498385U (en) * | 1991-01-28 | 1992-08-25 | ||
JPH079176A (en) * | 1993-06-23 | 1995-01-13 | Sanyo Mach Works Ltd | Laser machining method and laser machining head |
US7560659B2 (en) * | 2004-05-28 | 2009-07-14 | Comau, S.P.A. | Robot-aided remote laser welding with simplified control of focusing direction of laser beam |
JP2010508149A (en) * | 2006-10-30 | 2010-03-18 | オルセン,フレミング・オベ・エルホルム | Laser processing method and system |
-
1989
- 1989-06-13 JP JP1150894A patent/JPH0318494A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0498385U (en) * | 1991-01-28 | 1992-08-25 | ||
JPH079176A (en) * | 1993-06-23 | 1995-01-13 | Sanyo Mach Works Ltd | Laser machining method and laser machining head |
US7560659B2 (en) * | 2004-05-28 | 2009-07-14 | Comau, S.P.A. | Robot-aided remote laser welding with simplified control of focusing direction of laser beam |
US8148662B2 (en) | 2004-05-28 | 2012-04-03 | Comau S.P.A. | Method and device for robot-aided remote laser welding with simplified control of focusing direction of laser beam |
EP1600244B2 (en) † | 2004-05-28 | 2018-04-11 | COMAU S.p.A. | Method and device for robot-aided remote laser welding, with simplified control of focusing direction of laser beam |
JP2010508149A (en) * | 2006-10-30 | 2010-03-18 | オルセン,フレミング・オベ・エルホルム | Laser processing method and system |
US9044824B2 (en) | 2006-10-30 | 2015-06-02 | Flemming Ove Olsen | Method and system for laser processing |
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