JPH03184287A - Heating device - Google Patents
Heating deviceInfo
- Publication number
- JPH03184287A JPH03184287A JP32137389A JP32137389A JPH03184287A JP H03184287 A JPH03184287 A JP H03184287A JP 32137389 A JP32137389 A JP 32137389A JP 32137389 A JP32137389 A JP 32137389A JP H03184287 A JPH03184287 A JP H03184287A
- Authority
- JP
- Japan
- Prior art keywords
- ellipse
- reflection surface
- light source
- rod
- light beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims description 17
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Control Of Resistance Heating (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は加熱装置、特に電子部品のハンダ付けに好適
な加熱装置に関する。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a heating device, and particularly to a heating device suitable for soldering electronic components.
〈従来の技術〉
従来のハンダ付は用の加熱装置を第５図及び第６図に基
づいて説明する（特開昭６３−９８６号公報参照）。■
が左右一対の反射ミラーで、内側断面形状が所定サイズ
の楕円０１に合致する半楕円柱形状であって、その頂点
Ａ付近に切欠部２を形成した如き形状を呈している。つ
まり、図面上皮れないがこの同一断面形状のまま所定の
長さサイズを備えた立体形状となっている。従って、こ
の反射ミラーｌの内側には、半楕円柱形面状の反射面３
が形成されることとなる。そして、この反射面３が合致
する楕円０１の第１焦点ｆ、には棒状光源４としてのハ
ロゲンランプが反射ミラーｌと平行な長手方向に沿って
設置されている。この棒状光源４から発せられた光ビー
ムＬは反射面３にて反射された後、第２焦点ｒ２近辺に
集光する。<Prior Art> A conventional heating device for soldering will be explained based on FIGS. 5 and 6 (see Japanese Patent Laid-Open No. 63-986). ■
are a pair of left and right reflecting mirrors, each of which has a semi-elliptic cylinder shape whose inner cross-sectional shape matches an ellipse 01 of a predetermined size, and which has a notch 2 formed near its apex A. In other words, although it is not shown in the drawing, it has a three-dimensional shape with a predetermined length and size while maintaining the same cross-sectional shape. Therefore, inside this reflecting mirror l, there is a semi-elliptic cylindrical reflecting surface 3.
will be formed. At the first focal point f of the ellipse 01 where the reflecting surface 3 coincides, a halogen lamp serving as a rod-shaped light source 4 is installed along the longitudinal direction parallel to the reflecting mirror l. The light beam L emitted from this rod-shaped light source 4 is reflected by the reflecting surface 3 and then condensed near the second focal point r2.
〈発明が解決しようとする課題〉
本来ならば、この第２焦点ｆ２の一点に完全に集光する
訳であるが、棒状光源４自体が一定の幅（太さ）を有し
ているために、集光された光ビームＬは棒状光源４に平
行な一定幅りの帯状の照射エリア１７となる。つまり、
反射面３の棒状光源４から遠い部分（例えばｂ −ｃの
範囲）で反射された光ビームＬ１は反射による倍率が低
いために、第２焦点ｆ２に幅ｄ′である棒状光源４の像
を結ひ、棒状光源４に近い頂点Ａ寄りの部分（例えばａ
−ｂの範囲）で反射された光ビームＬ２は反射による
倍率が高いために、第２焦点ｆ２に幅りである棒状光源
４の像を結び、この光ビームＬ２に係る像の幅りが光ビ
ームＬの全体的な幅となる。<Problem to be solved by the invention> Originally, the light would be completely focused on one point of this second focal point f2, but since the rod-shaped light source 4 itself has a certain width (thickness), The condensed light beam L becomes a belt-shaped irradiation area 17 with a constant width parallel to the rod-shaped light source 4. In other words,
Since the light beam L1 reflected at the part of the reflecting surface 3 far from the rod-shaped light source 4 (for example, in the range b-c) has a low magnification due to reflection, an image of the rod-shaped light source 4 having a width of d' is formed at the second focal point f2. The part near the apex A near the rod-shaped light source 4 (for example, a
Since the light beam L2 reflected in the range (range -b) has a high magnification due to reflection, it forms an image of the rod-shaped light source 4 with a width at the second focal point f2, and the width of the image related to this light beam L2 is the light beam L2. This is the overall width of the beam L.
このように第２焦点ｆ２位置に得られる帯状の照射エリ
ア１７の幅りがどうしても広くなりがちで、この照射エ
リア１７にてフラットパックＩＣ５のリードピン６の列
をハンダ７にて基板８に接合しようとしても、熱に弱い
ＩＣ部分９や或いは隣のリードピン−１０に光ビームＬ
が当たってしまうため、良好なハンダ処理を行いづらか
った。In this way, the width of the band-shaped irradiation area 17 obtained at the second focal point f2 position tends to become wide, and in this irradiation area 17, the row of lead pins 6 of the flat pack IC 5 will be bonded to the substrate 8 with the solder 7. However, the light beam L may be applied to the heat-sensitive IC part 9 or the adjacent lead pin 10.
This made it difficult to perform a good soldering process.
この発明はこのような従来の技術に着目してなされたも
のであり、従来よりも幅が狭い帯状の照射エリアを得る
ことができる加熱装置を提供せんとするものである。The present invention has been made by paying attention to such conventional techniques, and aims to provide a heating device that can obtain a strip-shaped irradiation area narrower than the conventional technique.
く課題を解決するための手段〉
上記の目的を達成するために、この発明に係る加熱装置
の反射面は、断面形状が所定サイズの楕円に合致する曲
率の半楕円柱形面であって、その頂点寄り部分が切欠部
となっている第１反射面と、断面形状が前記第１反射面
の楕円と同心で且つサイズ大なる楕円に合致する曲率の
部分楕円柱形面であって、前記切欠部の対応位置にある
第２反射面とから成り、前記棒状光源は前記第１反射面
が合致する楕円の第１焦点に位置している。Means for Solving the Problems> In order to achieve the above object, the reflective surface of the heating device according to the present invention is a semi-elliptic cylindrical surface whose cross-sectional shape has a curvature that matches an ellipse of a predetermined size, a first reflecting surface whose portion near the apex is a notch; and a partially elliptical cylindrical surface whose cross-sectional shape is concentric with the ellipse of the first reflecting surface and has a curvature matching the ellipse which is larger in size, and a second reflecting surface located at a position corresponding to the notch, and the rod-shaped light source is located at the first focal point of the ellipse where the first reflecting surface coincides.
く作 用〉
棒状光源からの光ビームを高倍率で反射する反射面の頂
点寄り部分を切欠部として無くして第１反射面とし、そ
の切欠部の対応位置に第２反射面を配したので、この第
２反射面における反射倍率は下がり、この部分で反射さ
れた光ビームは外側へ広がらず、帯状照射エリアの幅が
狭くなる。Function> The part near the apex of the reflecting surface that reflects the light beam from the rod-shaped light source at high magnification is removed as a notch and becomes the first reflecting surface, and the second reflecting surface is placed at the corresponding position of the notch. The reflection magnification on this second reflective surface decreases, the light beam reflected at this portion does not spread outward, and the width of the belt-shaped irradiation area becomes narrower.
〈実 施 例〉
以下この発明の好適な一実施例を第１図〜第４図に基づ
いて説明する。尚、従来と共通する部分には同一の符号
を付し、重複する説明は省略する。<Embodiment> A preferred embodiment of the present invention will be described below with reference to FIGS. 1 to 4. Incidentally, the same reference numerals are given to the parts common to the conventional one, and redundant explanation will be omitted.
この実施例に係る反射ミラーＩＩは、楕円Ｏに合致する
曲率の半楕円柱面で、その頂点Ａより部分を大きな切欠
部１９とした第１反射面１２を備えた一対の第１反射ミ
ラー１３と、前記楕円Ｏと同心で且つ該楕円０１よりも
サイズ大なる楕円０２に合致する曲率の部分楕円柱面で
あって、前記切欠部１９の対応位置にある第２反射面１
４を備えた第２反射ミラー１５と、から成っている。The reflecting mirror II according to this embodiment is a pair of first reflecting mirrors 13 having a first reflecting surface 12 which is a semi-elliptic cylindrical surface with a curvature matching an ellipse O, and has a large notch 19 at a portion from the apex A of the first reflecting surface 12. and a second reflective surface 1 that is concentric with the ellipse O and has a curvature that matches an ellipse 02 that is larger in size than the ellipse 01, and that is located at a position corresponding to the notch 19.
4 and a second reflecting mirror 15.
棒状の光源４は第１反射面１２が合致する楕円Ｏの第１
焦点ｆ１に設置されている。また、第２反射面１４の頂
点Ａ′部分は幅の狭い切欠部１６となっている。この部
分を切欠部１６としたのは、この部分で反射された光ビ
ームが棒状光源４自体にはね返ってきて、この棒状光源
４自身に熱負荷を加えてしまうからである。The rod-shaped light source 4 is located at the first ellipse O with which the first reflecting surface 12 coincides.
It is installed at the focal point f1. Further, the apex A' portion of the second reflective surface 14 forms a narrow notch 16. The reason why this portion is made into the cutout portion 16 is that the light beam reflected at this portion bounces back onto the rod-shaped light source 4 itself, thereby adding a thermal load to the rod-shaped light source 4 itself.
そして、棒状光源４から発せられた光ビームＬのうち、
第１反射面１２にて反射された光ビームＬ、は、棒状光
源４から第１反射面１２までの距離が長いために、従来
通り反射倍率が低く、第２焦点ｆ２に幅ｄ′である棒状
光源４の像を結ぶ。Of the light beam L emitted from the rod-shaped light source 4,
Since the distance from the rod-shaped light source 4 to the first reflective surface 12 is long, the light beam L reflected at the first reflective surface 12 has a low reflection magnification as before, and has a width d' at the second focal point f2. An image of the bar-shaped light source 4 is formed.
また、第２反射面１４にて反射された光ビームＬ２は、
棒状光源４から第２反射面１４までの距離が長くなった
ため、それに応じて反射倍率が下がり、先の第１反射面
１２で反射された光ビームＬのすぐ外側の接近位置に光
ビームＬ、を包み込む状態で幅ｄである棒状光源４の像
を結ぶ。従って、前記第１反射面１２及び第２反射面１
４にて反射されて集光された光ビームＬ（Ｌ、、Ｌ２）
は狭い幅（この実施例では２〜３ｍｍ）ｄの帯状の照射
エリア１７となる。この実施例における光ビームＬをエ
ネルギー（集光密度）の面から従来例と比べると、第４
図から明らかなように、本発明の光ビームＬの方が従来
よりも第２焦点ｆ２に集中しているのがわかる。Furthermore, the light beam L2 reflected by the second reflecting surface 14 is
Since the distance from the rod-shaped light source 4 to the second reflective surface 14 has become longer, the reflection magnification has decreased accordingly, and the light beam L is brought to an approach position just outside of the light beam L reflected by the first reflective surface 12. An image of the rod-shaped light source 4 having a width of d is formed in a state of enveloping the . Therefore, the first reflective surface 12 and the second reflective surface 1
The light beam L (L,, L2) reflected and focused at 4
becomes a strip-shaped irradiation area 17 with a narrow width (2 to 3 mm in this embodiment) d. Comparing the light beam L in this embodiment with that of the conventional example in terms of energy (concentration density), it is found that the fourth
As is clear from the figure, the light beam L of the present invention is more concentrated at the second focal point f2 than the conventional one.
次に、上記の如き構造をした加熱装置により、フラット
パックＩＣ５のリードピン６を基板８に接合する場合の
動作を説明する。まず、棒状光源４には最初から全電圧
（１００Ｖ）をかけずに、照射エリア１７を基板８上に
おいて目で確認できる程度の小さい電圧（２０Ｖ）をか
ける。そして、照射エリア１７をリードピン６の列に位
置合わせさせた後に全電圧をかける。そうすることによ
り、第１反射面１２及び第２反射面１４にてそれぞれ反
射された光ビームＬ、 、Ｌ２の相乗作用によりリード
ピン６の下方のハンダ７が溶けて、リードピン６が基板
８に対して確実に接合されることとなる。つまり、第１
反射面１２からの光ビームＬはリードピン６めがけて狭
い幅ｄ′で照射され、これに対し第２反射面からの光ビ
ームＬ２は先の光ビームＬ１の直ぐ外側の接近位置をめ
がけて幅ｄで照射されるため、光ビームＬ１はダイレク
トにリードピン６及びハンダ７を加熱し、光ビームＬ２
は先の光ビームＬ１による加熱部分周辺の基板８等をソ
フトに加熱する。従って、溶融したハンダ７は基板８に
対する「なじみ」や「ぬれ性」が高まり、大変に良好な
ハンダ付は処理を行うことができる。しかも、このよう
に光ビームＬ、、Ｌ、による相乗的な加熱を行なえるも
のでありながら、その照射エリア１７自体の幅ｄは従来
に比べて狭いので、熱に弱いＩＣ部分９や隣接するリー
ドピンに光ビームＬが当たったりするようなことはない
。しかも、照射エリア１７の幅ｄが狭くなった分だけ光
ビームＬのエネルギーが高まるので、従来よりも短時間
（約８秒）でハンダ７を溶融させることができ、ハンダ
付は作業能率が高まる。加えて、第１ミラー１３と第２
反射ミラー１５との隙間１８から棒状光源４の出し入れ
を行なえるようになり、メンテナンス性が向上する。Next, the operation of joining the lead pins 6 of the flat pack IC 5 to the substrate 8 using the heating device having the above structure will be described. First, a small voltage (20 V) is applied to the rod-shaped light source 4 so that the irradiation area 17 can be visually confirmed on the substrate 8 without applying the full voltage (100 V) from the beginning. Then, after aligning the irradiation area 17 with the row of lead pins 6, full voltage is applied. By doing so, the solder 7 below the lead pin 6 melts due to the synergistic effect of the light beams L, , L2 reflected by the first reflecting surface 12 and the second reflecting surface 14, respectively, and the lead pin 6 touches the substrate 8. This will ensure a secure connection. In other words, the first
The light beam L from the reflective surface 12 is irradiated with a narrow width d' toward the lead pin 6, whereas the light beam L2 from the second reflective surface is irradiated with a narrow width d' toward the approach position immediately outside the previous light beam L1. Therefore, the light beam L1 directly heats the lead pin 6 and the solder 7, and the light beam L2
gently heats the substrate 8 and the like around the portion heated by the light beam L1. Therefore, the molten solder 7 has improved "fitting" and "wetting" to the substrate 8, and very good soldering can be achieved. Moreover, although the light beams L, , L can perform synergistic heating in this way, the width d of the irradiation area 17 itself is narrower than in the past, so the heat-sensitive IC part 9 and the adjacent There is no possibility that the light beam L will hit the lead pin. Furthermore, since the energy of the light beam L increases as the width d of the irradiation area 17 becomes narrower, the solder 7 can be melted in a shorter time (approximately 8 seconds) than before, increasing the work efficiency of soldering. . In addition, the first mirror 13 and the second
The rod-shaped light source 4 can be taken in and out through the gap 18 between it and the reflecting mirror 15, improving maintainability.
〈発明の効果〉
この発明に係る加熱装置は、以上説明してきた如き内容
のものであって、第２反射面が棒状光源から離れること
となるので、この部分における反射倍率が下がることと
なり、光ビームが外側へ広がらず帯状照射エリアの幅が
狭くなる。従って、基板上に電子部品等を密集状態でハ
ンダ付けしたりする場合のハンダ部位加熱用として好適
である。<Effects of the Invention> The heating device according to the present invention has the content as described above, and since the second reflecting surface is separated from the rod-shaped light source, the reflection magnification in this part is reduced, and the light is The beam does not spread outward and the width of the band-shaped irradiation area becomes narrow. Therefore, it is suitable for heating solder parts when electronic components and the like are soldered on a board in a dense manner.
また、照射エリアの幅が狭くなった分だけ光ビームのエ
ネルギーが高まるので、加熱対象部位の温度を従来より
も短時間で目標温度まで到達させることができ、ハンダ
付は作業能率が向上する。Furthermore, since the energy of the light beam increases as the width of the irradiation area becomes narrower, the temperature of the part to be heated can reach the target temperature in a shorter time than before, improving work efficiency in soldering.
加えて、第１反射面と第２反射面との間の隙間から棒状
光源の出し入れ等を行うことができるようになりメンテ
ナンス性も向上する。In addition, the rod-shaped light source can be taken in and out through the gap between the first reflective surface and the second reflective surface, improving maintainability.
第１図はこの発明の好適な一実施例を示す加熱装置の概
略側面図、
第２図は第１図に示した加熱装置の全体斜視図、第３図
は光ビームによりフラットパックＩＣのリードピンをハ
ンダ付けする状態を示す拡大側面図、
第４図は光ビームの集光密度と第２焦点位置との関係を
示す図、
第５図は従来の加熱装置を示す第１図相当の側面図、そ
して
第６図は従来の加熱装置を示す第３図相当の拡大側面図
である。
４ °°°′ 棒状光源
１１− 反射ミラー
１３ ′−第１反射面
１４− 第２反射面
１９−・・−切欠部
１７ °−照射エリア
Ａ、Ａ’−・・ 頂点
Ｌ −光ビーム
０、．０２−“′ 楕円
１１５２焦点セカ゛５／）１巨ｉｌｌ （ｍｍ）第５図FIG. 1 is a schematic side view of a heating device showing a preferred embodiment of the present invention, FIG. 2 is an overall perspective view of the heating device shown in FIG. 1, and FIG. Fig. 4 is a diagram showing the relationship between the condensation density of the light beam and the second focal point position, and Fig. 5 is a side view equivalent to Fig. 1 showing a conventional heating device. , and FIG. 6 is an enlarged side view corresponding to FIG. 3 showing a conventional heating device. 4 °°°' Bar-shaped light source 11 - Reflection mirror 13 ' - First reflective surface 14 - Second reflective surface 19 - Notch 17 ° - Irradiation area A, A' - Vertex L - Light beam 0, ．． 02-“′ Ellipse 1152 focal point 5/) 1 giant ill (mm) Fig. 5
Claims (2)
反射ミラーの反射面でもって棒状光源から発せられた光
ビームを棒状光源と平行な１本の細い帯状の照射エリア
として集光する加熱装置において、 上記反射面は、断面形状が所定サイズの楕円に合致する
曲率の半楕円柱形面であって、その頂点寄り部分が切欠
部となっている第１反射面と、断面形状が前記第１反射
面の楕円と同心で且つサイズ大なる楕円に合致する曲率
の部分楕円柱形面であって、前記切欠部の対応位置にあ
る第２反射面とから成り、 前記棒状光源は前記第１反射面が合致する楕円の第１焦
点に位置していることを特徴とする加熱装置。(1) A single bar-shaped light source is installed inside the reflecting mirror, and the light beam emitted from the bar-shaped light source is focused by the reflecting surface of the reflecting mirror into a single thin strip-shaped irradiation area parallel to the bar-shaped light source. In the heating device, the reflecting surface has a first reflecting surface whose cross-sectional shape is a semi-elliptic cylindrical surface with a curvature that matches an ellipse of a predetermined size, and whose portion near the apex is a notch; is a partially elliptical cylindrical surface that is concentric with the ellipse of the first reflecting surface and has a curvature matching the large ellipse, and a second reflecting surface located at a corresponding position of the notch, the rod-shaped light source A heating device characterized in that the first reflective surface is located at a first focal point of a matching ellipse.
項１記載の加熱装置。(2) The heating device according to claim 1, wherein the apex portion of the second reflective surface is a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321373A JPH0634377B2 (en) | 1989-12-13 | 1989-12-13 | Heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321373A JPH0634377B2 (en) | 1989-12-13 | 1989-12-13 | Heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03184287A true JPH03184287A (en) | 1991-08-12 |
| JPH0634377B2 JPH0634377B2 (en) | 1994-05-02 |
Family
ID=18131842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1321373A Expired - Lifetime JPH0634377B2 (en) | 1989-12-13 | 1989-12-13 | Heating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634377B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5592582A (en) * | 1993-03-30 | 1997-01-07 | Nauchno-Proizvodstvennya Firma "Adonia" | Beam machining device with heating lamp and segmented reflector surface |
| US5594831A (en) * | 1993-03-30 | 1997-01-14 | Nauchno-Proizvodstvennay Firma "Mgm" | Beam machining device with reflector comprised of arcs of confocal ellipses |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63986A (en) * | 1986-06-18 | 1988-01-05 | 株式会社日立製作所 | Heater |
| JPH01161692A (en) * | 1987-12-18 | 1989-06-26 | Japan Ranpu Kk | Lamp heat source device |
-
1989
- 1989-12-13 JP JP1321373A patent/JPH0634377B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63986A (en) * | 1986-06-18 | 1988-01-05 | 株式会社日立製作所 | Heater |
| JPH01161692A (en) * | 1987-12-18 | 1989-06-26 | Japan Ranpu Kk | Lamp heat source device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5592582A (en) * | 1993-03-30 | 1997-01-07 | Nauchno-Proizvodstvennya Firma "Adonia" | Beam machining device with heating lamp and segmented reflector surface |
| US5594831A (en) * | 1993-03-30 | 1997-01-14 | Nauchno-Proizvodstvennay Firma "Mgm" | Beam machining device with reflector comprised of arcs of confocal ellipses |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0634377B2 (en) | 1994-05-02 |
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