JPH0318412Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a conveying device for a lead frame encapsulating a semiconductor element.

[Conventional technology]

6 to 8 relate to a conventional conveying device for a lead frame encapsulating a semiconductor element, in which FIG. 6 is an overall perspective view, FIG. 7 is a side view, and FIG. 8 is a front view.

In the figure, 1 is a lead frame, and 2 is a semiconductor element encapsulation body. In this figure, an IC is taken as an example. 3
a and 3b are grooved rails that guide the lead frame 1; 4 are grooved rails 3a and 3b that guide the lead frame;
The claw 5, which is fed from the rear end along
D) is a connecting bar that conveys. Although FIG. 6 shows an example of two rows, the configuration and operation are the same for a single row or for two or more rows.

Next, the operation will be explained. As shown in FIGS. 6 and 7, both ends of the lead frame are inserted into the grooves of the grooved rails 3a and 3b, and then the feed claw 4 is lowered into the rails 3a and 3b from the rear end of the lead frame 1. (arrow A), then rails 3a, 3b
The feed claw 4 is moved a predetermined distance in the E direction in parallel with (arrow B). When the lead frame 1 is moved a predetermined distance, the feed claw 4 is raised (arrow C) and then returned to its original position (arrow D), and one cycle of conveyance is completed and the lead frame 1 has been conveyed a predetermined distance. Become. By repeating this operation, the lead frames 1 are conveyed one after another.

[Problem that the invention attempts to solve]

By the way, in the conventional conveying device described above, if the lead frame 1 is deformed, the lead frame 1
may become jammed in the grooved rails 3a, 3b, or the rear edge of the lead frame 1 may be deformed while being conveyed by the feed claws 4. Furthermore, when transporting over long distances, the rails 3a and 3b are joined together, but the lead frame may become clogged or deformed at the joint.

The present invention has been made in order to eliminate the drawbacks of the conventional conveying apparatus as described above, and is intended to provide a conveying apparatus that ensures smooth conveyance of lead frames.

[Means and actions for solving problems]

In order to achieve the above purpose, a semiconductor element encapsulation lead frame is clamped between two pieces attached to a main shaft and a slave axis, and the lead frame is transported by rotating the pieces. It was configured as follows. As a result, it has become possible to smoothly transport the lead frame without damaging or deforming the lead frame.

[Example of idea]

Figures 1 to 5 show a conveyor for a lead frame encapsulating a semiconductor element, which is an embodiment of the present invention. 3 are side views, FIG. 4 is a partially enlarged view, and FIG. 5 is an explanatory view of the connection between the toothed ring and the boss. In the figure, 1 and 2 are the same parts as the conventional device, 6a and 6b are a pair of conical rings made of hard plastic, 7a and 7b are a pair of cylindrical rings made of soft rubber, 8 is a boss made of hard plastic, and 9a , 9b is a soft rubber belt, 10 is a bolt, 11 is a main shaft, 12 is a set screw, 13 is a toothed ring made of foamed rubber, 14 is a hard plastic boss, 15 is a slave shaft, and 16 is a stopper. It's a screw.

As shown in FIG. 2, a boss 8 is fixed to the main shaft 11 with a set screw 12, and a pair of cylindrical rings 7a, 7b and a conical ring 6a, 6b are attached to the boss 8 with a bolt 1.
Install with 0. At this time, the width Wf of the cylindrical rings 7a and 7b attached to the boss 8 is made slightly larger than the width Wl of the lead frame 1. Next, the boss 14 is fixed at a predetermined position on the slave shaft 15 with a set screw 16, and the fifth
As shown in the figure, the toothed ring 13 is integrated with the boss 14 by inserting the protrusion of the ring 13 into the hole of the boss 14. Among the parts configured as described above, the group of parts mounted on the main shaft 11 is referred to as the main transport piece 17, and the group of parts mounted on the slave shaft 15 is referred to as the slave transport piece 18.
A structure in which the main shaft 11 and the slave shaft 15 are arranged side by side with their transport pieces 17 and 18 corresponding to each other is called a transport frame assembly 19. Note that the number of the main conveyance piece 17 and the slave conveyance piece 18 attached to the main shaft 11 and the slave shaft 15 may be one set or a plurality of sets. Next, as shown in FIG. 1, two sets of transport shaft assemblies 19 are arranged in parallel, belts 9a and 9b are stretched between the bosses 8 of the main transport pieces, and the main shaft 11 and the slave shaft 15
When connected to a drive device (not shown), the lead frame 1 conveying device is completed.

Next, the operation will be explained. As shown in FIGS. 1 and 2, a semiconductor element encapsulation lead frame 1
Both edges of the lead frame are connected to cylindrical rings 7a, 7.
When the lead frame 1 is placed on the belts 9a and 9b, and rotations F and G are applied to the main shaft 11 and the slave shaft 15 by a drive device (not shown), the lead frame 1 moves in the direction of the arrow H. move in the direction of At this time, the toothed ring 13 of the slave conveyance piece presses the sealing body portion of the lead frame from above with its outer peripheral surface, so that the toothed ring 13 is compressively deformed by an amount S as shown in FIG. This results in a strong conveying force for the lead frame 1. Further, since the conical rings 6a and 6b of the main conveyance pieces have cones on their inner surfaces, they are effective in correcting the position in the width direction of the lead frame 1 to be conveyed.

In the above embodiment, the distance Lt between the two sets of transport shafts shown in FIG. 1 is the length Ll of the lead frame 1.
It is desirable to make it smaller.

In the above embodiment, the bolts 10 were used to secure the conical rings 6a, 6b and the cylindrical rings 7a, 7b to the boss 8, but adhesive methods or integral molding methods may be used. The same applies to the method of fixing the toothed ring 13 to the boss 14.

Also, set screws 12 and 16 were used to fix the bosses 8 and 14 to the main shaft 11 and slave shaft 15, respectively.
It is also possible to use spline grooves or conical holes to improve accuracy.

Furthermore, although the embodiment is an example in which there are two rows of transport pieces, it is easy to use a single row or two or more rows by increasing or decreasing the number of transport pieces.

[Effect of idea]

This invention is a conveyance device for semiconductor element encapsulation lead frames, in which two sets of conveyance shaft sets consisting of a main shaft and a slave shaft each equipped with a conveyance piece are installed in parallel, a belt is stretched between them, and the shafts are rotated. Since the lead frame was configured to be able to move on the belt by tightening the lead frame, excellent effects as described below could be achieved.

Do not damage or deform the lead frame.

Transport is reliable.

By controlling the drive device, conveyance conditions can be freely controlled.

By increasing or decreasing the number of transport pieces, the capacity of the transport device can be freely changed.

Since the method of connection to the drive device is flexible, transport in liquid can also be carried out freely.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a lead frame transport device showing an embodiment of the present invention, Fig. 2 is a partial sectional view of the transport piece, Fig. 3 is a side view thereof, and Fig. 4 is a toothed ring and a semiconductor element. An enlarged view showing the state of contact with the sealing body,
FIG. 5 is an explanatory diagram of the integral connection between the toothed ring of the slave conveyance piece and the boss, FIG. 6 is a perspective view of the conventional device, FIG. 7 is a side view thereof, and FIG. 8 is a front view. In the figure, 6a and 6b are conical rings, 7a and 7b are cylindrical rings, 8 is a boss, 9a and 9b are belts, and 10
is a bolt, 11 is a main shaft, 12 is a set screw, 13 is a toothed ring, 14 is a boss, 15 is a slave shaft, 16 is a set screw, 17 is a main transport piece, 18 is a slave transport piece,
19 is a conveyance shaft assembly. The same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims for Utility Model Registration] (1) A conveyance device that conveys a semiconductor element-encapsulated lead frame continuously or intermittently in a predetermined direction has a main shaft to which one or more cylindrical main conveyance pieces are fixed. and a slave shaft located above the main shaft and having an elastic cylindrical slave transport piece fixed thereto, the main transport piece and the slave transport piece are made to correspond with each other, and At least two sets of conveyor shaft assemblies are arranged in parallel, with the positions of the conveyor pieces corresponding to each other, so that the interval between the outer peripheries of the lead frame is slightly smaller than the thickness of the sealing body of the lead frame. , The main conveyance pieces of each shaft assembly are connected by an elastic belt surrounding the outer periphery thereof, and the main shaft and the slave shaft are connected to a drive device so as to rotate in opposite directions. A transport device for lead frames encapsulating semiconductor elements. (2) The conveying device for a semiconductor element encapsulating lead frame according to claim (1), wherein an interval between at least two sets of the conveying shaft sets that are installed side by side is smaller than a length of the lead frame. (3) The conveyance device for a semiconductor element encapsulating lead frame according to claim (1), wherein the main conveyance piece has conical surfaces extending in the radial direction on both sides thereof.