JPH03183780A - Device for producing semiconductor - Google Patents

Abstract

PURPOSE:To prevent the fluctuations of pressure due to the clogging of a pipe line by branching a part of the pipeline into plural pipelines, providing a trap in each branch pipeline and furnishing a passage changing means at the branch point. CONSTITUTION:In this semiconductor producing device, a part of the pipeline 1 is branched into pipelines 11 and 12 at the branch point 2, and a trap 3 is joined to the pipelines 11 and 12 and placed in each pipeline part 4. The pipeline part 4 is connected respectively to pipelines 61 and 62 which are joined into one pipeline 6 at the branch point 5, and the valves 71 and 72 for changing the passage are provided to the branch points 2 and 5. The passage is appropri ately changed by the valves 71 and 72 to use the pipelines 11 and 61 or the pipelines 12 and 62. As a result, the clogging material in the pipeline part 4 is cleaned off while the furnace is used, and the fluctuations of pressure are prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and particularly to the structure of a piping system connected to a CVD equipment.

[Conventional technology]

FIG. 2 is a diagram showing the configuration of a piping system in a conventional CVD apparatus. In the same figure, 1 is a pipe, this pipe 1
A piping section 4 having a trap 3 is provided in the middle of the
, 6, connected to piping 6 on the pump side.

In such a configuration, among the gases, solid substances, and the like that have passed through the pipe 1 , the solid substances are captured by the trap 3 and accumulated in the trap 3 when passing through the pipe section 4 . This prevents solid substances from flowing into the pump. Then, only gaseous substances flow through the pipe 6, preventing the pump from becoming contaminated.

[Problem to be solved by the invention]

However, the conventional semiconductor manufacturing apparatus has a problem in that if too much solid material accumulates in the trap 3, the piping section 4 is clogged and the pressure in front of the piping becomes high and fluctuating. Furthermore, there is a problem in that the driving of the semiconductor manufacturing equipment must be stopped in order to remove the accumulated solid material.

The present invention has been made to solve the above-mentioned conventional problems, and aims to provide a semiconductor manufacturing apparatus that can prevent pressure changes in front of one pipe and can clean traps while using the apparatus.

[Means to solve the problem]

In the semiconductor manufacturing equipment according to the present invention, a part of the piping is branched into a plurality of pipes, a trap is provided in the plurality of pipes, and one of the plurality of pipes is always used, and it is connected to other pipes. It is equipped with a switching means that can be switched.

[Effect]

In this invention, the pipes are divided into a plurality of pipes, so that before the traps in one pipe become clogged, the switching means is used to switch to the other pipe, thereby preventing a sudden pressure rise in the front part of the pipe, and While the nine pipes are in use, the material accumulated in the net of the other pipe can be removed, so there is no need to stop the semiconductor manufacturing equipment.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a block diagram showing the main parts of an embodiment of a semiconductor manufacturing apparatus according to the present invention, and the same parts as in the above-mentioned figures are given the same reference numerals. In the figure, a part of a pipe 1 is branched into two from a branch point 2, and each branched pipe 11.
A trap 3 is accommodated in a piping section 4 and connected to each of the traps 1z, and a portion of the piping 6 is similarly branched into two forks from a branch point 5, and connected to each of the branched pipings 61 and 6z, respectively. ing. In addition, pulps 71 and 7 are provided at branch point 2 of the pipe 10 and branch point 5 of the pipe 60, respectively, to switch the flow paths, and these valves ? r, 7
2. Either one of the multi-branched piping is used by switching between one direction and the other direction.

In such a structure, the gas or solid substance that has passed through the pipe 1 flows into the pipe v4 at the branch point 2.

At this time, only one part of the valve 71 is open, so
For gases and solid substances, use Pulp TI's open pipe 401
It only flows into the book. And the trap 3 inside the pipe 4
The solid substance is captured by the pipe, and when it flows through the pipe 6 through the branch point 5 of the pipe, only the gas remains and the subsequent damage to the pump is reduced. At this time, trap 3
Solid substances gradually accumulate in b1, eventually clogging the pipes,
The pressure in front of the pipe gradually increases, but trap 3
Since the valves 7t and 7z can be switched and the solid substances accumulated between them can be removed before the trap 3 becomes clogged, pressure changes can be prevented without clogging the trap 3. Since one pipe can be cleaned while the other pipe is in use, the pipe can be cleaned while the furnace is in use.

In addition, in the above-mentioned embodiment, there are two pipes to be branched.
Although the description has been made regarding the case where the fc is a book, the present invention is not limited to this, and it is also possible to use two or more books.

〔Effect of the invention〕

As explained above, according to the present invention, since there are a plurality of pipes, there is an effect that the pipes can be cleaned while using the furnace without causing pressure fluctuations due to clogging of the pipes.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor manufacturing apparatus. 1.11,12 ・O#・Piping, 2... Branch point, 3
11@1111) Wrap, 4... Piping, 5...
pulp. Agent Masuo Oiwa

Claims (1)

[Claims] 1. A semiconductor manufacturing apparatus, characterized in that a part of a pipe is divided into a plurality of pipes and branched, a trap is provided in the plurality of branched pipes, and a flow path switching means is provided at the branch point.