JPH03177357A - Burning of barium titanate-based semiconductor porcelain - Google Patents
Burning of barium titanate-based semiconductor porcelainInfo
- Publication number
- JPH03177357A JPH03177357A JP1318024A JP31802489A JPH03177357A JP H03177357 A JPH03177357 A JP H03177357A JP 1318024 A JP1318024 A JP 1318024A JP 31802489 A JP31802489 A JP 31802489A JP H03177357 A JPH03177357 A JP H03177357A
- Authority
- JP
- Japan
- Prior art keywords
- fired
- temperature
- burning
- layer
- barium titanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910002113 barium titanate Inorganic materials 0.000 title claims abstract description 22
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 229910052573 porcelain Inorganic materials 0.000 title claims abstract description 14
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 title claims description 19
- 238000010304 firing Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 9
- 229910052788 barium Inorganic materials 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- BAQNULZQXCKSQW-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Ti+4] BAQNULZQXCKSQW-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052593 corundum Inorganic materials 0.000 abstract description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 4
- 238000001816 cooling Methods 0.000 description 10
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910018404 Al2 O3 Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は周囲温度によって抵抗値が変化するチタン酸バ
リウム系半導体磁器を用いて電流制御を行う温度補償用
、温度センサーとして利用されるチタン酸バリウム系半
導体磁器の焼成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a barium titanate semiconductor porcelain whose resistance value changes depending on the ambient temperature, which is used for temperature compensation and as a temperature sensor for controlling current. The present invention relates to a method for firing semiconductor porcelain.
従来の技術
チタン酸バリウム系の正特性サーミスタは、チタン酸バ
リウムを主成分として半導体化にはY。Conventional technology A barium titanate-based positive temperature coefficient thermistor uses barium titanate as its main component and is made into a semiconductor.
La、Ce、Nb、Bi、Sb、Wなどの酸化物の1種
以上を微量含有させたもので、好適な温度で焼成すると
半導体化し、ある温度で抵抗が著しく増加(キュリー点
)する正の抵抗温度変化を示す特徴を有している。It contains trace amounts of one or more oxides such as La, Ce, Nb, Bi, Sb, and W. It becomes a semiconductor when fired at a suitable temperature, and is a positive oxide whose resistance increases significantly at a certain temperature (Curie point). It has the characteristic of showing resistance temperature change.
そして、チタン酸バリウムのキュリー点は、はぼ120
℃付近にある。このキュリー点は、チタン酸バリウム(
BaTiO3)の中のBa、Tiの一部を置換すること
によって変化させることができる。例えば、キュリー点
を高い温度に移動させ°るためには、Baの一部を鉛(
Pb)で置換することにより得られる。また、キュリー
点を低い温度に移動させるためには、Baの一部をスト
ロンチウム(Sr)で、あるいはTfの一部をすず(S
n)で置換することにより得られることが知られている
。The Curie point of barium titanate is 120.
It is around ℃. This Curie point is barium titanate (
It can be changed by partially substituting Ba and Ti in BaTiO3). For example, in order to move the Curie point to a higher temperature, some of the Ba must be replaced with lead (
Pb). In addition, in order to move the Curie point to a lower temperature, it is necessary to replace part of Ba with strontium (Sr) or replace part of Tf with tin (Sr).
It is known that it can be obtained by substituting with n).
ところで、チタン酸バリウム系半導体磁器を製造するた
めには、通常1200℃〜1400℃の高温で焼成する
必要がある。しかしながら、温度補償用として用いられ
るチタン酸バリウム系半導体磁器は、キュリー点を低温
側にもツB al−xS rxT i 03系あるいは
BaTi1−xSrx○3系であり、チタン酸バリウム
系半導体磁器の温度特性において、キュリー点以上の温
度での抵抗値が直線的に増加する部分を利用して電流制
御を行っている。このため、温度補償用素子として要求
される特性として、常温(25℃)抵抗値R25と80
℃での抵抗値Raoの比、即ちR80/R25の規格値
がある。そして、一般に焼成においては、最高温度から
冷却する速度が速いほど、R80/R25の値は小さく
なることが知られている。このようなチタン酸バリウム
系半導体磁器を焼成する場合、一般にアルミナ質(A!
! 2(h)の焼成さやに酸化ジルコニウム(Zr02
)の粉末を敷きつめ、その上に成形体を並べ、温度設定
のできる単炉あるいはトンネル炉で焼成を行っている。By the way, in order to manufacture barium titanate-based semiconductor ceramics, it is usually necessary to fire at a high temperature of 1200°C to 1400°C. However, the barium titanate-based semiconductor porcelain used for temperature compensation is a B al-xS rxT i 03 system or BaTi1-xSrx○3 system, which has a Curie point on the low temperature side. In terms of characteristics, current control is performed using the part where the resistance value increases linearly at temperatures above the Curie point. For this reason, the characteristics required for a temperature compensation element are the resistance value R25 and 80°C at room temperature (25°C).
There is a standard value of the ratio of resistance values Rao at °C, ie, R80/R25. It is generally known that in firing, the faster the cooling rate from the maximum temperature, the smaller the value of R80/R25. When firing such barium titanate-based semiconductor porcelain, alumina (A!
! Zirconium oxide (Zr02
) powder is laid down, the molded bodies are arranged on top of it, and fired in a single furnace or tunnel furnace where the temperature can be set.
発明が解決しようとする課題
しかしながら、上記の従来の構成では、焼成時の最高温
度からの冷却速度が速くなるほど、焼成炉内の温度が設
定値になっているにもかかわらず、アルミナ質の焼成さ
やの熱容量が大きいため、炉内の温度にさやがついてい
けず、さやに接している焼結体はその影響を受け、特性
のバラツキを生ずる問題点を有していた。Problems to be Solved by the Invention However, in the conventional configuration described above, the faster the cooling rate from the maximum temperature during firing, the faster the firing rate of alumina becomes, even though the temperature in the firing furnace is at the set value. Since the heat capacity of the pod is large, the pod cannot keep up with the temperature in the furnace, and the sintered body in contact with the pod is affected by this, resulting in variations in properties.
本発明は上記従来の問題点を解決するもので、焼成時に
おいて、最高温度からの冷却速度を速くして行った場合
でも、冷却過程による焼結体の特性のバラツキを抑えた
焼結体を得ることができるチタン酸バリウム系半導体磁
器の焼成方法を提供することを目的とするものである。The present invention solves the above-mentioned conventional problems, and provides a sintered body that suppresses variations in the properties of the sintered body due to the cooling process even when the cooling rate from the maximum temperature is increased during firing. The object of the present invention is to provide a method for firing barium titanate-based semiconductor porcelain that can be obtained.
課題を解決するための手段
この課題を達成するために本発明のチタン酸バリウム系
半導体磁器の焼成方法は、チタン酸バリウム系の成形体
を収納する焼成さやが、SiC層とAt2203層から
なる構成を有するものを用いて焼成することを特徴とす
るものである。ここで、成形体を収納する側はA220
3層であり、SiC層上に成形体を収納した場合、チタ
ン酸バリfクム系成形体はSiCと反応性が強く、使用
することはできない。Means for Solving the Problem In order to achieve this problem, the method for firing barium titanate-based semiconductor porcelain of the present invention is such that the firing sheath containing the barium titanate-based molded body is composed of a SiC layer and an At2203 layer. It is characterized in that it is fired using a material having Here, the side where the molded body is stored is A220.
When there are three layers and the molded body is housed on the SiC layer, the baricum titanate molded body is highly reactive with SiC and cannot be used.
作用
この構成によって、AQ 203 (分子熱cp−12
4,7J −ma l−’d e g−’)とそれより
小さい比熱を有するS i C(Cp=48.6J −
ma 1−’deg=)の層をもつ構造にすることで、
焼成さやの熱放散がAl2O3だけのものよりもよくな
り、焼成さやがもつ熱容量を小さくすることができるの
で、焼成炉内の設定温度に焼成さやもついていきやすく
なるため、冷却過程による焼結体の特性のバラツキを抑
えたチタン酸バリウム系半導体磁器を得ることができる
。Effect This configuration allows AQ 203 (molecular heat cp-12
4,7J-ma l-'d e g-') and a smaller specific heat of S i C (Cp=48.6J-
By creating a structure with layers of ma 1−'deg=),
The heat dissipation of the fired pod is better than that of only Al2O3, and the heat capacity of the fired pod can be reduced, making it easier for the fired pod to keep up with the set temperature in the firing furnace. It is possible to obtain barium titanate-based semiconductor porcelain with suppressed variations in properties.
また、本発明において、SiC層をAt! 203層と
組合せた焼成さやを用いるのは、SiCは熱伝導率が大
きく、かつ耐火性にすぐれており、さらにAe 203
と熱膨張係数がほぼ等しいことによっている。特に、A
e 203と熱膨張係数が異なる材質のものを用いて焼
成さやを構成すると、焼成により焼成さやが反ってしま
い好ましくない。Moreover, in the present invention, the SiC layer is At! The reason for using the fired sheath in combination with the Ae 203 layer is that SiC has high thermal conductivity and excellent fire resistance.
This is because the coefficients of thermal expansion are almost the same. In particular, A
If the fired pod is constructed using a material with a coefficient of thermal expansion different from e203, the fired pod will warp during firing, which is not preferable.
実施例
以下、本発明の実施例について図面を参照しながら説明
する。EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.
第1図は本実施例で使用した焼成さやの断面を示すもの
である。第1図(a)はA0203層1とSiC層2か
らなるサンドイッチ状の焼成さやである。FIG. 1 shows a cross section of the fired pod used in this example. FIG. 1(a) shows a sandwich-like fired pod consisting of an A0203 layer 1 and a SiC layer 2.
また、第1図(b)は同図(a)と同様にAe 203
層1とSiC層2からなる焼成さやであるが、2層で構
成された焼成さやを示している。In addition, FIG. 1(b) shows Ae 203 similarly to FIG. 1(a).
Although the fired sheath is composed of layer 1 and SiC layer 2, it shows a fired sheath composed of two layers.
次にAe 203層からなる焼成さやと、上記2種類の
焼成さやに熱電対をそれぞれその焼成さやの上面につけ
、温度測定を行った。このとき焼成炉内の温度設定は、
1400℃から1時間に400℃の冷却速度で行った。Next, thermocouples were attached to the upper surfaces of the fired pods made of Ae 203 layer and the above two types of fired pods, respectively, to measure the temperature. At this time, the temperature setting in the firing furnace is
The cooling was performed from 1400°C at a cooling rate of 400°C per hour.
その結果を第2図に示す。第2図の実IAはこのときの
炉内の温度であり、実MBは第1図(a)及び(b)の
焼成さやを測定した結果であり、実線Cは従来のAe
203層からなる焼成さやを測定したときの結果である
。この結果から分かるように、Ae2ChMだけの焼成
さやより、i 203層とSiC層とからなる焼成さや
を使用することにより、焼成時における冷却過程におい
て焼成さやの温度が炉内の設定値とほぼ同しような温度
になっていることが示されている。The results are shown in FIG. The actual IA in Figure 2 is the temperature inside the furnace at this time, the actual MB is the result of measuring the fired pods in Figures 1 (a) and (b), and the solid line C is the temperature of the conventional Ae.
These are the results when a fired pod consisting of 203 layers was measured. As can be seen from this result, by using a fired pod consisting of an i203 layer and a SiC layer, the temperature of the fired pod during the cooling process during firing is almost the same as the set value in the furnace, rather than a fired pod made of only Ae2ChM. It is shown that the temperature is about
次に、第1図(a) 、 (b)に示される焼成さやに
成形体を収納し焼成を行った具体例について説明する。Next, a specific example in which a molded body is housed in a firing sheath shown in FIGS. 1(a) and 1(b) and fired will be described.
ここで、成形体は次のようにして用意した。まず、組成
がB a T i o、e+ S no、+s○3+0
.014Nb20s+0.024S io2 +0.0
IAf! 203になるように市販の高純度原料を秤量
し、ゴム内張りしたポットミルにメノウ玉石と共に入れ
、混合・粉砕し乾燥した。この乾燥した原料にバインダ
ーとしてポリビニルアルコール(P、V、A)を10重
量%加えて造粒したのち、油圧プレスを用い、圧力80
0 kg / cJで直径10mm、厚さ1.2師の円
板状に成形し、成形体を得た。Here, the molded body was prepared as follows. First, the composition is B a T io, e+ S no, +s○3+0
.. 014Nb20s+0.024S io2 +0.0
IAf! Commercially available high-purity raw materials were weighed to give a weight of 2.0 mm, put into a rubber-lined pot mill together with agate cobbles, mixed, crushed, and dried. After adding 10% by weight of polyvinyl alcohol (P, V, A) as a binder to this dried raw material and granulating it, using a hydraulic press, a pressure of 80
It was molded into a disk shape of 10 mm in diameter and 1.2 mm in thickness at 0 kg/cJ to obtain a molded body.
次に、第3図に示すように上記の成形体6を焼成さや全
体に収納した。このとき、焼成さや内には酸化ジルコニ
ウム(ZrO2)からなる粉末7を敷きつめておいた。Next, as shown in FIG. 3, the above molded body 6 was housed in the entire firing sheath. At this time, powder 7 made of zirconium oxide (ZrO2) was spread inside the fired sheath.
また、第3図に示すようにAe 203層1の間にSi
C層2を設けたサンドイッチ状の焼成さやで実施した。Moreover, as shown in FIG.
The experiment was carried out using a sandwich-shaped fired pod provided with a C layer 2.
ここで、本実施例に使用した焼成さやの大きさは縦及び
横の長さが280 rrm 、厚さが10mm(Al2
O3層;3mmX2.SiC層;4m)である。そして
、成形体を収納した焼成さやを温度設定ができる焼成炉
内に入れ、昇温速度毎時200℃で1380℃まで昇温
し、1380℃で1時間焼成したのち、冷却速度を変え
て降温し、チタン酸バリウム系磁器試料を得た。Here, the size of the fired pod used in this example was 280 rrm in length and width, and 10 mm in thickness (Al2
O3 layer; 3mmX2. SiC layer; 4 m). Then, the fired pod containing the molded body was placed in a firing furnace where the temperature could be set, and the temperature was raised to 1380°C at a heating rate of 200°C per hour. After firing at 1380°C for 1 hour, the temperature was lowered by changing the cooling rate. , barium titanate-based porcelain samples were obtained.
次に、このようにして得られた試料の特性を従来のAe
203層だけからなる焼成さやを用いた場合と併せて
調べた。即ち、得られた試料を各さや内の焼結体50ケ
をランダムサンプリングし、試料の両面にアルミニウム
溶射による電極をつけ、常温抵抗値(R25)の平均と
標準偏差(Sn−+)を計算した。また、常温抵抗値と
80℃での抵抗値(Rao )との比(R80/R25
)を測定し、平均値を計算した。その結果を下記の第1
表及び第2表に示す。第1表はSiC層とAl2O3層
からなる本発明の焼成さやを使用したときの結果であり
、第2表は従来のAt! 203の焼成さやを使用した
ときの結果である。Next, the characteristics of the sample obtained in this way were compared with conventional Ae
This was also investigated using a fired pod consisting of only 203 layers. That is, 50 sintered bodies in each pod were randomly sampled, aluminum sprayed electrodes were attached to both sides of the sample, and the average and standard deviation (Sn-+) of the room temperature resistance value (R25) were calculated. did. Also, the ratio of the resistance value at room temperature to the resistance value at 80°C (Rao) (R80/R25
) was measured and the average value was calculated. The results are shown in the first section below.
Shown in Table and Table 2. Table 1 shows the results when using the fired pod of the present invention consisting of a SiC layer and an Al2O3 layer, and Table 2 shows the results of the conventional At! These are the results when using No. 203 fired pods.
く第
表〉
く第
表〉
以上の結果は、本発明の焼成さやを用いた場合SiCを
有することで焼成さやの熱放散がAt!203だけのも
のよりもよくなり、焼成さやがもつ熱容量を小さくする
ことができるので、焼成炉内の冷却過程における設定温
度についていくことができ、焼結体の特性のバラツキを
抑えたチタン酸バリウム系半導体磁器を得ることができ
ることを示している。Table 1 Table 1 The above results show that when the fired pod of the present invention is used, the heat dissipation of the fired pod is At! Barium titanate is better than 203 alone, and the heat capacity of the fired pod can be reduced, allowing it to keep up with the set temperature during the cooling process in the firing furnace, suppressing variations in the properties of the sintered body. This shows that it is possible to obtain semiconducting porcelain.
発明の効果
以上のように本発明は、SiC層とAe 203層から
構成された焼成さやを用いることにより、焼成における
冷却過程による焼結体の特性のバラツキを抑えたチタン
酸バリウム系半導体磁器を得ることができるものである
。Effects of the Invention As described above, the present invention provides barium titanate-based semiconductor porcelain that suppresses variations in the characteristics of the sintered body due to the cooling process during firing by using a fired sheath composed of a SiC layer and an Ae 203 layer. It is something that can be obtained.
第1図(a) 、 (b)はそれぞれ本発明の実施例に
係る焼成さやの断面図、第2図は本発明の実施例及び従
来例における焼成さやの温度変化を示したグラフ、第3
図は本発明の実施例におけるチタン酸バjウム系半導体
磁器焼成−工程を示す断面図である。
1・・・・・・Al1203層、2・・・・・・SiC
層。Figures 1 (a) and (b) are cross-sectional views of fired pods according to embodiments of the present invention, Figure 2 is a graph showing temperature changes of fired pods in embodiments of the present invention and conventional examples, and Figure 3.
The figure is a sectional view showing the process of firing barium titanate semiconductor ceramics in an embodiment of the present invention. 1...Al1203 layer, 2...SiC
layer.
Claims (1)
O_3層からなる焼成さや内の上記Al_2O_3層側
に上記成形体を位置するようにして収納し、上記焼成さ
やを焼成炉に入れ、上記チタン酸バリウム系成形体を焼
成することを特徴とするチタン酸バリウム系半導体磁器
の焼成方法。A barium titanate-based molded body is combined with a SiC layer and Al_2
The titanium titanium oxide is characterized in that the molded body is placed on the side of the Al_2O_3 layer in a fired sheath consisting of O_3 layers, the fired sheath is placed in a firing furnace, and the barium titanate-based molded body is fired. A method for firing barium acid semiconductor porcelain.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1318024A JP2808758B2 (en) | 1989-12-07 | 1989-12-07 | Method for firing barium titanate-based semiconductor porcelain |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1318024A JP2808758B2 (en) | 1989-12-07 | 1989-12-07 | Method for firing barium titanate-based semiconductor porcelain |
Publications (2)
Publication Number | Publication Date |
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JPH03177357A true JPH03177357A (en) | 1991-08-01 |
JP2808758B2 JP2808758B2 (en) | 1998-10-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP1318024A Expired - Fee Related JP2808758B2 (en) | 1989-12-07 | 1989-12-07 | Method for firing barium titanate-based semiconductor porcelain |
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JP (1) | JP2808758B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308807A (en) * | 1992-07-15 | 1994-05-03 | Nalco Chemical Company | Production of lead zirconate titanates using zirconia sol as a reactant |
-
1989
- 1989-12-07 JP JP1318024A patent/JP2808758B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308807A (en) * | 1992-07-15 | 1994-05-03 | Nalco Chemical Company | Production of lead zirconate titanates using zirconia sol as a reactant |
Also Published As
Publication number | Publication date |
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JP2808758B2 (en) | 1998-10-08 |
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