JPH03175693A - Terminal electrode of ito film - Google Patents
Terminal electrode of ito filmInfo
- Publication number
- JPH03175693A JPH03175693A JP31562389A JP31562389A JPH03175693A JP H03175693 A JPH03175693 A JP H03175693A JP 31562389 A JP31562389 A JP 31562389A JP 31562389 A JP31562389 A JP 31562389A JP H03175693 A JPH03175693 A JP H03175693A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductor
- terminal electrode
- ito film
- fired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 235000019353 potassium silicate Nutrition 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 239000011521 glass Substances 0.000 abstract description 11
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 239000004115 Sodium Silicate Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 229910052911 sodium silicate Inorganic materials 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract description 2
- 239000002075 main ingredient Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- QWXYZCJEXYQNEI-OSZHWHEXSA-N intermediate I Chemical compound COC(=O)[C@@]1(C=O)[C@H]2CC=[N+](C\C2=C\C)CCc2c1[nH]c1ccccc21 QWXYZCJEXYQNEI-OSZHWHEXSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔機側
各種装置におけるＩＴＯ膜と外部導体との電気的接続を
図るための端子電極に関し、
ＩＴＯＩＩ！Ｉとの接合強度の向上を図った端子電極を
提供することを目的とし、
ＩＴＯ膜に接合した水ガラスの焼成膜と、前記焼成膜の
上に塗布した恨ペーストを焼成してなる中間導電体と、
外部導体との電気的接続のために前記中間導電体の上に
設けられた接続用導電体とから構成されたことを特徴と
する。[Detailed Description of the Invention] [Regarding a terminal electrode for electrically connecting an ITO film and an external conductor in various equipment on the machine side, ITOII! In order to provide a terminal electrode with improved bonding strength with ITO, an intermediate conductor is produced by firing a fired film of water glass bonded to an ITO film and a paste coated on the fired film. and,
A connecting conductor is provided on the intermediate conductor for electrical connection with an external conductor.
本発明は、各種装置におけるＩＴＯ膜と外部導体との電
気的接続を図るための端子電極に関する。The present invention relates to a terminal electrode for electrically connecting an ITO film and an external conductor in various devices.
酸化インジウム（ＩｎｘＯ３）を主成分とし、数％の酸
化スズを含むＩＴＯＪ１９は、優れた透光性を有してお
り、液晶パネル、プラズマデイスプレィパネル、タッチ
パネルなどの各種の装置における透明導電部材として広
く用いられている。ITOJ19, which is mainly composed of indium oxide (InxO3) and contains several percent tin oxide, has excellent translucency and is used as a transparent conductive material in various devices such as liquid crystal panels, plasma display panels, and touch panels. Widely used.
第３図（ａ）及び（ｂ）はタッチパネルＴＰの構成を示
す正面図及び側面図である。FIGS. 3(a) and 3(b) are a front view and a side view showing the configuration of the touch panel TP.
タッチパネルＴＰは、例えば、特開昭６２−２１７３１
６号公報に開示されている静電容量方式の座標入力装置
として、ＣＲＴなどの画面の前面に装着されて使用され
る。For example, the touch panel TP is disclosed in Japanese Patent Application Laid-Open No. 62-21731.
The capacitive coordinate input device disclosed in Japanese Patent No. 6 is used by being attached to the front of a screen such as a CRT.
ガラス基板２１の表面及び裏面には、それぞれ全面にわ
たって、所定の面抵抗値をもった透明導電膜としてのＩ
ＴＯ膜２膜上２３が形成されている。裏面側のＩＴ○１
模２３はデイスプレィ装置殻のノイズの影響を除くため
のシールド電極となる。A transparent conductive film having a predetermined sheet resistance value is coated on the front and back surfaces of the glass substrate 21, respectively.
A TO film 2 upper film 23 is formed. IT○1 on the back side
The pattern 23 serves as a shield electrode for removing the influence of noise from the display device shell.
ガラス基板２１の周囲において、表面側のＩＴＯ膜２膜
上２には、図外のタッチ位置検知回路を設けたフレキシ
ブル基板の端子（外部導体）に接続するための接続用Ｒ
電体として、半田を溶融させて盛り上げた半田バンプ２
４が、所定のピッチｐ（例えば２０ｆｆ１１１）をもっ
て多数設けられる。Around the glass substrate 21, on the ITO film 2 on the front side, there is a connecting R for connecting to a terminal (external conductor) of a flexible substrate provided with a touch position detection circuit (not shown).
Solder bump 2 made of melted solder and raised as an electric body
4 are provided in large numbers with a predetermined pitch p (for example, 20ff111).
ＩＴＯ膜２膜上２上意の点（座標）Ｐに指などを触れる
（タッチする）と、ＩＴＯ膜２膜上２Ｐで人体の静電容
量を介して接地され、ＩＴＯ膜２膜上２囲の各点と接地
ラインとの間の抵抗値に変化が生じる。この変化に対応
した信号が、各半田バンブ２４を介してタッチ位置検知
回路に伝えられ、これによって座標の指定が可能となる
。When you touch (touch) a point (coordinates) P on the ITO film 2 with your finger, it is grounded through the capacitance of the human body at the 2P on the ITO film 2, and the 2 surroundings on the ITO film 2 are grounded. A change occurs in the resistance value between each point of the ground line and the ground line. A signal corresponding to this change is transmitted to the touch position detection circuit via each solder bump 24, thereby making it possible to specify the coordinates.
第２図は従来の端子電極２０を示すタッチパネルＴＰ２
の部分断面図である。FIG. 2 shows a touch panel TP2 showing a conventional terminal electrode 20.
FIG.
一般に上述のように半田バンプ２４を設ける場合には、
半田とＩＴＯ膜２膜上２直接の接合が困難であるため、
半田バンブ２４とＩＴＯＩＩ！４２２との間に、銀ペー
ストをスクリーン印刷して焼成した銀導電膜からなる中
間導電体２５が設けられる。Generally, when providing the solder bumps 24 as described above,
Since it is difficult to directly bond the solder and the ITO film on the two films,
Handa Bamboo 24 and ITOII! 422, an intermediate conductor 25 made of a silver conductive film formed by screen printing and baking a silver paste is provided.
すなわち、従来においては、中間導電体２５と半田バン
プ２４とによって、ＩＴＯ膜２膜上２部導体とを電気的
に接続するための端子電極２０が構成されている。That is, conventionally, the intermediate conductor 25 and the solder bump 24 constitute the terminal electrode 20 for electrically connecting the ITO film 2 and the 2-part conductor on the film.
なお、図中の符号２６は、ＩＴＯ膜２膜上２護するため
に、ＩＴＯ膜２膜上２辺部（端子電極２０の形成領域）
以外の表面を覆って設けられた、例えば有機シリケイト
などからなる保護膜である。Note that the reference numeral 26 in the figure indicates two side parts on the ITO film 2 (formation area of the terminal electrode 20) in order to protect the ITO film 2.
This is a protective film made of, for example, organic silicate, which is provided to cover the other surfaces.
銀導電膜は、導電性及びコストの面から中間導電体２５
の材質として最適である。A silver conductive film is used as the intermediate conductor 25 from the viewpoint of conductivity and cost.
It is the most suitable material for
しかしながら、従来においては、中間導電体２５とＩＴ
Ｏ膜２膜上２接合強度が、中間導電体２５と半田バンブ
２４との接合強度に比べて小さく、中間導電体２５とＩ
ＴＯ膜２膜上２間、つまり、ＩＴＯ膜２膜上２子電極２
０との間で、剥離が生じ易いという問題があった。However, in the past, the intermediate conductor 25 and the IT
The bonding strength between the O film 2 and the solder bump 24 is smaller than the bonding strength between the intermediate conductor 25 and the solder bump 24.
Two electrodes between two TO films, that is, two electrodes on two ITO films.
0, there was a problem in that peeling was likely to occur.
このため、タッチパネルＴＰ２の電気的接続の信頼性が
低下することになる。For this reason, the reliability of the electrical connection of the touch panel TP2 decreases.
本発明は、上述の問題に鑑み、ＴＴＯ膜との接合強度の
向上を図った端子Ｔｉ極を提供することを目的としてい
る。SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention aims to provide a terminal Ti pole with improved bonding strength with a TTO film.
（課題を解決するための手段）
本発明は、上述の課題を解決するため、第１図に示すよ
うに、ＩＴＯ膜２膜上２合した水ガラスの焼成膜１６と
、前記焼成膜１６の上に塗布した銀ペーストを焼成して
なる中間導電体１５と、外部導体との電気的接続のため
に前記中間導電体１５の上に設けられた接続用導電体２
４とから構成されたことを特徴とする。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention, as shown in FIG. An intermediate conductor 15 formed by firing a silver paste applied thereon, and a connecting conductor 2 provided on the intermediate conductor 15 for electrical connection with an external conductor.
It is characterized by being composed of 4.
水ガラスの焼成膜１６はＩＴＯ膜２膜上２合する。焼成
膜１６とＩＴＯ膜２膜上２合力は大きい。The fired water glass film 16 is placed on the two ITO films. The resultant force on the fired film 16 and the two ITO films is large.
中間導電体１５は、焼成膜１６の上に塗布した銀ペース
トを焼成することによって設けられる。The intermediate conductor 15 is provided by firing a silver paste applied onto the fired film 16.
焼成Ｆ！１６と中間導電体１５の接合力も大きい。Firing F! The bonding force between 16 and intermediate conductor 15 is also large.
銀ペーストの焼成の際に、銀ペースト中の根粒子が焼成
膜１６に染み込み、ＩＴＯ膜２膜上２間導電体１５の導
通が可能となる。When the silver paste is fired, the root particles in the silver paste penetrate into the fired film 16, making it possible to conduct the conductor 15 between the two ITO films.
接続用導電体２４は、外部導体との電気的接続のために
中間導電体１５の上に設けられる。A connecting conductor 24 is provided on the intermediate conductor 15 for electrical connection with an external conductor.
以下、本発明の実施例を図面を参照しつつ説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明に係る端子電極ＩＯを示す夕・ノチパネ
ルＴＰＩの部分断面図である。FIG. 1 is a partial sectional view of a front panel TPI showing a terminal electrode IO according to the present invention.
同図において、第２図及び第３図と同一の機能を有する
構成要素には同一の符号を付し、その説明を省略する。In this figure, components having the same functions as those in FIGS. 2 and 3 are denoted by the same reference numerals, and their explanations will be omitted.
端子電極ＩＯは、水ガラスの焼成１１Ｊ１６、中間導電
体１５、及び半田バンプ２４から構成されており、以下
のようにして形成される。The terminal electrode IO is composed of a fired water glass 11J16, an intermediate conductor 15, and a solder bump 24, and is formed as follows.
まず、ＩＴＯ膜２膜上２に、ケイ酸ナトリウムを主成分
とする無機水ガラス液をスプレー塗布し、４５０［”Ｃ
］の温度で３０分の焼成を行い、ガラス基板２１の表面
側のほぼ全面を被う１５００〜２０００ ［入〕の厚さ
の焼成１１り１６を形成する。First, an inorganic water glass liquid containing sodium silicate as a main component was spray-coated on the ITO film 2, and
] is performed for 30 minutes to form a fired layer 16 having a thickness of 1500 to 2000 mm, covering almost the entire surface side of the glass substrate 21.
水ガラスは、ＩＴＯとの接合の親和性が良いことが知ら
れ°ζおり、焼成膜１６とＩＴＯ膜２膜上２接合強度は
大きい。It is known that water glass has good bonding affinity with ITO, and the bonding strength between the fired film 16 and the ITO film 2 is high.
次に、ガラス基板２１の周囲の所定位置に、スクリーン
印刷によって銀ペーストを塗布し、所定のパターン形状
の銀ペースト層を設ける。そして、４５０［’Ｃ］の温
度で３０分の焼成を行い、３０μｍの厚さの層状部を有
する中間導電体１５を形成する。Next, silver paste is applied to predetermined positions around the glass substrate 21 by screen printing to provide a silver paste layer in a predetermined pattern shape. Then, baking is performed for 30 minutes at a temperature of 450['C] to form the intermediate conductor 15 having a layered portion with a thickness of 30 μm.
焼成膜１６の表面は、ＩＴＯ膜２膜上２面よりも粗いの
で、中間導電体１５の下面が焼成膜１６の表面の凹凸に
入り込んだ状態で接合することによるいわゆるアンカー
効果によって、焼成膜１６と中間導電体１５とが物理的
に強固に接合するとともに、銀ペーストのガラス職分と
水ガラス成分とがガラス質化して化学的に結合すること
によっても接合の強度が増大する。Since the surface of the fired film 16 is rougher than the upper two surfaces of the ITO film 2, the lower surface of the intermediate conductor 15 penetrates into the irregularities of the surface of the fired film 16 and joins, resulting in a so-called anchor effect. The strength of the bond is also increased by physically strongly bonding the intermediate conductor 15 and the glass component of the silver paste and the water glass component becoming vitrified and chemically bonding.
また、水ガラスの焼成膜１６は、周知のように微視的に
は空疎（ポーラス）である、したがって、銀ペーストの
焼成時に、銀粒子が焼成膜１６に浸透してＩＴＯＩＩ！
２２に到達する。これによって、焼成膜１６の内の中間
導電体１５の下方の部分は、導電性を有することになる
。Furthermore, as is well known, the fired film 16 of water glass is microscopically porous. Therefore, when the silver paste is fired, silver particles penetrate into the fired film 16 and ITOII!
Reach 22. As a result, the portion of the fired film 16 below the intermediate conductor 15 becomes electrically conductive.
すなわち、焼成膜１６は絶縁体であるが、焼成１１！
１６の厚さを上述の程度の値とした場合には、充分にＩ
ＴＯ膜２膜上２部との導通を図ることができる。That is, although the fired film 16 is an insulator, the fired film 11!
When the thickness of 16 is set to the above-mentioned value, the I
It is possible to establish electrical conduction with the upper portion of the TO film 2.
その後においては、中間導電体１５上に、外部導体との
接続に必要な量の半田が盛り上げられ、半田バンプ２４
が設けられる。Thereafter, the amount of solder necessary for connection with the external conductor is piled up on the intermediate conductor 15, and the solder bumps 24
is provided.
上述の実施例によれば、周辺部をも含めてガラス基板２
１の全面を焼成膜１６で覆うようにしたので、この焼成
膜１６をＩＴＯ膜２膜上２護するための保護膜すること
ができる。言い換えれば、従来において、ガラス基板２
Ｉの周辺部以外に設けられていた保護膜２６を水ガラス
の焼成によって形成することとし、保護膜の形成領域を
ガラス基板２１の周辺部まで延長するだけで、端子電極
１０を構成する焼成膜１６を設けることができる。According to the above embodiment, the glass substrate 2 including the peripheral portion
Since the entire surface of the ITO film 1 is covered with the fired film 16, the fired film 16 can be used as a protective film for protecting the ITO film 2. In other words, conventionally, the glass substrate 2
The protective film 26 provided outside the peripheral area of the terminal electrode 10 is formed by firing water glass, and by simply extending the protective film formation area to the peripheral area of the glass substrate 21, the fired film constituting the terminal electrode 10 can be formed. 16 can be provided.
したがって、従来と同数の５！造工数で、電気的接続の
信頼性の向上を図ったタッチパネルＴＰを製造すること
ができる。Therefore, the same number as before! A touch panel TP with improved reliability of electrical connection can be manufactured with fewer man-hours.
上述の実施例においては、タッチパネルＴＰにおける端
子電極１０を例示したが、透明導電体としてＩＴＯ膜を
用いる各種の装置にも本発明を適用することができる。In the above-mentioned embodiment, the terminal electrode 10 in the touch panel TP was illustrated, but the present invention can also be applied to various devices using an ITO film as a transparent conductor.
［発明の効果］
本発明によれば、ＩＴＯ膜と端子電極との接合強度の向
上を図ることができる。[Effects of the Invention] According to the present invention, it is possible to improve the bonding strength between the ITO film and the terminal electrode.
４、4,
第１図は本発明に係る端子電極を示すタッチパネルの部
分断面図、
第２図は従来の端子電極を示すタッチパネルの部分断面
図、
第３図はタッチパネルの構成を示す図である。
図において、
１０は端子電極、
１５は中間ｉ！Ａ電体、
！６は水ガラスの焼成膜、
２２はＩＴＯ膜、
２４は半田バンプ（接続用導電体）
である。FIG. 1 is a partial sectional view of a touch panel showing terminal electrodes according to the present invention, FIG. 2 is a partial sectional view of a touch panel showing conventional terminal electrodes, and FIG. 3 is a diagram showing the configuration of the touch panel. In the figure, 10 is a terminal electrode, 15 is an intermediate i! A electric body! 6 is a fired film of water glass, 22 is an ITO film, and 24 is a solder bump (conductor for connection).
Claims (1)
１６）と、 前記焼成膜（１６）の上に塗布した銀ペー ストを焼成してなる中間導電体（１５）と、外部導体と
の電気的接続のために前記中間 導電体（１５）の上に設けられた接続用導電体（２４）
と から構成されたＩＴＯ膜の端子電極。(1) Fired water glass film bonded to ITO film (22) (
16), an intermediate conductor (15) formed by firing a silver paste applied on the fired film (16), and an intermediate conductor (15) formed on the intermediate conductor (15) for electrical connection with an external conductor. Provided connection conductor (24)
A terminal electrode of an ITO film composed of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31562389A JPH03175693A (en) | 1989-12-04 | 1989-12-04 | Terminal electrode of ito film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31562389A JPH03175693A (en) | 1989-12-04 | 1989-12-04 | Terminal electrode of ito film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03175693A true JPH03175693A (en) | 1991-07-30 |
Family
ID=18067596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31562389A Pending JPH03175693A (en) | 1989-12-04 | 1989-12-04 | Terminal electrode of ito film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03175693A (en) |
-
1989
- 1989-12-04 JP JP31562389A patent/JPH03175693A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104965617B (en) | Touch-control display panel | |
| CN205944094U (en) | OLED display panel and display device | |
| US9454267B2 (en) | Touch sensing circuit and method for making the same | |
| TWI467449B (en) | Capacitive touch panel and method for producing the same | |
| JP6333094B2 (en) | Touch panel and manufacturing method thereof | |
| CN106371669B (en) | Touch display panel and touch display device | |
| CN108241456B (en) | Touch sensing module, manufacturing method thereof and touch display panel applying same | |
| CN104090677A (en) | Embedded-type touch screen and display device | |
| WO2015169041A1 (en) | Touch control module and manufacturing method therefor, and display device | |
| KR20120010828A (en) | Touch Screen Panel and Display Device Having the Same | |
| JP3960850B2 (en) | Touch panel | |
| JPH05503600A (en) | Capacitive touch screen forming device | |
| CN106843616A (en) | A kind of touch base plate and preparation method thereof, touch control display apparatus | |
| KR20040070314A (en) | A method of applying an edge electrode pattern to a touch screen | |
| JP2598152B2 (en) | Touch panel | |
| CN108614652A (en) | Touch panel | |
| CN109656427B (en) | Capacitive touch screen | |
| CN206339952U (en) | Touch control display apparatus and its display module | |
| CN206209685U (en) | A kind of touch display screen and display device | |
| CN203825591U (en) | Anti-static structure for touch panel | |
| CN107577101B (en) | Electrophoretic display panel and manufacturing method thereof | |
| JPS636829Y2 (en) | ||
| JPH03175693A (en) | Terminal electrode of ito film | |
| CN110018757A (en) | Touch base plate and production method | |
| CN109143637A (en) | Manufacturing method, panel and the display device of panel |