JPH0317007U - - Google Patents
Info
- Publication number
- JPH0317007U JPH0317007U JP7756389U JP7756389U JPH0317007U JP H0317007 U JPH0317007 U JP H0317007U JP 7756389 U JP7756389 U JP 7756389U JP 7756389 U JP7756389 U JP 7756389U JP H0317007 U JPH0317007 U JP H0317007U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- pasting
- taping apparatus
- view
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7756389U JPH0613042Y2 (ja) | 1989-06-30 | 1989-06-30 | 半導体素子テーピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7756389U JPH0613042Y2 (ja) | 1989-06-30 | 1989-06-30 | 半導体素子テーピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0317007U true JPH0317007U (cs) | 1991-02-20 |
| JPH0613042Y2 JPH0613042Y2 (ja) | 1994-04-06 |
Family
ID=31620068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7756389U Expired - Lifetime JPH0613042Y2 (ja) | 1989-06-30 | 1989-06-30 | 半導体素子テーピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613042Y2 (cs) |
-
1989
- 1989-06-30 JP JP7756389U patent/JPH0613042Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613042Y2 (ja) | 1994-04-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |