JPH03167732A - Impregnated type cathode structure - Google Patents
Impregnated type cathode structureInfo
- Publication number
- JPH03167732A JPH03167732A JP1307092A JP30709289A JPH03167732A JP H03167732 A JPH03167732 A JP H03167732A JP 1307092 A JP1307092 A JP 1307092A JP 30709289 A JP30709289 A JP 30709289A JP H03167732 A JPH03167732 A JP H03167732A
- Authority
- JP
- Japan
- Prior art keywords
- cup
- sleeve
- cathode
- outer diameter
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 7
- 238000005219 brazing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- NZPGFUCQQUDSQG-UHFFFAOYSA-N [Mo].[Re] Chemical compound [Mo].[Re] NZPGFUCQQUDSQG-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、カラー受像管等の電子管に使用される高１流
密度の含浸型陰極構体に関するものである、，
（従来の技術）
近年、走査線を増加させて、解像度を改善したカラー受
像管や、超高周波対応受像管等の開発が要請されている
とともに、投写管等においてら、輝度の向上が望まれて
いる。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an impregnated cathode structure with a high current density used in an electron tube such as a color picture tube. In recent years, there has been a demand for the development of color picture tubes with increased scanning lines and improved resolution, and picture tubes compatible with ultra-high frequencies, as well as improvements in brightness in projection tubes, etc. .
これらの要請に応えるには、陰極から放出する電子の密
度を大幅に増加させる必要があるつところで、含浸型陰
極は、酸化物陰極に比べて、大きな電流密度を得られ、
寿命も長いことから、これまでは、主に、撮像管、進行
波管、クライストロン等の電子管に用いられてきたか、
今後は、カラー受像管の分野でも需要の拡大が予想され
る。To meet these demands, it is necessary to significantly increase the density of electrons emitted from the cathode, and impregnated cathodes can obtain a larger current density than oxide cathodes.
Since it has a long lifespan, it has been mainly used for electron tubes such as image pickup tubes, traveling wave tubes, and klystrons.
In the future, demand is expected to expand in the field of color picture tubes as well.
このような含浸型陰極構体として、第４図に示すように
、エミッタ（電子放射物質）を含浸した短円柱状の陰極
基体１を、有底短円筒状のカソプ２に収納してろう材３
を介して固着し、このカップ２をその底部側から円笥状
のスリーブ４の一端開口部に挿入し、このスリーブ・１
の一端開口部に上記陰極基体ｔを露出さけた状態で、カ
ップ２をスリーブ４に固定し、このスリーブ４にヒータ
５を内装するようにし、さらに、このスリーブ４を円筒
状のホルダ６の中央部に複数のストラップ７を介して同
軸上に固定支持したものがある。In such an impregnated cathode structure, as shown in FIG. 4, a short cylindrical cathode substrate 1 impregnated with an emitter (electron emitting substance) is housed in a short cylindrical cassop 2 with a bottom, and a brazing material 3
This cup 2 is inserted from the bottom side into the opening at one end of the conical sleeve 4, and this sleeve 1
The cup 2 is fixed to the sleeve 4 with the cathode substrate t exposed at one end opening, the heater 5 is housed in the sleeve 4, and the sleeve 4 is attached to the center of the cylindrical holder 6. There is one that is coaxially fixedly supported via a plurality of straps 7.
ところで、このような構造では、カップ２をスリーブ４
に挿入し易くするために、カップ２の外径をスリーブ４
の内径よりも小さくする必要がある。By the way, in such a structure, the cup 2 is connected to the sleeve 4.
To make it easier to insert the cup 2 into the sleeve 4,
It must be smaller than the inner diameter of the
このため、組立てた状態で、スリーブ４とカップ２の間
には常に隙間か存在し、陰極線管に紐込んだ動作状態で
、スリーブ４からカップ２及び陰極基体１に対する熱の
伝導が十分に行なわれないことと、ヒータ５からの輻射
熱がスリーブ４とカップ２の間の隙間から漏れることか
ら、陰極基体１の温度が思ったように上昇しなかったり
、製品ごとの温度のばらつきが大きくなったりして、陰
極線管の初期特性のばらつきが発生するという問題があ
った。Therefore, in the assembled state, there is always a gap between the sleeve 4 and the cup 2, and when the tube is connected to the cathode ray tube, heat is sufficiently conducted from the sleeve 4 to the cup 2 and the cathode base 1. In addition, the radiant heat from the heater 5 leaks from the gap between the sleeve 4 and the cup 2, so the temperature of the cathode substrate 1 may not rise as expected or the temperature may vary widely from product to product. As a result, there is a problem in that the initial characteristics of the cathode ray tube vary.
なお、ヒータ５のパワーによって陰極基体１の温度を上
げようとすると、消費電力が増加するだけでなく、ヒー
タ５自体の温度か上がるため、ヒータ５の変形、断線、
絶縁破壊等の問題が生じ、信頼性や耐久性が損なわれる
ことになる。Note that if you try to raise the temperature of the cathode substrate 1 using the power of the heater 5, not only will the power consumption increase, but the temperature of the heater 5 itself will also rise, which may cause deformation of the heater 5, disconnection, or
Problems such as dielectric breakdown will occur, and reliability and durability will be impaired.
（発明が解決しようとする課題）
上述したように、従来の含浸型陰極構体では、スリーブ
とカップの間の隙間により、陰極基体の温度が思ったよ
うに上昇しなかったり、温度のばらつきが大きくなった
りして、初期特性のばらつきが発生するという問題があ
った。(Problems to be Solved by the Invention) As mentioned above, in conventional impregnated cathode structures, the temperature of the cathode substrate does not rise as expected or the temperature varies widely due to the gap between the sleeve and the cup. There was a problem in that variations in initial characteristics occurred due to this.
本発明は、このような点に鑑みなされたもので、含浸型
陰極構体において、スリーブとカップの間の隙間をなく
すことにより、熱効率を向上させるとともに、温度を安
定させることを目的とするものである。The present invention was made in view of these points, and aims to improve thermal efficiency and stabilize temperature by eliminating the gap between the sleeve and the cup in an impregnated cathode structure. be.
（課題を解決するための手段）
本発明は、エミッタを含浸した陰極基体と、この陰極基
体を収納して底部に固着したカップと、このカップを底
部側から挿入し上記陰極基体を一端開口部に露出させた
状態でカップを固定するスリーブと、このスリーブに内
装されるヒータとを具備した含浸型陰極構体において、
上記カップの底部の外径を上記スリーブの内径よりも小
さく形成するとともに、このカップの開口部の外径をス
ノーブの内径以上に形成したものである。(Means for Solving the Problems) The present invention includes a cathode substrate impregnated with an emitter, a cup that houses the cathode substrate and is fixed to the bottom, and the cup is inserted from the bottom side and the cathode substrate is opened at one end. In an impregnated cathode assembly comprising a sleeve for fixing the cup in an exposed state, and a heater installed in the sleeve,
The outer diameter of the bottom of the cup is smaller than the inner diameter of the sleeve, and the outer diameter of the opening of the cup is larger than the inner diameter of the snob.
（作用）
本発明の含浸型陰極構体は、カップをスＩＪ一ブの内径
よりも小さい外径のカップの底部からス〕−ブ内に挿入
するので、挿入が容易にでき、そして、挿入し終わった
状態では、スリーブの内径以上の外径のカップの開口部
側の外周がスリーブの内周に密着するものである。(Function) The impregnated cathode structure of the present invention can be easily inserted into the tube because the cup is inserted into the tube from the bottom of the cup, which has an outer diameter smaller than the inner diameter of the tube. In the finished state, the outer periphery of the opening side of the cup, which has an outer diameter greater than the inner diameter of the sleeve, is in close contact with the inner periphery of the sleeve.
（実施例）
本発明の含浸型陰極構体の実施例を図面を参照して説明
する。(Example) An example of the impregnated cathode structure of the present invention will be described with reference to the drawings.
なお、実施例の説明に際しては、第４図に示した従来の
含浸型陰曙構体と同様の部分には同一の符号を付す。In the description of the embodiment, the same parts as in the conventional impregnated shade structure shown in FIG. 4 are given the same reference numerals.
第１図及び第２図に示す実施例において、１ｌはタンタ
ル、モリブデン等から成るカップで、このカップ１１は
、プレス戊形により、すりばちのように径を変えた有底
短円筒状に形成され、板厚０．０２５ｍｍ，底部の外径
１．５０ｍｍ，開口部の外径１．５８ｍｍ，深さ０．４
ｍｍである。In the embodiment shown in FIGS. 1 and 2, 1l is a cup made of tantalum, molybdenum, etc., and this cup 11 is formed into a short cylindrical shape with a bottom and a diameter changed like a mortar by pressing. , plate thickness 0.025mm, bottom outer diameter 1.50mm, opening outer diameter 1.58mm, depth 0.4
It is mm.
陰極基体１は、粒径か３〜１０μｍタングステン粉末を
成形し焼結して得た多孔質（ボーラス）タングステンの
ペレットの一端面にＲｕ−〜１０等のろう剤３層を形成
し、このペレットにＢａｄ．ＣａＯＳＡｌ２０，から成
るエミッタ（電子放射物質）を含浸したもので、直径１
．４５ｍｍ、厚さ０．４ｍｍの短円柱状である。The cathode substrate 1 is made by forming three layers of a brazing agent such as Ru-10 on one end surface of a porous (bolus) tungsten pellet obtained by molding and sintering tungsten powder with a particle size of 3 to 10 μm. Bad. It is impregnated with an emitter (electron emitting material) made of CaOSAl20, and has a diameter of 1
．． It has a short cylindrical shape with a length of 45 mm and a thickness of 0.4 mm.
そして、上記陰極基体１を、ろうｔオ３層がカップ１１
の底部に位置するように、カップ１１に挿入し、ろう材
３を介してカップＩ１の底部に溶接する。Then, the cathode substrate 1 is covered with a cup 11 of three layers of wax.
It is inserted into the cup 11 so that it is located at the bottom of the cup I1, and is welded to the bottom of the cup I1 via the brazing material 3.
スリーブ４は、タンタル、モリブデン等から成り、外径
１．６０ｍｍ，長さ５ｍｍ，厚さ０．０２５ ｍｍの円
筒状である。The sleeve 4 is made of tantalum, molybdenum, etc., and has a cylindrical shape with an outer diameter of 1.60 mm, a length of 5 mm, and a thickness of 0.025 mm.
そして、このスリーブ４の一端開口部に上記カソプ１１
をその小径の底部側から挿入し、陰極基体１の表面を加
圧することにより、カップ１１をスリーブ４内に完全に
挿入し、スリーブ４とカップ１１を溶接固着する。Then, the cassop 11 is inserted into the opening at one end of the sleeve 4.
By inserting the cup 11 from the bottom side of its small diameter and applying pressure to the surface of the cathode base 1, the cup 11 is completely inserted into the sleeve 4, and the sleeve 4 and the cup 11 are welded and fixed.
そして、このスリーブ４の他端外側部の３か所にそれぞ
れレニウムーモリブデン等から成る厚さ０．０５ｍｍ，
幅０．４ｍｍのリボン状のストラップ７の一端部を溶接
固着するとともに、この３枚のストラップ７の他端部を
コバールから成る円筒状のホルダ６の肩部の３か所に溶
接固着することにより、スリーブ４をホルダ６の中央部
にストラップ７を介して同軸上に固定支持する。At three locations on the outer side of the other end of this sleeve 4, there are provided 0.05 mm thick layers made of rhenium-molybdenum, etc., respectively.
One end of a ribbon-shaped strap 7 with a width of 0.4 mm is fixed by welding, and the other ends of these three straps 7 are fixed by welding at three locations on the shoulder of a cylindrical holder 6 made of Kovar. As a result, the sleeve 4 is coaxially fixedly supported at the center of the holder 6 via the strap 7.
なお、スリーブ４にはヒータ５を内装するようになって
いる。Note that a heater 5 is housed inside the sleeve 4.
このように、この実施例の含浸型陰極構体は、スリーブ
４の内径よりも小さい外径のカップ１１の底部をスリー
ブ４内に挿入してから、カップ１１に固着した陰極基体
１の表面を加圧し、カップ１１をその径の大きい開口部
まで全体的にスリーブ４内に強制的に挿入するので、ス
リーブ４に対するカップｌ１の挿入が容易で、挿入した
状態では、カップ１１の開口部側の外周面とスリーブ４
の内周面は完全に密着した状態となり、この密着した部
分を溶接して両者を固着することができる。As described above, in the impregnated cathode assembly of this embodiment, the bottom of the cup 11 having an outer diameter smaller than the inner diameter of the sleeve 4 is inserted into the sleeve 4, and then the surface of the cathode base 1 fixed to the cup 11 is processed. Since the entire cup 11 is forcibly inserted into the sleeve 4 up to its large diameter opening, the cup l1 can be easily inserted into the sleeve 4, and when inserted, the outer periphery of the cup 11 on the opening side Face and sleeve 4
The inner circumferential surfaces of the two are completely in contact with each other, and the two can be fixed by welding this close contact part.
したがって、スリーブ４とカップ１ｌの溶接時に、スリ
ーブ４の著しい変形や穴明きといった不具合が発生する
ことかなく、良好な溶接が可能となる。Therefore, when welding the sleeve 4 and the cup 1l, it is possible to perform good welding without causing problems such as significant deformation or holes in the sleeve 4.
この結果、スリーブ４からカップ１１に対する熱伝導が
十分に行なわれることと、ヒータ５からの輻射熱がスリ
ーブ４とカップ１１の間の漏れないことから、熱効率か
向上するとともに安定し、陰極基体１の温度が十分に上
昇し、温度も安定する。As a result, the heat conduction from the sleeve 4 to the cup 11 is sufficient, and the radiant heat from the heater 5 does not leak between the sleeve 4 and the cup 11, so the thermal efficiency is improved and stabilized, and the cathode base 1 is The temperature rises sufficiently and becomes stable.
なお、スリーブ４に対するカップ１１の挿入と同様に、
カップ１１に対する陰極基体１の挿入も容易となり、し
かも、陰極基体１の外周面とカップ１ｌの内周面との間
に隙間Ｉ２があるので、溶接の熱が陰極基体１に伝わり
難く、陰極基体↑に含浸したエミッタが溶接時の熱の影
響を受け難く、エミッタが変質し難いため、電子放射能
力が低下し難くなる。Note that similarly to the insertion of the cup 11 into the sleeve 4,
It becomes easy to insert the cathode base 1 into the cup 11, and since there is a gap I2 between the outer peripheral surface of the cathode base 1 and the inner peripheral surface of the cup 1l, the heat of welding is difficult to be transmitted to the cathode base 1, and the cathode base Since the emitter impregnated in ↑ is less susceptible to the effects of heat during welding and is less likely to change in quality, the electron emission ability is less likely to deteriorate.
第３図はこの実施例の含浸型陰極構体と第４図に示した
従来の構造の含浸型陰極構体のそれぞれの陰極温度を測
定して比較した図で、それぞれの含浸型陰極構体を電子
銃に組付け、この電子銃を測定用のガラス球に組込んだ
後、ガラス球を排気して電子銃を封止し、ヒータ５に６
．３Ｖ，６０ ０ｍＡを印加し、熱的に安定する１０分
後に陰極基体１の表面中央部の温度を光学的に測定した
結果をまとめたものである。FIG. 3 is a diagram comparing the cathode temperatures of the impregnated cathode structure of this embodiment and the impregnated cathode structure of the conventional structure shown in FIG. After assembling this electron gun into a glass bulb for measurement, the glass bulb is evacuated and the electron gun is sealed.
．． This is a summary of the results of optically measuring the temperature at the center of the surface of the cathode substrate 1 after 10 minutes of applying 3V and 600 mA and thermally stabilizing it.
この結果、陰極温度の平均（×で示してある）が、従来
は９７８℃ｂであるのに対し、本発明のこの実施例では
１００５℃ｂと、２ ５ ｄｅｇも向上し、熱効率が良
くなっていることが理解でき、そして、陰極温度のばら
つき（線で範囲を示してある）も、本発明のこの実施例
では従来の約半分となっており、特性が安定しているこ
とがわかる。As a result, the average cathode temperature (indicated by an x) was conventionally 978°Cb, but in this embodiment of the present invention it was 1005°Cb, an improvement of 25 degrees, resulting in better thermal efficiency. It can be seen that the variation in cathode temperature (the range is indicated by a line) is about half that of the conventional example in this embodiment of the present invention, indicating that the characteristics are stable.
なお、一般的に知られているように、含浸型陰極は、動
作温度が高いため、ヒータ５の温度も高くする必要があ
るが、ヒータ５の温度が高いと、ヒータ５とスリーブ４
やカップ１１との絶縁破壊電圧が低下するなどの問題が
生じ易いので、同じヒ一夕５で陰極温度が高くなれば、
その分、ヒータ５に安全な方向に設計を行なうことがで
きるので、その効果は大である。As is generally known, since the operating temperature of the impregnated cathode is high, it is necessary to raise the temperature of the heater 5 as well.
Problems such as a decrease in dielectric breakdown voltage with the cup 11 are likely to occur, so if the cathode temperature increases with the same heat 5,
Accordingly, the heater 5 can be designed in a direction that is safe, so the effect is great.
上述したように、本発明によれば、含浸型陰極構体にお
いて、カップをスリーブの内径よりも小さい外径のカッ
プの底部側からスリーブ内に挿入するので、挿入が容易
にてき、そして、挿入し終わった状態では、スリーブの
内径以上の外径のカップの開口部側の外周かスリーブの
内周に密着するので、動作時には、スリーブ内のヒータ
の熱をカップ内の陰極基体に効不的にかつ確実に伝える
ことができ、したがって、熱効率が向上するとともに安
定し、陰極温度が安定する結果、初期特性のばらつきが
発生しなくなる。As described above, according to the present invention, in the impregnated cathode assembly, the cup is inserted into the sleeve from the bottom side of the cup, which has an outer diameter smaller than the inner diameter of the sleeve. In the finished state, the outer periphery of the opening side of the cup, which has an outer diameter greater than the inner diameter of the sleeve, is in close contact with the inner periphery of the sleeve, so during operation, the heat from the heater in the sleeve is ineffectively transferred to the cathode substrate in the cup. Therefore, thermal efficiency is improved and stabilized, and as a result of stabilizing the cathode temperature, variations in initial characteristics do not occur.
第１図は本発明の含ｄ型陰極構体の実施例の一部を断面
にした斜視図、第２図はその要部の断面図、第３図はこ
の実施例と第４図に示した従来例の陰極温度の比較図、
第４１図は従来の含ご１型陰曙構体の一部を断１栢にし
た斜視図である。
１
陰極基体、
４
ス
Ｊ−ブ、
５
ヒ
一タ、
１１ ・
カ
ソ プ 。FIG. 1 is a partially sectional perspective view of an embodiment of the D-type cathode assembly of the present invention, FIG. 2 is a sectional view of its essential parts, and FIG. 3 shows this embodiment and FIG. 4. Comparison diagram of cathode temperature of conventional example,
FIG. 41 is a partially cutaway perspective view of a conventional 1-type shade structure. 1 cathode substrate, 4 tube, 5 heater, 11 cassop.
Claims (1)
収納して底部に固着したカップと、このカップを底部側
から挿入し上記陰極基体を一端開口部に露出させた状態
でカップを固定するスリーブと、このスリーブに内装さ
れるヒータとを具備し、 上記カップの底部の外径を上記スリーブの内径よりも小
さく形成するとともに、このカップの開口部の外径をス
リーブの内径以上に形成したことを特徴とする含浸型陰
極構体。(1) A cathode substrate impregnated with an emitter, a cup that houses the cathode substrate and is fixed to the bottom, and this cup is inserted from the bottom side and the cup is fixed with the cathode substrate exposed at one end through the opening. The cup includes a sleeve and a heater housed in the sleeve, the outer diameter of the bottom of the cup is smaller than the inner diameter of the sleeve, and the outer diameter of the opening of the cup is larger than the inner diameter of the sleeve. An impregnated cathode structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30709289A JP2588288B2 (en) | 1989-11-27 | 1989-11-27 | Impregnated cathode structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30709289A JP2588288B2 (en) | 1989-11-27 | 1989-11-27 | Impregnated cathode structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03167732A true JPH03167732A (en) | 1991-07-19 |
| JP2588288B2 JP2588288B2 (en) | 1997-03-05 |
Family
ID=17964930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30709289A Expired - Fee Related JP2588288B2 (en) | 1989-11-27 | 1989-11-27 | Impregnated cathode structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2588288B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553109U (en) * | 1991-12-17 | 1993-07-13 | 株式会社東芝 | Impregnated cathode assembly |
| WO1996042100A1 (en) * | 1995-06-09 | 1996-12-27 | Kabushiki Kaisha Toshiba | Impregnated cathode structure, cathode substrate used for the structure, electron gun structure using the cathode structure, and electron tube |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167735A (en) * | 1989-11-16 | 1991-07-19 | Samsung Electron Devices Co Ltd | Cathode for electron gun and its manufacture |
-
1989
- 1989-11-27 JP JP30709289A patent/JP2588288B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167735A (en) * | 1989-11-16 | 1991-07-19 | Samsung Electron Devices Co Ltd | Cathode for electron gun and its manufacture |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0553109U (en) * | 1991-12-17 | 1993-07-13 | 株式会社東芝 | Impregnated cathode assembly |
| WO1996042100A1 (en) * | 1995-06-09 | 1996-12-27 | Kabushiki Kaisha Toshiba | Impregnated cathode structure, cathode substrate used for the structure, electron gun structure using the cathode structure, and electron tube |
| US6034469A (en) * | 1995-06-09 | 2000-03-07 | Kabushiki Kaisha Toshiba | Impregnated type cathode assembly, cathode substrate for use in the assembly, electron gun using the assembly, and electron tube using the cathode assembly |
| US6304024B1 (en) | 1995-06-09 | 2001-10-16 | Kabushiki Kaisha Toshiba | Impregnated-type cathode substrate with large particle diameter low porosity region and small particle diameter high porosity region |
| US6447355B1 (en) | 1995-06-09 | 2002-09-10 | Kabushiki Kaisha Toshiba | Impregnated-type cathode substrate with large particle diameter low porosity region and small particle diameter high porosity region |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2588288B2 (en) | 1997-03-05 |
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