JPH03166061A - Polishing sheet - Google Patents
Polishing sheetInfo
- Publication number
- JPH03166061A JPH03166061A JP30421789A JP30421789A JPH03166061A JP H03166061 A JPH03166061 A JP H03166061A JP 30421789 A JP30421789 A JP 30421789A JP 30421789 A JP30421789 A JP 30421789A JP H03166061 A JPH03166061 A JP H03166061A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- modulus
- magnetic
- layer
- binder resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000011230 binding agent Substances 0.000 claims abstract description 15
- 239000006061 abrasive grain Substances 0.000 claims abstract description 7
- 230000009477 glass transition Effects 0.000 claims description 14
- 229920005749 polyurethane resin Polymers 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- SPBDXSGPUHCETR-JFUDTMANSA-N 8883yp2r6d Chemical compound O1[C@@H](C)[C@H](O)[C@@H](OC)C[C@@H]1O[C@@H]1[C@@H](OC)C[C@H](O[C@@H]2C(=C/C[C@@H]3C[C@@H](C[C@@]4(O[C@@H]([C@@H](C)CC4)C(C)C)O3)OC(=O)[C@@H]3C=C(C)[C@@H](O)[C@H]4OC\C([C@@]34O)=C/C=C/[C@@H]2C)/C)O[C@H]1C.C1C[C@H](C)[C@@H]([C@@H](C)CC)O[C@@]21O[C@H](C\C=C(C)\[C@@H](O[C@@H]1O[C@@H](C)[C@H](O[C@@H]3O[C@@H](C)[C@H](O)[C@@H](OC)C3)[C@@H](OC)C1)[C@@H](C)\C=C\C=C/1[C@]3([C@H](C(=O)O4)C=C(C)[C@@H](O)[C@H]3OC\1)O)C[C@H]4C2 SPBDXSGPUHCETR-JFUDTMANSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- -1 isocyanate compounds Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はフレキシブル磁気ディスク、磁気テーブ等の
表面研磨に使用する研磨シートに関し、さらに詳しくは
、フレキシブル磁気ディスク、磁気テープ等の磁性層表
面をスクラッチ傷を発生させることなく研磨する研磨シ
ートに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a polishing sheet used for polishing the surface of a flexible magnetic disk, magnetic tape, etc., and more specifically, to a polishing sheet used for polishing the surface of a magnetic layer of a flexible magnetic disk, magnetic tape, etc. This invention relates to an abrasive sheet that polishes without causing scratches.
研磨シートは、通常、ポリエステルフィルム等の基体上
に、ＡＩ！２ ０３粉末、Ｃｒ，０３粉末、Ｓｉｎｇ粉
末、ＳｉＣ粉末等の研磨砥粒を結合剤樹脂で結着してつ
くられ、たとえば、フレキシブル磁気ディスク、磁気テ
ープ等の表面に摺接させ、磁性層表面の微小突起を研磨
して、表面を平滑にするときなどに広く使用されている
。（特公昭５３−４４７１４号）
〔発明が解決しようとする課題〕
ところが、この種の従来の研磨シートは、研磨層が硬く
て強靭であるため、研磨される微小突起のなかに研磨さ
れることなく塊のまま脱落されるものがあり、これが研
磨シートの表面に付着して、磁性層の表面にスクラッチ
傷を発生しやすい。Abrasive sheets are typically coated with AI! on a substrate such as a polyester film. It is made by bonding abrasive grains such as 203 powder, Cr,03 powder, Sing powder, SiC powder, etc. with a binder resin. For example, it is made by slidingly contacting the surface of a flexible magnetic disk, magnetic tape, etc. It is widely used for polishing minute protrusions on surfaces to make them smooth. (Japanese Patent Publication No. 53-44714) [Problems to be Solved by the Invention] However, in this type of conventional polishing sheet, the polishing layer is hard and strong, so that the polishing layer may not be polished into the microprotrusions to be polished. Some of them fall off as lumps, which adhere to the surface of the polishing sheet and tend to cause scratches on the surface of the magnetic layer.
この発明はかかる現状に鑑み種々検討を行った結果なさ
れたもので、研磨層の結合剤樹脂として１００％モジュ
ラスが１００ｋｇ／Ｃｆｌ！以下のものを使用すること
によって、フレキシブル磁気ディスク、磁気テープ等の
磁性層表面を、スクラッチ傷を発生させることなく平滑
に研磨し、磁気記録再生時にスクラッチ傷によるドロッ
プアウトが生じないようにしたものである。This invention was made as a result of various studies in view of the current situation, and the 100% modulus of the binder resin for the polishing layer is 100 kg/Cfl! By using the following materials, the surface of the magnetic layer of flexible magnetic disks, magnetic tapes, etc. is polished smoothly without scratches, and dropouts due to scratches do not occur during magnetic recording and playback. It is.
この発明において、研磨層に使用する結合剤樹脂は、１
００％モジュラスが１ ０ ０ ｋｇ／ｃＪ以下のもの
が好ましく使用され、ポリウレタン樹脂の場合は１００
％モジュラスが１ ０ ０ ｋｇ／ｃｆｆｌ以下で、さ
らにガラス転移温度がＯ〜−４０℃のポリウレタン樹脂
が好ましく使用される。この種の結合剤樹脂は、比較的
柔らかく強度もそれほど大きくないため、この種の樹脂
を用いて研磨層を形戒すると、研磨層の強度が磁性層か
ら微小突起を塊のまま脱落させるほど強靭にならず、砥
粒を充分に保持して研磨機能を発揮する。しかして、こ
のような研磨層を設けた研磨シートを用いて、フレキシ
ブル磁気ディスク、磁気テープ等の磁性層表面を研磨す
ると、磁性層表面の微小突起が塊のまま脱落することも
なく、徐々に微小突起の突起部だけが研磨される．従っ
て、微小突起の脱落物が研磨シートの表面に付着するこ
ともなく、この微小突起の脱落物によるフレキシブル磁
気ディスク、磁気テープ等の磁性層表面のスクラッチ傷
の発生も無くて、磁性層表面を平滑に研磨することがで
きる。そして、磁気記録再生時のスクラッチ傷によるド
ロップアウトの発生が防止される。In this invention, the binder resin used in the polishing layer is 1
00% modulus of 100 kg/cJ or less is preferably used, and in the case of polyurethane resin, 100% modulus is used.
A polyurethane resin having a % modulus of 100 kg/cffl or less and a glass transition temperature of 0 to -40°C is preferably used. This type of binder resin is relatively soft and does not have much strength, so if you use this type of resin to form a polishing layer, the strength of the polishing layer will be strong enough to cause microprotrusions to fall off from the magnetic layer in their entirety. It retains abrasive grains sufficiently and performs its polishing function. However, when the surface of the magnetic layer of a flexible magnetic disk, magnetic tape, etc. is polished using an abrasive sheet provided with such an abrasive layer, the minute protrusions on the surface of the magnetic layer do not fall off as lumps, but are gradually removed. Only the protrusions of the microprotrusions are polished. Therefore, the fallen particles of minute protrusions do not adhere to the surface of the polishing sheet, and the scratches on the surface of the magnetic layer of flexible magnetic disks, magnetic tapes, etc. due to the fallen particles of minute protrusions do not occur. Can be polished smooth. This prevents dropouts from occurring due to scratches during magnetic recording and reproduction.
このような結合剤樹脂を含む研磨層は、これらの１００
％モジュラスが１ ０ ０ ｋｇ／ｃｎ！以下の結合剤
樹脂、もしくは１００％モジュラスが１００ｋｇ／ ｃ
ｎｌ以下で、ガラス転移温度が０〜−４０℃のポリウレ
タン樹脂を、研磨砥粒、有機溶剤等とともに混合分散し
て研磨塗料を調製し、この研磨塗料を基体上に塗布、乾
燥して形威される。１００％モジュラスが１ ０ ０
ｋｇ／ｃｎｌ以下の結合剤樹脂としては、いずれも１０
０％モジュラスが１００ｋｇ／ｃｆｆｌ以下の塩化ビニ
ルー酢酸ビニル系共重合体、ポリビニルプチラール系樹
脂、繊維素系樹脂、ポリエステル系樹脂、エポキシ系樹
脂、ポリエーテル系樹脂など従来から汎用されている結
合剤樹脂がいずれも好適に使用され、具体例としては、
たとえば、東洋紡社製；バイロン３００，ユニチカ社製
． ＵＥ−３ ２ ２ ０などが挙げられる。また、ｌ
００％モジュラスが１００ｋｇ／ＣＩａ以下で、ガラス
転移温度がＯ〜−４０℃のポリウレタン樹脂としては、
たとえば、大日本インキ化学工業社製；パンデックスＴ
−５２０１、大日インキ化学工業社製；バンデックスＨ
ｌ−２０００，日本ポリウレタン工業社製．Ｎ−２３０
４、日本ポリウレタン工業社製；Ｎ−３１１３などが好
適なものとして使用される。The polishing layer containing such a binder resin is made of these 100
% modulus is 100 kg/cn! The following binder resin or 100% modulus is 100kg/c
An abrasive paint is prepared by mixing and dispersing a polyurethane resin with a glass transition temperature of 0 to -40°C with abrasive grains, an organic solvent, etc., and this abrasive paint is applied onto a substrate, dried, and shaped. be done. 100% modulus is 1 0 0
As for the binder resin below kg/cnl, all of them are 10
Conventionally widely used binders such as vinyl chloride-vinyl acetate copolymers with a 0% modulus of 100 kg/cffl or less, polyvinyl butyral resins, cellulose resins, polyester resins, epoxy resins, and polyether resins. All resins are preferably used, and specific examples include:
For example, manufactured by Toyobo Co., Ltd.; Byron 300, manufactured by Unitika Co., Ltd. Examples include UE-3220. Also, l
As a polyurethane resin with a 00% modulus of 100 kg/CIa or less and a glass transition temperature of O to -40°C,
For example, manufactured by Dainippon Ink and Chemicals; Pandex T
-5201, manufactured by Dainichi Ink Chemical Industries, Ltd.; Bandex H
l-2000, manufactured by Nippon Polyurethane Industries. N-230
4. N-3113 manufactured by Nippon Polyurethane Kogyo Co., Ltd. is preferably used.
このような１００％モジュラスが１ ０ ０ ｋｇ／ｃ
＋ｆｌ以下の結合剤樹脂、および１００％モジュラスが
１ ０ ０ ｋｇ／ｄ以下で、ガラス転移温度が０〜−
４０℃のポリウレタン樹脂は、単独で使用する他、従来
から汎用されている塩化ビニルー酢酸ビニル系共重合体
、ポリビニルブチラール系樹脂、繊維素系樹脂、ポリエ
ステル系樹脂、エポキシ系樹脂、ポリエーテル系樹脂、
イソシアネート化合物、放射線硬化型樹脂等と併用して
もよく、併用する場合の配合割合は、併用する他の結合
剤樹脂より多くなるようにするのが好ましい。Such a 100% modulus is 100 kg/c
+ fl or less binder resin, 100% modulus is 100 kg/d or less, and glass transition temperature is 0 to -
Polyurethane resins at 40°C can be used alone, as well as conventionally widely used vinyl chloride-vinyl acetate copolymers, polyvinyl butyral resins, cellulose resins, polyester resins, epoxy resins, and polyether resins. ,
It may be used in combination with isocyanate compounds, radiation-curable resins, etc., and when used in combination, the blending ratio is preferably greater than that of other binder resins used in combination.
研磨層に使用される研磨砥粒としては、適度な？度を有
し、磁性層表面を平滑に研磨できるものが好ましく使用
され、たとえば、Ａ１■○，粉末、Ｃｒ．０．粉末、Ｓ
ｉｎ．粉末、ＳｉＣ粉末などが、単独または２種以上混
合して使用される。Is it appropriate for the abrasive grains used in the polishing layer? Preferably, those having a hardness and capable of polishing the surface of the magnetic layer smoothly are used, such as A1■○, powder, Cr. 0. powder, S
in. Powder, SiC powder, etc. may be used alone or in combination of two or more.
使用量は、充分な研磨効果を発揮させるため、研磨層中
の全固形或分に対して２０〜９０重量％の範囲内で使用
するのが好ましく、５０〜９０重景％の範囲内で使用す
るのがより好ましい。The amount used is preferably within the range of 20 to 90% by weight based on the total solids in the polishing layer, and within the range of 50 to 90% by weight, in order to exhibit a sufficient polishing effect. It is more preferable to do so.
有機溶剤としては、アセトン、メチルイソブチルケトン
、メチルエチルケトン、シクロヘキサノン、トルエン、
酢酸エチル、テトラヒドロフラン、ジメチルホルムアミ
ドなど従来一般に使用される有機溶剤がいずれも単独で
、或いは二種以上混合して使用される。Organic solvents include acetone, methyl isobutyl ketone, methyl ethyl ketone, cyclohexanone, toluene,
Conventionally conventional organic solvents such as ethyl acetate, tetrahydrofuran, and dimethylformamide can be used alone or in combination of two or more.
なお、研磨層中には、通常使用されている各種添加剤、
たとえば、潤滑剤、分散剤、充填剤などを適宜に添加使
用してもよい。The polishing layer contains various commonly used additives,
For example, a lubricant, a dispersant, a filler, etc. may be added as appropriate.
次に、この発明の実施例について説明する。 Next, embodiments of the invention will be described.
実施例１
α−Ａ１２０，粉末 ８０重量部（粒子径
■μｍ）
パンデックスＴ−５２０１（大日本 ２０〃インキ化
学工業社製；ボリウ
レタン樹脂、１００％モジュ
ラス１０ｋｇ／ｃｍ２，ガラス転移
温度−３０℃）
メチルエチルケトン ２０〃トルエン
８０〃この組成物をボール逅ル中で
４８時間混合分散して研磨塗料を調製し、この研磨塗料
を厚さ３８μｍのポリエステルフィルム上に、乾燥厚が
約１５μｍとなるように塗布、乾燥して研磨層を形威し
た。次いで、これを所定の幅に裁断して研磨シートを作
製した。Example 1 α-A120, powder 80 parts by weight (particle size μm) Pandex T-5201 (Dainippon 20〃Ink Kagaku Kogyo Co., Ltd.; polyurethane resin, 100% modulus 10 kg/cm2, glass transition temperature -30°C ) Methyl ethyl ketone 20 Toluene
80〃This composition was mixed and dispersed in a bowl for 48 hours to prepare an abrasive paint, and this abrasive paint was applied onto a polyester film with a thickness of 38 μm to a dry thickness of about 15 μm, and dried. The polishing layer is shaped. Next, this was cut into a predetermined width to produce an abrasive sheet.
実施例２
実施例１における研磨塗料の組威において、パンデック
スＴ−５２０１に代えて、パンデックスＨＩ−２０００
（大日本インキ化学工業社製；ポリウレタン樹脂、１
００％モジュラス３５ｋｇ／ｃｎｆ、ガラス転移温度−
５℃）を同量使用した以外は、実施例１と同様にして研
磨シートを作製した。Example 2 In the composition of the polishing paint in Example 1, Pandex HI-2000 was used instead of Pandex T-5201.
(Manufactured by Dainippon Ink and Chemicals; polyurethane resin, 1
00% modulus 35kg/cnf, glass transition temperature -
A polishing sheet was prepared in the same manner as in Example 1, except that the same amount of 5°C) was used.
実施例３
実施例１における研磨塗料の組戒において、パンデック
スＴ−５２０１に代えて、バイロン３００（東洋紡社製
；ポリエステル樹脂、１００％モジュラス２０ｋｇ／ｃ
ｆｆｌ，ガラス転移温度−６℃）を同量使用した以外は
、実施例１と同様にして研磨シートを作製した。Example 3 In the composition of the polishing paint in Example 1, Byron 300 (manufactured by Toyobo Co., Ltd.; polyester resin, 100% modulus 20 kg/c) was used instead of Pandex T-5201.
A polishing sheet was prepared in the same manner as in Example 1, except that the same amount of FFL (glass transition temperature -6° C.) was used.
実施例４
実施例１における研磨塗料の組成において、バンデック
スＴ−５２０１に代えて、Ｎ−２３０４（日本ポリウレ
タン工業社製：ポリウレタン樹脂、１００％モジュラス
１ ５ 〜３ ０ ｋｇ／ ｃｆｆｌ，ガラス転移温度
−２３℃）を同量使用した以外は、実施例１と同様にし
て研磨シートを作製した。Example 4 In the composition of the polishing paint in Example 1, Bandex T-5201 was replaced with N-2304 (manufactured by Nippon Polyurethane Industries Co., Ltd.: polyurethane resin, 100% modulus 15-30 kg/cffl, glass transition temperature An abrasive sheet was prepared in the same manner as in Example 1, except that the same amount of (-23°C) was used.
実施例５
実施例１における研磨塗料の組戒において、バンデック
スＴ−５２０１に代えて、Ｎ−３１１３（日本ポリウレ
タン工業社製；ポリウレタン樹脂、１００％モジュラス
６６ｋｇ／ｃｆｆｌ，ガラス転移温度−３７℃）を同量
使用した以外は、実施例１と同様にして研磨シートを作
製した。Example 5 In the composition of the polishing paint in Example 1, N-3113 (manufactured by Nippon Polyurethane Industry Co., Ltd.; polyurethane resin, 100% modulus 66 kg/cffl, glass transition temperature -37°C) was used instead of Bandex T-5201. A polishing sheet was produced in the same manner as in Example 1, except that the same amount of was used.
比較例１
実施例ｌにおける研磨塗料の岨或において、パンデソク
スＴ−５２０１に代えて、Ｎ２３０１（日本ポリウレタ
ン工業社製；ポリウレタン樹脂、１００％モジュラス１
７ ０ 〜２ ３ ０ｋｇ／ｃｎｌ、ガラス転移温度
２２℃）を同量使用した以外は、実施例１と同様にして
研磨シートを作製した。Comparative Example 1 In the polishing paint of Example 1, N2301 (manufactured by Nippon Polyurethane Industry Co., Ltd.; polyurethane resin, 100% modulus 1) was used instead of Pandesox T-5201.
A polishing sheet was produced in the same manner as in Example 1, except that the same amount of 70 to 230 kg/cnl, glass transition temperature 22°C) was used.
比較例２
実施例１における研磨塗料の組或において、バンデック
スＴ−５２０１に代えて、パラブレン２６３（日本ポリ
ウレタン工業社製；ポリウレタン樹脂、１００％モジュ
ラス１２０ｋｇ／ｃ這、ガラス転移温度−２６℃）を同
量使用した以外は、実施例１と同様にして研磨シートを
作製した。Comparative Example 2 In the polishing paint composition in Example 1, Parabrene 263 (manufactured by Nippon Polyurethane Industries Co., Ltd.; polyurethane resin, 100% modulus 120 kg/c, glass transition temperature -26°C) was used instead of Bandex T-5201. A polishing sheet was produced in the same manner as in Example 1, except that the same amount of was used.
比較例３
実施例１における研磨塗料の組成において、バンデック
スＴ−５２０１に代えて、ＣＡ−３ １ ０（モートン
社製；ポリウレタン樹脂、１００％モジュラス１９５ｋ
ｇ／ｃＪ、ガラス転移温度４３℃）を同量使用した以外
は、実施例１と同様にして研磨シートを作製した。Comparative Example 3 In the composition of the polishing paint in Example 1, CA-3 10 (manufactured by Morton; polyurethane resin, 100% modulus 195k) was used instead of Bandex T-5201.
A polishing sheet was prepared in the same manner as in Example 1, except that the same amount of the polishing material (g/cJ, glass transition temperature 43° C.) was used.
比較例４
実施例ｌにおける研磨塗料の組或において、パンデック
スＴ−５２０１に代えて、エスタン５７４０ＸＯ６９１
（グッドリッヂ社製；ポリウレタン樹脂、１００％
モジュラス２ ４ ０ ｋｇ／ｃｆｆｌ，ガラス転移温
度４２℃）を同量使用した以外は、実施例１と同様にし
て研磨シートを作製した。Comparative Example 4 In the polishing paint composition in Example 1, Estan 5740XO691 was used instead of Pandex T-5201.
(Manufactured by Goodridge; polyurethane resin, 100%
An abrasive sheet was prepared in the same manner as in Example 1, except that the same amount of 240 kg/cffl (modulus: 240 kg/cffl, glass transition temperature: 42° C.) was used.
各実施例および比較例で得られた研磨シートを用いてフ
レキシブル磁気ディスクを研磨し、磁性層表面のスクラ
ッチ傷の有無および脱落物の付着を調べた。Flexible magnetic disks were polished using the polishing sheets obtained in the Examples and Comparative Examples, and the presence or absence of scratches on the surface of the magnetic layer and adhesion of fallen substances were examined.
下記第１表はその結果である。Table 1 below shows the results.
第１表
〔発明の効果〕
上記第１表から明らかなように、この発明で得られた研
磨シート（実施例エないし５）は、比較例エないし４で
得られた研磨シートに比し、スクラッチ傷がなくて、脱
落物の付着もなく、このことからこの発明で得られた研
磨シートは、スクラッチ傷を発生させることなく磁気記
録媒体などの磁性層表面を平滑に研磨できることがでわ
かる。Table 1 [Effects of the Invention] As is clear from Table 1 above, the polishing sheets obtained in the present invention (Examples D to 5) have a lower There were no scratches and there was no adhesion of fallen matter, which shows that the polishing sheet obtained by the present invention can polish the surface of the magnetic layer of a magnetic recording medium etc. smoothly without generating scratches.
Claims (1)
＾２以下の結合剤樹脂を研磨砥粒等とともに含む研磨層
を設けたことを特徴とする研磨シート２、結合剤樹脂が
、１００％モジュラスが１００ｋｇ／ｃｍ＾２以下で、
ガラス転移温度が０〜−４０℃のポリウレタン樹脂であ
る請求項１記載の研磨シート1. On the substrate, 100% modulus is 100 kg/cm
A polishing sheet 2 characterized in that a polishing layer containing a binder resin of ^2 or less together with abrasive grains etc. is provided, the binder resin has a 100% modulus of 100 kg/cm^2 or less,
The polishing sheet according to claim 1, which is a polyurethane resin having a glass transition temperature of 0 to -40°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1304217A JP2987383B2 (en) | 1989-11-21 | 1989-11-21 | Polishing sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1304217A JP2987383B2 (en) | 1989-11-21 | 1989-11-21 | Polishing sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03166061A true JPH03166061A (en) | 1991-07-18 |
| JP2987383B2 JP2987383B2 (en) | 1999-12-06 |
Family
ID=17930418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1304217A Expired - Fee Related JP2987383B2 (en) | 1989-11-21 | 1989-11-21 | Polishing sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2987383B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006231429A (en) * | 2005-02-22 | 2006-09-07 | Inoac Corp | Polishing pad and its manufacturing method |
| JP2010201558A (en) * | 2009-03-03 | 2010-09-16 | Fujibo Holdings Inc | Polishing tape |
| CN105651654A (en) * | 2015-12-30 | 2016-06-08 | 平顶山易成新材料有限公司 | Method for detecting scratch degree of silicon carbide powder for precision grinding |
-
1989
- 1989-11-21 JP JP1304217A patent/JP2987383B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006231429A (en) * | 2005-02-22 | 2006-09-07 | Inoac Corp | Polishing pad and its manufacturing method |
| JP2010201558A (en) * | 2009-03-03 | 2010-09-16 | Fujibo Holdings Inc | Polishing tape |
| CN105651654A (en) * | 2015-12-30 | 2016-06-08 | 平顶山易成新材料有限公司 | Method for detecting scratch degree of silicon carbide powder for precision grinding |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2987383B2 (en) | 1999-12-06 |
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