JPH0316389U - - Google Patents
Info
- Publication number
- JPH0316389U JPH0316389U JP7485189U JP7485189U JPH0316389U JP H0316389 U JPH0316389 U JP H0316389U JP 7485189 U JP7485189 U JP 7485189U JP 7485189 U JP7485189 U JP 7485189U JP H0316389 U JPH0316389 U JP H0316389U
- Authority
- JP
- Japan
- Prior art keywords
- threaded portion
- semiconductor component
- male threaded
- mounting member
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Description
第１図は本考案に係る半導体部品の実装構造の
一実施例の拡大断面図、第２図は円筒状部材の拡
大断面図、第３図は従来の回路ユニツトの中継器
長手方向より見た図、第４図は第３図の回路ユニ
ツトの要部断面側面図、第５図はツエナーダイオ
ードの従来の取付け構造の拡大断面図である。
１……円筒状部材、５３……ツエナーダイオー
ド、５４……取付け金具、５４ａ，５６ａ……開
孔、５３ｄ……雄ねじ部、５６……絶縁板、６０
……ナツト。
Fig. 1 is an enlarged sectional view of an embodiment of a semiconductor component mounting structure according to the present invention, Fig. 2 is an enlarged sectional view of a cylindrical member, and Fig. 3 is a conventional circuit unit seen from the longitudinal direction of a repeater. 4 is a sectional side view of a main part of the circuit unit shown in FIG. 3, and FIG. 5 is an enlarged sectional view of a conventional mounting structure for a Zener diode. DESCRIPTION OF SYMBOLS 1... Cylindrical member, 53... Zener diode, 54... Mounting metal fittings, 54a, 56a... Hole, 53d... Male threaded part, 56... Insulating plate, 60
...Natsuto.
Claims (1)
取付け部材５４及び絶縁板５６の開孔にこの順序
で貫通せしめ、該雄ねじ部５３ｄの貫通側に雌ね
じ部材６０を螺着して半導体部品５３を取付け部
材５４に絶縁取付けする半導体部品の実装構造に
おいて、取付け部材５４及び絶縁板５６の開孔５
４ａ，５６ａの内周面とこれに対向する該雄ねじ
部５３ｄの外周面との間に、両者を隔離し得る絶
縁性の円筒状部材１を介在せしめたことを特徴と
する半導体部品の実装構造。 The male threaded portion 53d of the semiconductor component 53 is passed through at least the mounting member 54 and the opening of the insulating plate 56 in this order, and the female threaded member 60 is screwed onto the penetrating side of the male threaded portion 53d to attach the semiconductor component 53 to the mounting member 54. In a mounting structure for semiconductor components to be mounted insulated, the mounting member 54 and the opening 5 in the insulating plate 56
A semiconductor component mounting structure characterized in that an insulating cylindrical member 1 is interposed between the inner circumferential surfaces of 4a and 56a and the outer circumferential surface of the male threaded portion 53d opposing thereto. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485189U JPH0316389U (en) | 1989-06-28 | 1989-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485189U JPH0316389U (en) | 1989-06-28 | 1989-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316389U true JPH0316389U (en) | 1991-02-19 |
Family
ID=31614908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7485189U Pending JPH0316389U (en) | 1989-06-28 | 1989-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316389U (en) |
-
1989
- 1989-06-28 JP JP7485189U patent/JPH0316389U/ja active Pending