JPH0316275Y2 - - Google Patents
Info
- Publication number
- JPH0316275Y2 JPH0316275Y2 JP2501486U JP2501486U JPH0316275Y2 JP H0316275 Y2 JPH0316275 Y2 JP H0316275Y2 JP 2501486 U JP2501486 U JP 2501486U JP 2501486 U JP2501486 U JP 2501486U JP H0316275 Y2 JPH0316275 Y2 JP H0316275Y2
- Authority
- JP
- Japan
- Prior art keywords
- fitting
- insulating plate
- lead wire
- sealing body
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 36
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2501486U JPH0316275Y2 (US06559137-20030506-C00071.png) | 1986-02-21 | 1986-02-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2501486U JPH0316275Y2 (US06559137-20030506-C00071.png) | 1986-02-21 | 1986-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62138436U JPS62138436U (US06559137-20030506-C00071.png) | 1987-09-01 |
JPH0316275Y2 true JPH0316275Y2 (US06559137-20030506-C00071.png) | 1991-04-08 |
Family
ID=30824769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2501486U Expired JPH0316275Y2 (US06559137-20030506-C00071.png) | 1986-02-21 | 1986-02-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0316275Y2 (US06559137-20030506-C00071.png) |
-
1986
- 1986-02-21 JP JP2501486U patent/JPH0316275Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS62138436U (US06559137-20030506-C00071.png) | 1987-09-01 |