JPH03162575A - Stainless jig - Google Patents
Stainless jigInfo
- Publication number
- JPH03162575A JPH03162575A JP30350289A JP30350289A JPH03162575A JP H03162575 A JPH03162575 A JP H03162575A JP 30350289 A JP30350289 A JP 30350289A JP 30350289 A JP30350289 A JP 30350289A JP H03162575 A JPH03162575 A JP H03162575A
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- jig
- layer
- sus
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011247 coating layer Substances 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 238000004544 sputter deposition Methods 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010935 stainless steel Substances 0.000 claims abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 8
- 238000007733 ion plating Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 238000007738 vacuum evaporation Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 6
- 238000009713 electroplating Methods 0.000 abstract description 5
- 239000010409 thin film Substances 0.000 abstract description 5
- 238000001771 vacuum deposition Methods 0.000 abstract description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 18
- 239000010936 titanium Substances 0.000 description 18
- 229910052719 titanium Inorganic materials 0.000 description 18
- 238000000576 coating method Methods 0.000 description 16
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 15
- 229910052721 tungsten Inorganic materials 0.000 description 15
- 239000010937 tungsten Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 description 1
- 229940005991 chloric acid Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子工業界、電気機器材料等で使用されるイ
オンプレーティング、真空蒸着法、スパッタリングの薄
膜形或装置に用いる治具に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a jig used for thin film type or equipment for ion plating, vacuum evaporation, and sputtering used in the electronic industry, electrical equipment materials, etc. It is.
（従来技術とその問題点）
近年、半導体、特にＩＣの集積度が高くなり、その技術
は急速に伸びている。(Prior art and its problems) In recent years, the degree of integration of semiconductors, especially ICs, has increased, and the technology thereof has been rapidly growing.
これらの集積度が高くなればなるほど、ＩＣの回路幅、
回路の厚さ等がサブミクロンの領域になり、ファインパ
ターン形成するうえで超クリーンルームが必要条件にな
ってきている。The higher the degree of integration, the wider the IC circuit width.
The thickness of circuits is now in the submicron range, and ultra-clean rooms are becoming a necessary condition for forming fine patterns.
一方、サブミクロンの回路ができれば、Ｓｉウエハーや
回路材料の材質により拡散が生じ、ａｔ１ｏｙスパイク
を生じ特性上悪影響を発生させる。On the other hand, if a submicron circuit is created, diffusion will occur due to the Si wafer or the material of the circuit material, causing an at1oy spike and causing an adverse effect on the characteristics.
このａｌｌｏｙスパイクを防止させるために、拡散防止
のバリャーが必要で、タングステン、チタンまたはこれ
らの合金が使用されている。 これらの金属は、大気中
では安定で薬品にも腐蝕しにくく、現在イオンプレーテ
ィング、真空蒸着法、スパッタリングの薄膜形成装置に
用いる治具に付着したタングステン、チタンまたはこれ
らの合金被膜は、機械的な処理方法として、ホーニング
やブラスト等で除去しているが、機械的な処理方法とし
て付着した被膜を除去した場合、治具のＳＵＳベース材
料に食い込むことが多く、その後に洗浄しても取りきれ
ないという欠点があり、付着物を取りきれないまま、半
導体製造に使用すると、微細な付着物が治工具から落ち
、ＩＣ等の回路形成上パーティクル等の障害を生じてい
る。To prevent this alloy spike, a diffusion barrier is required, and tungsten, titanium, or an alloy thereof is used. These metals are stable in the atmosphere and are not easily corroded by chemicals.Currently, tungsten, titanium, or their alloy coatings attached to jigs used in thin film forming equipment for ion plating, vacuum evaporation, and sputtering cannot be mechanically coated. As a treatment method, it is removed by honing, blasting, etc., but when removing the adhered film using a mechanical treatment method, it often digs into the SUS base material of the jig, and it cannot be removed even after cleaning. If it is used in semiconductor manufacturing without removing the deposits, the fine deposits will fall off the jigs and tools, causing problems such as particles in the formation of circuits such as ICs.
そこで、薬品によるクリーニングで治具に付着したタン
グステン、チタンまたはこれらの合金被膜を除去し、し
かも該付着物を取り除いた後の治具を再使用させるに障
害のないものとしているが治具のＳＵＳベース材料を腐
蝕させないで除去するには限られた種類の薬品を使用す
ることとなり治具に付着したタングステン、チタンまた
はこれらの合金被膜を完全に除去させるのに極めて多く
の労力を要している。Therefore, we remove the tungsten, titanium, or these alloy coatings that have adhered to the jig by cleaning with chemicals, and after removing the adhesion, the jig is safe to reuse, but the SUS of the jig is A limited number of chemicals are used to remove the base material without corroding it, and it takes an extremely large amount of effort to completely remove the tungsten, titanium, or these alloy coatings that adhere to the jig. .
（発明の目的）
本発明は、前記従来法の欠点を解決するために或された
もので、薬品によるクリーニングで治具に付着したタン
グステン、チタンまたはこれらの合金被膜を除去し、し
かも該付着物を取り除いた後の治具が再使用させるに障
害のない治具を提供することを目的とする。(Object of the Invention) The present invention was created to solve the drawbacks of the conventional method, and it is possible to remove tungsten, titanium, or their alloy coatings attached to a jig by cleaning with chemicals, and to remove the deposits. The purpose of the present invention is to provide a jig that can be reused after removal without any hindrance.
（問題点を解決するための手段）
本発明は、イオンプレーティング、スパッタリングおよ
び真空蒸着用ステンレス製治具において、該ステンレス
製治具の蒸着金属等が付着する面側に、第一の被覆層に
金またはニッケルの被覆層を形成し、第二の被覆層とし
て銀および／または銅の被覆層が形成されて成るステン
レス製治具である。(Means for Solving the Problems) The present invention provides a stainless steel jig for ion plating, sputtering, and vacuum deposition, in which a first coating layer is provided on the side of the stainless steel jig to which vapor-deposited metal, etc. adheres. This is a stainless steel jig having a gold or nickel coating layer formed thereon, and a silver and/or copper coating layer formed as a second coating layer.
まず、ステンレス製治具を使用する前に予めタングステ
ン、チタンまたはこれらの合金被膜の付着する面側に第
一の被覆層として金またはニッケルの被覆層を形成し、
次いで、第二の被覆層として銀および／または銅の被覆
層を形成させる。First, before using the stainless steel jig, a gold or nickel coating layer is formed as a first coating layer on the side to which the tungsten, titanium, or alloy coating of these is to be attached.
Next, a silver and/or copper coating layer is formed as a second coating layer.
前記第一の被覆層として金またはニッケルとするのはＳ
ＵＳベース材料と第二の被覆層である銀および／または
銅の被覆層の密着性を高める効果があるとともに、治具
に付着したタングステン、チタンまたはこれらの合金被
膜を除去するため薬品によるクリーニングの際に除去の
程度を目視で判断するに適するからであり、また、第二
の被覆層を形成している銀および／または銅の被覆層と
の対蘂品特性が異なるものであるからである。The first coating layer is made of gold or nickel.
It has the effect of increasing the adhesion between the US base material and the second coating layer of silver and/or copper, and also uses chemical cleaning to remove tungsten, titanium, or their alloy coatings that adhere to the jig. This is because it is suitable for visually determining the extent of removal, and also because the anti-coating properties are different from those of the silver and/or copper coating layer forming the second coating layer. .
なお、金またはニッケルの被覆層の厚みは０． １μｍ
以上であればよいものである。Note that the thickness of the gold or nickel coating layer is 0. 1μm
Any above is sufficient.
前記第二の被覆層として銀および／または銅の被覆層と
するのは、ＳＵＳベース材料を腐蝕しにくい薬品として
硝酸、シアン等に容易に溶解するため治具に付着したタ
ングステン、チタンまたはこれらの合金被膜をはがし易
くなるという効果かある。The second coating layer is made of silver and/or copper because it easily dissolves in nitric acid, cyanide, etc. as a chemical that does not easily corrode the SUS base material. This has the effect of making it easier to peel off the alloy coating.
また、該第二の被覆層の厚みは０，２〜２０μｍでよい
もので、０．２μｍ以下では第二の被覆層からはがれに
くく、２０μｍ以上では経済的に不利となるからである
。Further, the thickness of the second coating layer may be 0.2 to 20 μm; if it is less than 0.2 μm, it will be difficult to peel off from the second coating layer, and if it is more than 20 μm, it will be economically disadvantageous.
なお、前記第一の披覆層および第二の被覆層を形成させ
る方法としては、電気メッキ法、スパッタリング、また
はイオンプレーチイングにより選んで行うことが良く、
ＳＵＳベース材料を痛めることなく、被覆層の厚みを調
節し易く、緻密で密着性のよい被覆層が得られるからで
ある。The method for forming the first covering layer and the second covering layer may be selected from electroplating, sputtering, or ion plating.
This is because the thickness of the coating layer can be easily adjusted without damaging the SUS base material, and a dense coating layer with good adhesion can be obtained.
以下、本発明に係わる実施例を記載するが、該実施例は
本発明を限定するものではない。Examples related to the present invention will be described below, but the examples are not intended to limit the present invention.
（実施例ｌ）
治具であるＳＵＳ製のプラネタリドーム（直径４８０ｎ
＋ｍ）に予め第一の被覆層として金を０． ２μｍ電
気メッキしたのち、次いで第二の被覆層として銀を０．
２μｍ電気メッキしたのちスパッタリング装置内にセッ
トしてチタンの薄膜を形成させる操作をした。(Example 1) A planetary dome made of SUS (diameter 480n) was used as a jig.
+m) in advance with 0.0% gold as a first coating layer. After 2 μm electroplating, a second coating layer of 0.0 μm silver was applied.
After electroplating to a thickness of 2 μm, the sample was placed in a sputtering device to form a thin titanium film.
上記第一の被覆層に金を第二の被覆層に銀をメッキした
ＳＵＳ製のプラネタリドームに付着したチタン被膜（膜
厚５００〜１０００μｍ）を、純水で十分に洗浄した後
、ＳＵＳ製の容器に入れ希硝酸（硝酸１容量：水ｌ容量
）に過酸化水素を滴下しながら加えて加熱して液温６５
°Ｃにし、反応させたところ、第二の被覆層の銀が溶解
しチタン被膜が浮き上がりはがれて除去され金色の第一
の被覆層か目視で確認されたところでＳＵＳ製のプラネ
タリドームを取り出した。After thoroughly washing the titanium film (film thickness 500 to 1000 μm) attached to the SUS planetary dome with gold plating on the first coating layer and silver plating on the second coating layer with pure water, Add hydrogen peroxide dropwise to dilute nitric acid (1 volume of nitric acid: 1 volume of water) in a container and heat until the liquid temperature reaches 65.
℃ and allowed to react, the silver in the second coating layer was dissolved and the titanium coating was lifted up and peeled off. When the gold-colored first coating layer was visually confirmed, the SUS planetary dome was taken out.
次いで、純水で洗浄したのち、７０℃の温純水で十分に
洗浄した。Next, it was washed with pure water, and then thoroughly washed with warm pure water at 70°C.
また、ＳＵＳ製のプラネタリドームの腐蝕状況を拡大し
て観察したところ、何ら変化はみられなかった。Further, when the corrosion status of the SUS planetary dome was observed under magnification, no change was observed.
（実施例２）
ＳＵＳ製のホルダと防着板（幅３００ｍｍＸ長さ４５０
ｍｍ）に予め第一の被覆層として金を０．１μｍ電気メ
ッキしたのち、次いで第二の被覆層として銅を５．０μ
ｍ電気メッキしたのちスパッタリング装置内にセットし
てタングステンの薄膜を形成させる操作をした。(Example 2) SUS holder and anti-adhesion plate (width 300mm x length 450mm)
mm) was electroplated in advance with 0.1 μm of gold as a first coating layer, and then with 5.0 μm of copper as a second coating layer.
After electroplating, the sample was placed in a sputtering device to form a thin tungsten film.
上記第一の被覆層に金を第二の被覆層に銅をメッキした
ＳＵＳ製のホルダと防着板に付着したタングステン被膜
（膜厚５００〜１０００μｍ）を、純水で十分に洗浄し
た後、ＳＵＳ製の容器に入れ希硝酸（硝酸１容量：水【
０容量）に過酸化水素を滴下しながら加えて加熱して液
温６５℃にし、反応させたところ、第二の被覆層の銅が
溶解しタングステン被膜が浮き上がりはがれて除去され
金色の第一の被覆層が目視で確認されたところでＳＵＳ
製のホルダと防着板を取り出した。After thoroughly washing the tungsten coating (film thickness 500 to 1000 μm) attached to the SUS holder and the anti-adhesion plate in which the first coating layer is plated with gold and the second coating layer is plated with copper, with pure water, Place dilute nitric acid (1 volume of nitric acid: water) in a SUS container.
When hydrogen peroxide was added dropwise to the solution (0 volume) and heated to a temperature of 65°C to cause a reaction, the copper in the second coating layer was dissolved and the tungsten coating was lifted up and peeled off, leaving the gold-colored first coating. When the coating layer is visually confirmed, the SUS
I took out the manufactured holder and anti-adhesion plate.
次いで、純水で洗浄したのち、７０℃の温純水で十分に
洗浄した。Next, it was washed with pure water, and then thoroughly washed with warm pure water at 70°C.
また、ＳＵＳ製のプラネタリドームの腐蝕状況を拡大し
て観察したところ、何ら変化はみられなかった。Further, when the corrosion status of the SUS planetary dome was observed under magnification, no change was observed.
（実施例３）
ＳＵＳ製のプラネタリドーム（直径３００ｍｍ）に予め
ニッケルを０．２μｍ電気メッキしたのち、次いで銅を
１． ０μｍ電気メッキし、スパッタリング装置内に
セットしてタングステンとチタンの薄膜を形成させる操
作をした。(Example 3) A SUS planetary dome (diameter 300 mm) was electroplated with nickel to a thickness of 0.2 μm, and then copper was plated to a thickness of 1.5 μm. It was electroplated to a thickness of 0 μm and placed in a sputtering device to form a thin film of tungsten and titanium.
上記第一の被覆層にニッケルを第二の被覆層に銅をメッ
キしたＳＵＳ製のプラネタリドームに付着したタングス
テンとチタンの層状の被膜（膜厚５００〜１０００μｍ
）を、純水で十分に洗浄した後、ＳＵＳ製の容器に入れ
シアン系の銅エッチング液（シアン化カリウム５ ０
ｇ／ｌ．、水酸化カリウム７．５ｇ／Ａ、剥離剤（商品
名Ｎソルト）１３ｇ／Ｉ！．）を、Ｐ． Ｖ． Ｃ槽
に建浴し、４０〜５０℃に加温してから、前記ブラネタ
リドームを一昼夜浸漬した。A layered coating of tungsten and titanium (film thickness 500 to 1000 μm) adhered to the SUS planetary dome in which the first coating layer is plated with nickel and the second coating layer is plated with copper.
) with pure water, put it in a SUS container and add a cyanide-based copper etching solution (potassium cyanide 50
g/l. , potassium hydroxide 7.5g/A, stripping agent (trade name N Salt) 13g/I! ．． ), P. V. A bath was prepared in Tank C, heated to 40 to 50°C, and then the Blanetari dome was immersed for one day and night.
第二の披覆層の銅が溶解しタングステンとチタンの層状
の被膜が浮き上がりはがれて除去されニッケル色の第一
の被覆層が目視で確認されたところでＳＵＳ製のプラネ
タリドームを取り出した。The SUS planetary dome was taken out when the copper of the second coating layer was dissolved, the layered coating of tungsten and titanium was lifted up, peeled off, and removed, and the nickel-colored first coating layer was visually confirmed.
次いで、純水で洗浄したのち、７０°Ｃの温純水で十分
に洗浄した。Next, it was washed with pure water, and then thoroughly washed with warm pure water at 70°C.
また、ＳＵＳ製のプラネタリドームの腐蝕状況を拡大し
て観察したところ、何ら変化はみられなかった。Further, when the corrosion status of the SUS planetary dome was observed under magnification, no change was observed.
（実施例４）
ＳＵＳ製のプラネタリドーム（直径４８０ｍｍ）に予め
第一の被覆層として金を０．２μｍ電気メッキしたのち
、次いで第二の被覆層として銅を２．０μｍ電気メッキ
したのち、さらに銀を０．５μｍ電気メッキし、スパッ
タリング装置内にセットしてチタンの薄膜を形成させる
操作をした。(Example 4) A SUS planetary dome (diameter 480 mm) was electroplated with gold to a thickness of 0.2 μm as a first coating layer, then copper was electroplated to a thickness of 2.0 μm as a second coating layer, and then Silver was electroplated to a thickness of 0.5 μm, and the plate was placed in a sputtering device to form a thin titanium film.
上記第一の被覆層に金を第二の被覆層に銅と銀をメッキ
したＳＵＳ製のプラネタリドームに付着したチタン被膜
（膜厚３００〜５００μｍ）を、純水で十分に洗浄した
後、ＳＵＳ製の容器に入れ希６Ｃｊ酸（稍酸２容量：水
ＩＯ容ｍ）に過酸化水素を滴下しながら加えて加熱して
液温６５℃にし、反応させたところ、第二の被覆層の銀
と銅が溶解しチタンが浮き上がりはがれて除去され金色
の第一の被覆層が目視で確認されたところでＳＵＳ製の
プラネタリドームを取り出した。The titanium film (thickness: 300 to 500 μm) attached to the SUS planetary dome, in which the first coating layer is plated with gold and the second coating layer is plated with copper and silver, is thoroughly washed with pure water, and then the SUS Hydrogen peroxide was added dropwise to dilute 6Cj acid (2 volumes of chloric acid: IO volume of water in m) in a plastic container, heated to a liquid temperature of 65°C, and reacted. When the copper was dissolved and the titanium was lifted up and peeled off, and the golden first coating layer was visually confirmed, the SUS planetary dome was taken out.
次いで、純水で洗浄したのち、７０℃の温純水で十分に
洗浄した。Next, it was washed with pure water, and then thoroughly washed with warm pure water at 70°C.
また、ＳＵＳ製のプラネタリドームの腐蝕状況を拡大し
て観察したところ、何ら変化はみられなかった。Further, when the corrosion status of the SUS planetary dome was observed under magnification, no change was observed.
（発明の効果）
以一ヒのように、本発明の予め治具に第一の被覆層とし
て金またはニッケルの被覆を形成させ、第二の被覆層と
して銀および／または銅の被覆層を形成しておき、スパ
ッタリングや真空蒸着を行った際に付着するタングステ
ンやチタン等の被膜を薬品で処理することでタングステ
ンやチタン等を剥がして除去することができ、従来法の
欠点となる治具に食い込むことのある付着物等がなく、
しかもＳＵＳのベース材を腐蝕することもなく処理がで
き、
該治工具を再利用することができ極めて効果大なるもの
である。(Effects of the Invention) As described above, a gold or nickel coating is formed as a first coating layer on the jig of the present invention, and a silver and/or copper coating layer is formed as a second coating layer. By treating the coating of tungsten, titanium, etc. that adheres during sputtering or vacuum evaporation with chemicals, the tungsten, titanium, etc. can be peeled off and removed. There are no deposits that could dig in,
Moreover, the process can be performed without corroding the SUS base material, and the jigs and tools can be reused, which is extremely effective.
Claims (1)
空蒸着用ステンレス製治具において、該ステンレス製治
具の蒸着金属等が付着する面側に、第一の被覆層として
金またはニッケルの被覆層を形成し、第二の被覆層とし
て銀および／または銅の被覆層が形成されて成るステン
レス製治具。(1) In a stainless steel jig for ion plating, sputtering, and vacuum evaporation, a gold or nickel coating layer is formed as a first coating layer on the side of the stainless steel jig to which evaporated metal, etc. is attached, A stainless steel jig in which a silver and/or copper coating layer is formed as a second coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30350289A JPH03162575A (en) | 1989-11-22 | 1989-11-22 | Stainless jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30350289A JPH03162575A (en) | 1989-11-22 | 1989-11-22 | Stainless jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03162575A true JPH03162575A (en) | 1991-07-12 |
Family
ID=17921744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30350289A Pending JPH03162575A (en) | 1989-11-22 | 1989-11-22 | Stainless jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03162575A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020040702A (en) * | 2002-03-05 | 2002-05-30 | 김경수 | Jig Material for Hot-dip Galranized Metal Plate |
| JP2014141709A (en) * | 2013-01-23 | 2014-08-07 | Sumitomo Metal Mining Co Ltd | Deposition preventing member and film deposition apparatus comprising the same and maintenance method of deposition preventing member |
-
1989
- 1989-11-22 JP JP30350289A patent/JPH03162575A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020040702A (en) * | 2002-03-05 | 2002-05-30 | 김경수 | Jig Material for Hot-dip Galranized Metal Plate |
| JP2014141709A (en) * | 2013-01-23 | 2014-08-07 | Sumitomo Metal Mining Co Ltd | Deposition preventing member and film deposition apparatus comprising the same and maintenance method of deposition preventing member |
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