JPH0316241Y2 - - Google Patents
Info
- Publication number
- JPH0316241Y2 JPH0316241Y2 JP1987143378U JP14337887U JPH0316241Y2 JP H0316241 Y2 JPH0316241 Y2 JP H0316241Y2 JP 1987143378 U JP1987143378 U JP 1987143378U JP 14337887 U JP14337887 U JP 14337887U JP H0316241 Y2 JPH0316241 Y2 JP H0316241Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- terminal
- thermistor element
- exterior pipe
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- -1 is used Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
【考案の詳細な説明】
［産業上の利用分野］
本考案は、リード線の無いチツプ型部品として
構成されたサーミスタに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thermistor configured as a chip-type component without lead wires.
［従来の技術］
第５図で示すように、従来のサーミスタはサー
ミスタ素子１と、ガラス製の外装パイプ２と、リ
ード線３と、金属ブロツク状のスラグ端子６とか
ら成る。サーミスタ素子１は、例えば、セラミツ
クからなるサーミスタ素地４の両主面に、Ag等
からなる一対の電極５が形成されたものである。
このサーミスタ素子１の両電極５に各々スラグ端
子６を接続し、さらに該スラグ端子６に各々リー
ド線３を接続して、前記外装パイプ２に挿入す
る。そして、外装パイプ２の両端を気密に封じ、
その両端からリード線３をアキシヤル状に導出さ
せている。[Prior Art] As shown in FIG. 5, a conventional thermistor consists of a thermistor element 1, a glass exterior pipe 2, a lead wire 3, and a metal block-shaped slug terminal 6. The thermistor element 1 includes, for example, a pair of electrodes 5 made of Ag or the like formed on both main surfaces of a thermistor base 4 made of ceramic.
A slug terminal 6 is connected to both electrodes 5 of this thermistor element 1, and a lead wire 3 is connected to each of the slug terminals 6, and then inserted into the exterior pipe 2. Then, both ends of the exterior pipe 2 are hermetically sealed,
Lead wires 3 are led out in an axial manner from both ends thereof.
このような従来のサーミスタは、多くの場合配
線基板ａ等に搭載して用いられるが、その際、第
５図で示すように、封止した外装パイプ２の端部
の個所からリード線３を直角に折り曲げ、配線基
板ａの貫通孔ｂにリード線を挿入する。さらに、
配線基板ａの裏面側でリード線３の先端を折り曲
げ、該基板ａに固定する。 Such a conventional thermistor is often mounted on a wiring board a, etc., but in this case, as shown in FIG. 5, the lead wire 3 is connected from the end of the sealed exterior pipe 2. Bend it at right angles and insert the lead wire into the through hole b of the wiring board a. moreover,
The tips of the lead wires 3 are bent on the back side of the wiring board a and fixed to the board a.
しかし、前記のようなリード線を有する従来の
サーミスタにおいては、リード線３を有するが故
に様々な問題点を有していた。さらに、電子部品
のチツプ化に対応できないという課題があつた。 However, the conventional thermistor having the lead wire as described above has various problems because of the lead wire 3. Furthermore, there was a problem that it could not cope with the chipping of electronic components.
そこで、この種の電子部品のチツプ化が試みら
れている。 Therefore, attempts have been made to convert this type of electronic component into chips.
［考案が解決しようとする問題点］
しかし、チツプ化に際しては、サーミスタ素子
が絶縁性の外装体で覆われ、さらに両端の端子で
挟まれるため、サーミスタ素子への外部からの伝
熱が行なわれにくい。このため、外部の熱変化に
対する応答性が悪く、外気の温度変化に対するサ
ーミスタの応答速度が遅いという課題があつた。[Problems that the invention aims to solve] However, when making chips, the thermistor element is covered with an insulating exterior body and is further sandwiched between terminals at both ends, so heat transfer to the thermistor element from the outside occurs. Hateful. For this reason, there were problems in that the responsiveness to external thermal changes was poor and the thermistor's response speed to external temperature changes was slow.
本考案は、前記従来の問題点を解決することを
目的とする。 The present invention aims to solve the above-mentioned conventional problems.
［問題を解決するための手段］
即ち、前記本考案の目的は、サーミスタ素地１
４に一対の電極１５を形成したサーミスタ素子１
１と、一端に底部１３ａを有し、他端側に太径部
１３ｂを有する一対の端子１３と、絶縁性の外装
パイプ１２とから成り、外装パイプ１２の中にサ
ーミスタ素子１１を配設し、該パイプ１２の両端
から、前記端子１３を圧入し、該端子１３の底部
１３ａをサーミスタ素子１１の電極１５に接触さ
せると共に、両側からサーミスタ素子１１を挟み
込み、端子１３の外周側に前記外装パイプ１２を
気密に封止し、該パイプ１２から端子１３の太径
部１３ｂを露出させてなり、さらに前記端子１３
は、サーミスタ素子１１の電極に接する底部１３
ｃ側が閉じた凹状の空間部１３ｃを有する中空状
のものからなることを特徴とするチツプサーミス
タにより達成される。[Means for solving the problem] That is, the object of the present invention is to solve the thermistor material 1
Thermistor element 1 with a pair of electrodes 15 formed on 4
1, a pair of terminals 13 having a bottom portion 13a at one end and a large diameter portion 13b at the other end, and an insulating exterior pipe 12, in which a thermistor element 11 is disposed. , the terminal 13 is press-fitted from both ends of the pipe 12, the bottom 13a of the terminal 13 is brought into contact with the electrode 15 of the thermistor element 11, the thermistor element 11 is sandwiched from both sides, and the exterior pipe is placed on the outer circumferential side of the terminal 13. 12 is hermetically sealed, the large diameter portion 13b of the terminal 13 is exposed from the pipe 12, and the terminal 13 is
is the bottom part 13 in contact with the electrode of the thermistor element 11
This is achieved by a chip thermistor characterized by being hollow and having a concave space 13c closed on the c side.
［作用］
本考案によれば、リード線を持たず、外装パイ
プ１２から露出した端子１３の太径部１３ｂを、
配線基板の電極に直接半田付けする形式の、わゆ
るチツプ型電子部品として構成できる。[Function] According to the present invention, the large diameter portion 13b of the terminal 13 that does not have a lead wire and is exposed from the exterior pipe 12,
It can be configured as a so-called chip-type electronic component that is directly soldered to the electrodes of a wiring board.
また、このチツプ型サーミスタの端子１３は中
空であつて、その底部１３ａがサーミスタ素子１
１の電極１５に接触しているため、外部とサーミ
スタ素子１１との間で、底部１３ａを介して伝熱
される。そして、これらの端子１３は、凹状の空
間部１３ｃを有する中空状のものからなるため、
熱容量が小さく、かつ肉厚が薄くなることから、
外装パイプ１２を介しての伝熱が円滑となる。従
つて、外気とサーミスタ素地１４との伝熱性が良
好であり、外部の温度変動に対するサーミスタ素
子１１の応答速度が速い。 Further, the terminal 13 of this chip type thermistor is hollow, and its bottom 13a is connected to the thermistor element 1.
Since the thermistor element 11 is in contact with the first electrode 15, heat is transferred between the outside and the thermistor element 11 via the bottom part 13a. Since these terminals 13 are hollow and have a concave space 13c,
Because the heat capacity is small and the wall thickness is thin,
Heat transfer through the exterior pipe 12 becomes smooth. Therefore, the heat transfer between the outside air and the thermistor base 14 is good, and the response speed of the thermistor element 11 to external temperature fluctuations is fast.
［実施例］
次ぎに、本考案の実施例について詳細に説明す
る。[Example] Next, an example of the present invention will be described in detail.
第１図と第２図で示すように、サーミスタ素子
１１は、円板または円柱形等に成形されたセラミ
ツクからなるサーミスタ素地１４と、その表面に
設けられた銀等からなる一対の電極１５とから成
る。サーミスタ素地１４は、その電気抵抗値が温
度変化に対して高い依存性を有し、温度の上昇に
伴い、電気抵抗値が高くなるポジテイヴなもの
と、この逆に電気抵抗値が低くなるネガテイヴな
ものとがある。 As shown in FIGS. 1 and 2, the thermistor element 11 includes a thermistor base 14 made of ceramic formed into a disc or cylinder shape, and a pair of electrodes 15 made of silver or the like provided on the surface of the thermistor base 14. Consists of. The thermistor material 14 has a high electrical resistance value that is highly dependent on temperature changes, with a positive material whose electrical resistance value increases as the temperature rises, and a negative material whose electrical resistance value decreases as the temperature rises. There is something.
外装パイプ１２には、ガラス製のものやセラミ
ツク製のように、耐熱性、絶縁性に優れるものが
使用され、特にガラスは加工性や気密性にも優れ
ることから最も適当な材料である。この外装パイ
プ１２には円筒形のものを用い、後述するよう
に、その両端から端子１３を圧入する。 For the exterior pipe 12, a material having excellent heat resistance and insulation properties, such as glass or ceramic, is used, and glass is the most suitable material because it has excellent workability and airtightness. This exterior pipe 12 is cylindrical, and the terminals 13 are press-fitted from both ends thereof, as will be described later.
端子１３には銅やニツケル等の金属製中空円筒
体を用い、その中が空間部１３ｃになつていると
共に、その一端側は底部１３ａとして閉じてい
る。さらに、空間部１３ｃが開いた他端側は、他
の部分より太径の太径部１３ｂとなつている。 The terminal 13 is a hollow cylindrical body made of metal such as copper or nickel, and has a space 13c inside and is closed at one end as a bottom 13a. Further, the other end side where the space portion 13c is open forms a large diameter portion 13b having a larger diameter than the other portions.
前記サーミスタ素子１１が外装パイプ１２の中
に挿入され、該パイプ１２の中央部に配置され
る。さらに、端子１３がその底部１３ａ側から外
装パイプ１２の両端に嵌め込まれ、圧入される。
そして端子１３の底部１３ａがサーミスタ素子１
１の両電極１５に各々接触し、かつサーミスタ素
子１１が端子１３によつて両側から挟み込まれ
る。なお、ここで端子１３の底部１３ａをサーミ
スタ素子１１の電極１５に半田付け、或は導電接
着等の手段によつて導電固着するのが望ましい。
さらに、外装パイプ１２の両端を端子１３に封着
し、内部への外気の浸入を阻止する。 The thermistor element 11 is inserted into the exterior pipe 12 and placed at the center of the pipe 12. Furthermore, the terminals 13 are fitted into both ends of the exterior pipe 12 from the bottom 13a side and press-fitted.
The bottom 13a of the terminal 13 is the thermistor element 1.
1, and the thermistor element 11 is sandwiched between the terminals 13 from both sides. Here, it is preferable that the bottom portion 13a of the terminal 13 is conductively fixed to the electrode 15 of the thermistor element 11 by means of soldering, conductive adhesive, or the like.
Further, both ends of the exterior pipe 12 are sealed to the terminals 13 to prevent outside air from entering the interior.
第３図と第４図は、各々本考案の他の実施例を
示す。即ち、第３図は端子１３の端部を長くし、
半田付け面積の増大を図つており、また、第４図
は端子１３の端部を外側に折返し、ここに外装パ
イプ１２の端部を嵌め込んで、半田付け面積の増
大と共に、外装パイプ１２の端部シールの補強を
図つている。 FIGS. 3 and 4 each show other embodiments of the present invention. That is, in FIG. 3, the end of the terminal 13 is lengthened,
In addition, as shown in FIG. 4, the end of the terminal 13 is folded back to the outside and the end of the exterior pipe 12 is fitted therein to increase the soldering area. The end seal is reinforced.
なお、以上の実施例では、円筒形の外装パイプ
１２や端子１３を用いた場合について説明した
が、これらが多角形断面を有する場合についても
同様にして本考案を実施できることはいうまでも
ない。 In the above embodiments, the case where the cylindrical exterior pipe 12 and the terminal 13 are used has been described, but it goes without saying that the present invention can be implemented in the same manner even when these have a polygonal cross section.
［考案の効果］
以上説明した通り、本考案に依れば、リード端
子を用いずに接続する形式のチツプ型サーミスタ
が得られるため、ガラス封止の気密性を劣化させ
ることなく、配線基板に搭載できる。さらに、外
部とサーミスタ素子との伝熱性が良好となるた
め、外気の温度変化に対する応答速度が速いサー
ミスタを提供することが可能となる。[Effects of the invention] As explained above, according to the invention, it is possible to obtain a chip-type thermistor that connects without using lead terminals, so it can be attached to a wiring board without deteriorating the airtightness of the glass seal. Can be installed. Furthermore, since heat transfer between the outside and the thermistor element is improved, it is possible to provide a thermistor that responds quickly to changes in the temperature of the outside air.
第１図は本考案の実施例を示すチツプ型サーミ
スタの縦断側面図、第２図は同サーミスタの分解
斜視図、第３図と第４図は本考案の他の実施例を
示すチツプ型サーミスタの縦断側面図、第５図は
サーミスタの従来例を示す配線基板搭載状態の縦
断側面図である。
１１……サーミスタ素子、１２……外装パイ
プ、１３……端子、１３ａ……端子の底部、１３
ｂ……端子の太径部、１４……サーミスタ素地、
１５……サーミスタ素子の電極。
Fig. 1 is a longitudinal cross-sectional side view of a chip thermistor showing an embodiment of the present invention, Fig. 2 is an exploded perspective view of the same thermistor, and Figs. 3 and 4 are chip-type thermistors showing other embodiments of the invention. FIG. 5 is a vertical side view of a conventional thermistor mounted on a wiring board. 11... Thermistor element, 12... Exterior pipe, 13... Terminal, 13a... Bottom of terminal, 13
b...Large diameter part of terminal, 14...Thermistor base,
15... Electrode of the thermistor element.
Claims (1)
たサーミスタ素子１１と、一端に底部１３ａを有
し、他端側に太径部１３ｂを有する一対の端子１
３と、絶縁性の外装パイプ１２とから成り、外装
パイプ１２の中にサーミスタ素子１１を配設し、
該パイプ１２の両端から、前記端子１３を圧入
し、該端子１３の底部１３ａをサーミスタ素子１
１の電極１５に接触させると共に、両側からサー
ミスタ素子１１を挟み込み、端子１３の外周側に
前記外装パイプ１２を気密に封止し、該パイプ１
２から端子１３の太径部１３ｂを露出させてな
り、さらに前記端子１３は、サーミスタ素子１１
の電極に接する底部１３ｃ側が閉じた凹状の空間
部１３ｃを有する中空状のものからなることを特
徴とするチツプサーミスタ。 A thermistor element 11 having a pair of electrodes 15 formed on a thermistor base 14, and a pair of terminals 1 having a bottom portion 13a at one end and a large diameter portion 13b at the other end.
3 and an insulating exterior pipe 12, a thermistor element 11 is arranged in the exterior pipe 12,
The terminal 13 is press-fitted from both ends of the pipe 12, and the bottom 13a of the terminal 13 is inserted into the thermistor element 1.
1, the thermistor element 11 is sandwiched from both sides, and the exterior pipe 12 is hermetically sealed on the outer peripheral side of the terminal 13.
The large diameter portion 13b of the terminal 13 is exposed from the thermistor element 11.
A chip thermistor characterized in that it is hollow and has a concave space 13c with a closed bottom 13c in contact with an electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143378U JPH0316241Y2 (en) | 1987-09-19 | 1987-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987143378U JPH0316241Y2 (en) | 1987-09-19 | 1987-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448002U JPS6448002U (en) | 1989-03-24 |
| JPH0316241Y2 true JPH0316241Y2 (en) | 1991-04-08 |
Family
ID=31410147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987143378U Expired JPH0316241Y2 (en) | 1987-09-19 | 1987-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316241Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101365356B1 (en) * | 2012-11-09 | 2014-02-20 | 스마트전자 주식회사 | Resistor and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62190302U (en) * | 1986-05-23 | 1987-12-03 |
-
1987
- 1987-09-19 JP JP1987143378U patent/JPH0316241Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448002U (en) | 1989-03-24 |
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