JPH0316158Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] This invention relates to a memory pack.

[Technical background of the invention and its problems]

A small electronic device that is loaded with a memory pack and used to input a word in one country's language (e.g. Japanese) and translate it into a word with the same meaning in another different country's language (e.g. English). There is a small electronic translator. With this small electronic translator,
Translation is performed by loading a word memory pack that stores word information of the language to be translated into the main body of the device, and by exchanging this memory pack, the language of the country to be translated can be changed.

The memory pack used in small electronic devices such as the above-mentioned small electronic translator has a storage element (such as a large-scale integrated circuit chip) built into the case.
only memory) pack, RAM (random access memory) pack, and ROM/
There is a RAM pack.

By the way, the case of this memory pack has conventionally been constructed by combining a pair of case bodies made of synthetic resin.
In order to provide mechanical strength, the wall thickness must be increased, and for this reason, conventional memory packs that use the synthetic resin case described above are quite thick, so they are not suitable for memory pack storage parts of small electronic devices. I also had to make it bigger.

[Purpose of invention]

This idea was made in view of the above-mentioned circumstances, and its purpose is to provide a memory pack that can be made thinner overall while maintaining the mechanical strength of the case. .

[Summary of the idea]

That is, in this invention, panels made of metal plates are attached to the lower and upper parts of a frame made of synthetic resin, respectively, and a memory element is provided inside the frame. Since it has a structure in which a metal panel is combined with a resin frame, it is possible to reduce the overall thickness of the memory pack while maintaining the mechanical strength of the case.

[Example of idea]

Examples of this invention shown in the drawings will be described below.

The embodiment shown in the drawings is an application of the present invention to a memory pack used in a small electronic translator.
4 to 4 show the memory pack, and FIG. 5 shows the memory pack being loaded into a small electronic translator.

In the figure, reference numeral 1 denotes a resin frame in the form of a rectangular frame made of synthetic resin.A stepped portion 1a is formed around the upper portion of the resin frame, and a groove 1b is formed in the lower portion inside the stepped portion 1a. A terminal hole 2 penetrating vertically is formed at one end of the resin frame 1, and wedge-shaped stoppers 3, 3 projecting outward are formed at the center portions of both sides. In the figure, reference numeral 4 denotes an upper surface panel made of a metal plate, which is a rectangular plate having a peripheral wall 4a around its lower part, and has a terminal hole 5 opened at one end. This top panel 4 is provided to cover the upper open portion of the resin frame 1, and the peripheral wall portion 4a is fitted into the stepped portion 1a and is fixed to the resin frame 1 by means such as adhesive. Note that an insulating sheet 6 is interposed between the resin frame 1 and the upper panel 4. In the figure, reference numeral 7 denotes a lower panel made of a metal plate, which is a rectangular plate having a peripheral wall 7a around the upper part, and locking claws 8, 8 are formed at the other end. This lower panel 7 is provided to cover the lower open part of the resin frame 1, and the peripheral wall part 7a is fitted into the groove 1b, and the locking claws 8, 8 are attached to the resin frame 1.
It is locked in a locking part (not shown) formed in the.
This lower panel 7 has mounting holes 9, 9 formed therein.
and screw holes formed in resin frame 1 (not shown)
It is fixed to the resin frame 1 by passing screws 10, 10 through and tightening it. A compression coil spring 12 is inserted into the through hole 11 formed in the resin frame 1, and the coil spring 12 causes the top panel 4 to
By electrically connecting the lower panel 7 and the lower panel 7, an electrostatic shield is provided to the memory element and the circuit board disposed within the resin frame 1.
In this way, the resin frame 1, the upper panel 4, and the lower panel 7 constitute a memory pack case. In other words, this case has metal plates for its upper and lower exterior panels, that is, the top panel 4 and the bottom panel 7, and since this case has metal plates for its exterior panels, it is different from a case made of synthetic resin. Since the resin frame 1 has high mechanical strength, the wall thickness can be reduced, and the thickness (height) of the resin frame 1 only needs to be large enough to accommodate the memory element and the circuit board.
The entire case is much thinner than a case that combines a resin case. Inside the case, there is a circuit board 13 on which a circuit pattern is formed, and a large board that stores word information in the language of a predetermined country and has a plurality of lead terminals 15 connected and fixed to the circuit pattern on the circuit board 13. Terminals formed on the resin frame 1 and the upper panel 4, which are connected in contact with memory elements 14, 14 made of large-scale integrated circuit chips, and a plurality of terminal electrodes 16 formed on the circuit board 13, and held by connector holders 18, 18. Interconnectors 17 that penetrate through the holes 2 and 5 and protrude to the outside are provided, respectively. As is well known, the interconnector 17 is made by alternately laminating insulating rubber and conductive rubber. Note that the circuit board 13 has screws 1
It is fixed to the resin frame 1 by 0 and 10. In addition, 19 in the figure is a pack fixing plate made of a metal plate.
On the rising walls 19a, 19a on both sides, there are locking claws 2.
0, 20 and long holes 21, 21 are formed respectively,
A positioning claw 22 is formed at the center of one end.
Incidentally, long holes 23, 23 are formed in the pack fixing plate 19 to provide relief for the screws 10, 10.
This pack fixing plate 19 is arranged to overlap the lower surface of the lower panel 7, and the rising walls 19a on both sides,
19a are located outside both sides of the resin frame 1, and the elongated holes 21, 2 of the rising walls 19a, 19a
1 has stoppers 3, 3 formed on both sides of the resin frame 1 inserted therein. Therefore, the pack fixing plate 19 is supported by the stoppers 3, 3, and the elongated holes 21,
21 so as to be movable in the longitudinal direction of the memory pack.

The memory pack thus constructed is loaded into a small electronic translator as shown in FIG. Fifth
In the figure, 24 is the main body case of the translator, 25 is a back cover made of a metal plate combined with the main body case 24, 26 is a circuit board provided inside the main body case 24, and 27 is below the circuit board 26 inside the main body case 24. This is a board holder made of synthetic resin that is stacked on the side. A memory pack storage part 28 having a rectangular shape corresponding to the outer shape of the memory pack case is formed vertically through the board holder 27, and a riser of the pack fixing plate 19 is formed on both sides of the memory pack storage part 28. Walls 19a, 19a and locking claw 2
Recesses 29, 29 into which 0, 20 are movably inserted
are formed in these recesses 29, 29, respectively, and groove-shaped locking portions 30, 30, into which the locking claws 20, 20 of the pack fixing plate 19 are locked, are formed, respectively. A positioning recess 31 is formed in the center of one end of the memory pack housing portion 28, in which the positioning claw 22 of the pack fixing plate 19 is engaged. Incidentally, on the lower surface of the circuit board 26 facing the memory pack storage section 28, a plurality of terminal electrodes 32 to be connected to the circuit patterns are formed. Then, the memory pack is fitted and loaded into the memory pack storage section 28 by removing the back cover 25 from the main body case 24 and opening the memory pack storage section 28. In this case, the pack fixing plate 19 is moved to the other end of the memory pack and placed in the recesses 29, 29 of the memory pack housing 28, and then the panel fixing plate 19 is moved to the one end of the memory pack. to lock the locking claws 20, 20 to the locking portions 30, 30, and align the alignment claws 22 to the alignment recesses 3.
1, the memory pack is fixed in the memory pack housing 28, and thereby the interconnector 17 protruding from the upper surface of the memory pack case is held in contact with the terminal electrodes 32 of the circuit board 26. Ru. After this, attach the back cover 25 to the main body case 24 and remove the memory pack storage section 2.
Block 8. Further, the back cover 25 is provided with protrusions 33, 33 formed to protrude inward, and the protrusions 33, 33 abut against the other end edge of the pack fixing plate 19, so that the pack fixing plate 19 is attached to the other end of the cartridge. It prevents it from moving to the side. Therefore, the pack fixing plate 19 will not shift toward the other end of the memory pack and the locking claws 20 will not come off the locking parts 30, 30, so the pack fixing plate 19 will not displace the memory pack. Fixation will not be canceled indiscriminately.

The case of the memory pack may be any combination of a resin frame and an upper panel and a lower panel made of metal plates, and its assembly structure, electrostatic shielding structure, etc. are not limited to those of the embodiments. The structure for storing the memory pack in the pack storage section of the main body of the device is not limited to one using a pack fixing plate. The memory pack of the present invention is not limited to use in small electronic translators, but can also be used in other small electronic devices that require memory packs, and its models can also be ROM,
It may be either RAM or ROM/RAM.

[Effect of idea]

The memory pack of this invention has a structure in which the case that houses the memory element is attached to a frame made of synthetic resin by covering the lower and upper parts of the frame with exterior panels made of metal plates, so the mechanical strength of the case is reduced. Therefore, it is possible to reduce the thickness of the memory pack storage portion of a small electronic device while maintaining the same size.

[Brief explanation of drawings]

Figures 1 and 2 are front and side views of a memory pack showing an embodiment of this invention, Figure 3 is an enlarged sectional view taken along the - line in Figure 1, and Figure 4 is an exploded perspective view of the memory pack. FIG. 5 is a perspective view showing a state in which a memory pack is stored in a memory pack storage section of a small electronic translator. 1...Resin frame, 4...Top panel, 7...
...lower panel, 13...circuit board, 14...memory element, 17...interconnector, 19...pack fixing plate.

Claims (1)

[Scope of utility model registration request] Exterior panels made of metal plates are attached to the bottom and top of the frame made of synthetic resin, respectively.
A memory pack comprising a memory element provided inside the frame.