JPH03159200A - Observing device for semiconductor chip - Google Patents

Abstract

PURPOSE:To correct the attitudes of outer leads and to more accurately observe with a camera by landing the outer leads of a semiconductor chip on a transparent landing plate. CONSTITUTION:A landing stage 20 is mounted on the top of a bracket 13, and a transparent landing plate 21 like a glass plate is mounted. A semiconductor chip P placed on a movable stage 28 is conveyed between a camera 6 and light sources 22, 23, and the nozzle 27 of a moving head 26 is simultaneously advanced to a gap between the sources 22 and 23, and sucks the chip P on the stage 28 to take it up. Then, the stage 20 is advanced between the camera 6 and the chip P, the nozzle 27 is moved down, and outer leads L are landed on the plate 21. Then, an XY table is operated to move the camera 6 in directions X Y, thereby observing the leads L extended from four sides of a semiconductor C.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a semiconductor chip observation device, in which an outer lead extending from a semiconductor chip is temporarily landed on a transparent surface, and is observed by a camera below. It is something.

(Prior Art) It is known as the so-called TAB method that a semiconductor is mounted on a film carrier made of a synthetic resin such as polyimide, and then the film carrier is punched out with a cutter to form a semiconductor chip. Mounting such a semiconductor chip on a substrate is generally called outer lead bonding, and this outer lead bonding involves forming a large number of extremely thin outer leads extending from the semiconductor at extremely small pitches onto the substrate. Since the outer lead must be matched to the electrode section of the microscopic electrode, the outer lead is observed in advance with a camera to precisely detect its position.

(Problems to be Solved by the Invention) The above-mentioned film carrier is managed by being wound on a reel, and therefore, the outer lead formed by punching out the film carrier may be bent due to the winding. many.

Also, mounting a semiconductor on a film carrier is -i
Inner lead bonding is called inner lead bonding, but this inner lead bonding is performed by thermocompression bonding the inner lead of the film carrier to the electrode part formed on the circuit surface of the semiconductor, which causes thermal stress. The lead is easily deformed.

FIG. 9 shows how the outer lead L of the semiconductor chip 2 P, which has been bent and deformed in this way, is observed by the camera 100. Since the outer lead is bent and deformed, its correct position cannot be confirmed. Therefore, even if this semiconductor chip P is mounted on the substrate 101 based on this observation result, the outer leads L are not connected to the electrode portion 1 of the substrate 101.
This means that it is not possible to accurately match 02. Reference numeral 103 denotes a nozzle of a transfer spatula for adsorbing the semiconductor chip P.

Therefore, an object of the present invention is to provide a means for correctly observing a bent and deformed outer lead.

(Means for Solving the Problems) For this purpose, the present invention provides a camera, a light source section provided above the camera, and a light source section between the camera and the light source section.
A semiconductor chip observation device is constituted by a transparent landing plate on which the outer leads of the semiconductor chip adsorbed by the nozzle of the transfer hand land.

(Function) In the above configuration, the outer leads of the semiconductor chip are
By landing on a transparent landing plate, the bending deformity is corrected and observed from below with a camera.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor chip observation device;
There is an XY child table consisting of an X table 2 and a Y table 3, and a camera 6 is attached to a support 'Fi4 extending from the Y table 3 via a micrometer 5. This micrometer 5 moves the camera 6 up and down to adjust the focal length. MX and MY are the X motor and the X motor.

10 is a table plate provided on the upper side of the XY child table, and a bracket 13 is attached to the upper surface of 7 via an X rail 11 and a slider 12 so as to be slidable in the X direction. 14 is a cylinder, 15 is its rod,
The tip of the rod 15 is connected to the bracket 13, and as the rod 15 moves forward and backward, the bracket 1
3 slides in the X direction.

A landing stage 20 is attached to the upper part of the bracket 13, and a transparent landing plate 21 such as a glass plate is attached thereto. As described above, this landing plate 21 slides in the X direction when the cylinder 14 operates, and the camera 6
move forward upwards and retreat laterally. 22.23 is
It is a plate-shaped light source unit disposed above the landing stage 20 at a distance t, and is supported by support arms 24 and 25. This interval t becomes a passage for the nozzle 27 of the transfer head 26 that attracts the semiconductor chip P. Reference numeral 28 denotes a movable stage that moves in the X direction and carries the semiconductor chip P placed thereon below the light source sections 22 and 23. L is an outer lead formed by punching out a film carrier, and C is a semiconductor mounted on the outer lead L by inner lead bonding.

This observation device has the above-mentioned configuration.Next, the observation method will be explained with reference to FIGS. 2(a) to 2(e).

With the landing stage 20 moved to the side, the movable stage 28 moves forward, and the semiconductor chip P placed on it is moved forward.
It is carried in between the camera 6 and the light source section 22, 23 (Fig. 2 (
a)). At the same time, the nozzle 27 of the transfer head 26 enters the space between the light source parts 22 and 23, attracts and ticks up the half-quad chips P on the movable stage 28, and the movable stage 28 retreats to the side. ((b) in the same figure).

Next, the landing stage 20 enters between the camera 6 and the semiconductor chip P (FIG. 6(c)), and then the nozzle 27 descends, lands the outer lead L on the landing plate 2I, and then operates the XY child table. By moving the camera 6 in the X and Y directions, the outer leads L extending from the four sides of the semiconductor C are observed (FIG. 6(d)). At this time, the light source units 22 and 23 are lit, so the silhouette of the outer lead L can be clearly observed with the camera 6. Next, the nozzle 27 rises to transfer the semiconductor chip P to the next process, and the landing stage 20 retreats to the side (
Figure (e)).

FIG. 3 shows the outer lead L in the step (d) above.
The figure shows a state in which the robot has landed on the landing plate 21. As mentioned above, the outer lead L is bent and deformed due to curling of the film carrier and thermal stress, but this bending deformation is corrected by landing on the landing plate 21. Therefore, the outer lead L is By correctly observing the positional deviation of the lead L, the outer lead L can be accurately matched and mounted on the electrode portion of the substrate in a post-process.

Incidentally, the nozzle 27 itself has a height error due to bending and deformation due to the heat generated during the inner lead bonding described above.

Therefore, if there is a height difference between the top surface of the landing plate 21, which is the observation position, and the top surface of the substrate (not shown) on which the semiconductor chip P is mounted, the outer leads L of the semiconductor chip P and the electrode portions of the substrate may This causes a relative positional shift. Therefore, it is desirable that the height of the top surface of the landing plate 21 be made equal to the height of the top surface of the substrate on which the semiconductor chip P is mounted.

As shown in FIG. 4, the semiconductor chip P may be directly transferred and landed on the landing plate 21 by the nozzle 27 and observed by the camera 6. In this case, the movable table 28
is not necessary.

(Example 2) In the above example, since there is a gap t between the light source parts 22 and 23 for the nozzle 27 to go in and out, uneven illumination occurs, and the outer part extending in four directions from the semiconductor C There is a drawback that the lead L cannot be observed uniformly and clearly. Therefore, in this embodiment, a means for solving such difficulties will be explained.

In FIG. 5, the support arm 24.25 is supported on a movable block 31.32.

This movable block 31, 32 slides back and forth along the guide rod 33 in the Y direction. 34 and 35 are support blocks for the guide loft 33, and 36 is a fixing plate attached to the tip of the guide rod 33. This fixed plate 3
6 and the movable blocks 31 and 32 are coil spring members 37.
The spring force of the light source unit 22
．． 23 is biased in the closing direction. Further, a wedge-shaped cam plate 38 is attached to the lower part of the movable block 31, 32. 38a is a cam surface. Further, cam followers 39 are pivotally attached to both sides of the landing stage 20.

Therefore, when the stage 20 advances and retreats in the X direction, the cam plate 38 advances and retreats in the Y direction in synchronization with this, and the light source sections 22 and 23 open and close. Further, a groove portion 40 into which the nozzle 27 fits is formed in the joint portion of the light source portions 22 and 23.

Therefore, as shown by the solid line in Figure 6, landing stage 2
0 has retreated and the movable stage 28 has entered, the light source sections 22 and 23 are open, and the nozzle 27 enters from the interval t between them, and the semiconductor chip P on the movable stage 28
Tick up. Also, the movable stage 28 moves backward,
When the landing stage 20 enters, the cam follower 39 moves the cam surface 38a, and the light sources 22 and 23 close (the sixth
(See the dashed line in the figure). In this state, the nozzle 27 is fitted into the groove 40 and surrounded by the light source parts 22 and 23. Therefore, the light from the light source sections 22 and 3 can be uniformly irradiated onto the outer leads L extending in four directions of the semiconductor chip P, and can be clearly observed with the camera 6.

(Example 3) Since inner lead bonding is performed by thermocompression bonding the inner lead to the electrode portion of the semiconductor, the outer lead is likely to be thermally deformed. Next, a nozzle for ensuring that the outer lead L thermally deformed in this way lands on the landing plate 21 or the substrate will be described.

In FIG. 7(a), 51 is a jig with a hook-shaped cross section attached to the nozzle 27, and when its lower end surface is pressed against the horizontal part of the outer lead L extending from the semiconductor chip P, Correcting the outer lead posture. In the figure, the chain line indicates the outer lead L bent due to thermal deformation or the like. Further, as shown in FIG. 5(b), the substrate 5
Even when mounted on the 0, the posture of the outer lead is corrected. By providing the jig 51 on the side of the nozzle 27 in this manner, the bending deformation of the outer lead L can be corrected and the outer lead L can be reliably landed on the landing plate 21 or the substrate 50. Note that, as described above, it is desirable that the heights Hl and H2 of the top surface of the landing plate 21 on which the outer lead L lands and the top surface of the substrate 50 are the same height.

FIG. 8(a) shows a nozzle 52 which is advantageous for adsorption of a semiconductor chip P whose circuit surface is coated with a bond B for protection of the circuit.
It shows. The lower end 52a of this nozzle 52 branches laterally and attracts the horizontal portion of the outer lead.

Further, according to this nozzle 52, as shown in FIG. 5(b), a semiconductor chip P having a circuit formed on the bottom surface and outer leads L extending laterally from the bottom surface can also be adsorbed advantageously.

(Effects of the Invention) As explained above, the present invention includes a camera, a light source section provided above the camera, and a semiconductor chip disposed between the camera and the light source section that is attached to the nozzle of the transfer head. Since the semiconductor chip observation device is placed at the bottom of the groove from the transparent landing plate on which the outer leads land, the posture of the outer leads extending from the semiconductor can be corrected, allowing for accurate observation with a camera, which in turn improves the accuracy of mounting onto the board. I can give you.

[Brief explanation of the drawing]

The figures show an embodiment of the present invention, in which Fig. 1 is a perspective view of a semiconductor chip observation device, a perspective view of the semiconductor chip placed on a second plate, and Fig. 4 is a perspective view of a semiconductor chip during observation of another embodiment. 5 is a perspective view of the observation device of another embodiment, FIG. 6 is a plan view of the opening/closing means of the light source section, and FIGS. 7(a) and 7(b) are views of the nozzle of another embodiment. A side view, FIGS. 8(a) and 8(b) are sectional views of still another embodiment of the nozzle, and FIG. 9 is a perspective view during observation by conventional means. 6...Camera 21...Landing plate 22.23...Light source section 26...Transfer head 27.52...Nozzle L...Outer lead P...Semiconductor chip

Claims (1)

[Claims] a camera; a light source section provided above the camera;
A semiconductor chip observation device characterized by comprising a transparent landing plate located between the camera and a light source section, on which the outer leads of the semiconductor chip adsorbed by the nozzle of the transfer head land.