JPH03150897A - High-frequency equipment - Google Patents
High-frequency equipmentInfo
- Publication number
- JPH03150897A JPH03150897A JP28951289A JP28951289A JPH03150897A JP H03150897 A JPH03150897 A JP H03150897A JP 28951289 A JP28951289 A JP 28951289A JP 28951289 A JP28951289 A JP 28951289A JP H03150897 A JPH03150897 A JP H03150897A
- Authority
- JP
- Japan
- Prior art keywords
- ground pattern
- case
- soldering
- filter
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 この発明はフィルタを内蔵した高周波機器に関する。[Detailed description of the invention] Industrial applications The present invention relates to high frequency equipment with a built-in filter.
従来の技術
従来の高周波機器においては、第３図のように金属製の
筐体（図示せず）内にプリント基板１を設け、このプリ
ント基板１上にフィルタ３を実装している。このフィル
タ３は金属製のケース４と、このケース４内に設けられ
た複数の同軸共振器（図示せず）と、この同軸共振器か
ら引き出された入出力端子６とからなシ、前記ケース４
をプリント基板１のフィルタ実装部分に実装後、プリン
ト基板１のアースパターン２の適当な場所にアースのた
めに半田１０が施されている。2. Description of the Related Art In a conventional high frequency device, a printed circuit board 1 is provided in a metal casing (not shown) as shown in FIG. 3, and a filter 3 is mounted on the printed circuit board 1. This filter 3 consists of a metal case 4, a plurality of coaxial resonators (not shown) provided in the case 4, an input/output terminal 6 drawn out from the coaxial resonators, and the case 4. 4
After mounting on the filter mounting portion of the printed circuit board 1, solder 10 is applied to an appropriate location of the ground pattern 2 of the printed circuit board 1 for grounding.
なお、第３図において、６はプリント基板１上に設けた
信号パターン、７は信号パターン６の接続部で、この接
続部７に、入出力端子５が半田付けされる。８は接続部
７の外周にレジストインクで形成された枠部で、半田の
枠部８外への流出を防いでいる。In FIG. 3, 6 is a signal pattern provided on the printed circuit board 1, and 7 is a connecting portion of the signal pattern 6. The input/output terminal 5 is soldered to this connecting portion 7. Reference numeral 8 denotes a frame portion formed with resist ink around the outer periphery of the connection portion 7 to prevent solder from flowing out of the frame portion 8 .
発明が解決しようとする課題
しかしながら、上記の構成とした場合、アースパターン
２とケース４との半田１０の位置がばらつき、それによ
ってフィルタの特性が変動してしまうという問題があっ
た。Problems to be Solved by the Invention However, with the above configuration, there is a problem in that the position of the solder 10 between the ground pattern 2 and the case 4 varies, which causes the characteristics of the filter to vary.
そこで本発明は、フィルタの特性を安定化させることを
目的とするものである。Therefore, an object of the present invention is to stabilize the characteristics of the filter.
課題を解決するための手段
そして、この課題を解決するために、本発明はプリント
基板のアースパターンの少なくとも一部にレジストイン
クによる半田付はマークを形成したものである。Means for Solving the Problems And in order to solve the problems, the present invention forms a soldering mark using resist ink on at least a part of the ground pattern of a printed circuit board.
作用
そして、この構成とすれば、ケースとアースパターンと
の半田付けは、半田付はマークを見て行われるので、ど
の製品においても半田付は位置がほぼ同じものになる。Function: With this configuration, soldering between the case and the ground pattern is done by looking at the marks, so the soldering positions are almost the same for all products.
このため、フィルタの特性も安定するものである。Therefore, the characteristics of the filter are also stable.
実施例
ｆｇ１図および第２図において、図示していない金属製
の筐体内に設けられたプリント基板１に斜線を付して示
したアースパターン２を形成し、このアースパターン２
の上がフィルタ３の実装部となっている。フィルタ３は
金属製のケース４と。Example fg In FIG. 1 and FIG. 2, a ground pattern 2 shown with diagonal lines is formed on a printed circuit board 1 provided in a metal casing (not shown).
The upper part is the mounting part of the filter 3. The filter 3 has a metal case 4.
このケース４の中に設けられた複数の同軸共振器（図示
せず）と、そこから引き出された入出力端子６とから形
成されている。このフィルタ３をアースパターン２の上
に第１図のように実装し、入出力端子６は第２図のよう
に折り曲げられた先端を信号パターンｅの接続部７で半
田付けを行う。It is formed from a plurality of coaxial resonators (not shown) provided in the case 4 and input/output terminals 6 drawn out from the coaxial resonators. This filter 3 is mounted on the ground pattern 2 as shown in FIG. 1, and the bent ends of the input/output terminals 6 are soldered to the connecting portion 7 of the signal pattern e as shown in FIG.
この場合、接続部７の外周にはレジストインクによって
枠部８が形成されており、半田がこの枠部８外に流出し
ないように構成されている。また、アースパターン２に
はコ字状の半田付はマーク９が設けられており、このコ
字状の半田付はマーク９内においてケース４とアースパ
ターン２の半田付けが行われるようになっている。この
半田付はマーク９は事前に形成しておくものであり、よ
ってケース４とアースパターン２との半田付けはばらつ
きのない位置で行われるようになる。また、半田付はマ
ーク９が、ケース４１Ｃ開放部分が向かったコ字状であ
るので半田が半田付はマークｅ外に流れにくくなるので
ある。In this case, a frame portion 8 is formed on the outer periphery of the connecting portion 7 using resist ink, and the solder is configured to prevent solder from flowing out of the frame portion 8 . Further, the ground pattern 2 is provided with a U-shaped soldering mark 9, and the case 4 and the ground pattern 2 are soldered within the U-shaped soldering mark 9. There is. In this soldering, the marks 9 are formed in advance, so that the soldering between the case 4 and the ground pattern 2 can be performed at uniform positions. Furthermore, since the soldering mark 9 is U-shaped with the open part of the case 41C facing toward it, it is difficult for the solder to flow outside the mark e.
発明の効果
前記実施例の説明より明らかなように、本発明はプリン
ト基板のアースパターンの少なくとも一部にレジストイ
ンクによる半田付はマークを形成したものである。そし
て、この構成とすれば、ケースとアースパターンとの半
田付けは、半田付はマークを見て行われるので、どの製
品においても半田付は位置がほぼ同じものになる０この
ため、フィルタの特性も安定するものである。また半田
付はマークをコ字状にすることにより、半田が外に流れ
ず、外観の改善およびフィルタの特性安定にも効果があ
る。Effects of the Invention As is clear from the description of the above embodiments, in the present invention, a soldering mark is formed using resist ink on at least a part of the ground pattern of a printed circuit board. With this configuration, soldering between the case and the ground pattern is done by looking at the marks, so the soldering positions are almost the same for all products. Therefore, the characteristics of the filter It is also stable. Furthermore, by making the soldering mark into a U-shape, the solder does not flow outward, which is effective in improving the appearance and stabilizing the characteristics of the filter.
第１図は本発明の一実施例の上面図、第２図はその側面
図、第３図は従来例の上面図である。
１・・・・・・プリント基板、２・・・・・・アースパ
ターン、３・・・・・・フィルタ、４・・・・・・ケー
ス、５・・・・・・入出力端子、６・・・・・・信号パ
ターン、７・・・・・・接続部、８・・・・・・枠部、
９・・・・・・半田付はマーク。FIG. 1 is a top view of an embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a top view of a conventional example. 1... Printed circuit board, 2... Earth pattern, 3... Filter, 4... Case, 5... Input/output terminal, 6 ......Signal pattern, 7...Connection part, 8...Frame part,
9...Mark for soldering.
Claims (2)
ント基板と、このプリント基板上に実装されたフィルタ
とを備え、前記フィルタは、金属製のケースと、このケ
ース内に設けられた複数の同軸共振器と、この同軸共振
器から引き出された入出力端子とを有し、前記ケースを
プリント基板のフィルタ実装部に実装するとともに、こ
のケースをプリント基板のアースパターンに半田付けし
、前記アースパターンの少なくとも一部にはレジストイ
ンクによる半田付けマークを形成した高周波機器。(1) The filter includes a metal case, a printed circuit board provided in the case, and a filter mounted on the printed circuit board, and the filter includes a metal case and a printed circuit board provided in the case. The device has a plurality of coaxial resonators and input/output terminals drawn out from the coaxial resonators, and the case is mounted on the filter mounting part of the printed circuit board, and the case is soldered to the ground pattern of the printed circuit board. , a high frequency device in which a soldering mark made of resist ink is formed on at least a portion of the ground pattern;
トインクによりコ字状で、コ字状の開放部がケース側に
向いている半田付けマークを形成した請求項１記載の高
周波機器。(2) The high-frequency device according to claim 1, wherein a U-shaped soldering mark is formed on a part of the ground pattern of the printed circuit board using resist ink, and the U-shaped open part faces toward the case side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28951289A JPH03150897A (en) | 1989-11-07 | 1989-11-07 | High-frequency equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28951289A JPH03150897A (en) | 1989-11-07 | 1989-11-07 | High-frequency equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03150897A true JPH03150897A (en) | 1991-06-27 |
Family
ID=17744229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28951289A Pending JPH03150897A (en) | 1989-11-07 | 1989-11-07 | High-frequency equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03150897A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135875A (en) * | 2006-11-27 | 2008-06-12 | Nippon Dempa Kogyo Co Ltd | Manufacturing method of surface-mounted crystal oscillator |
-
1989
- 1989-11-07 JP JP28951289A patent/JPH03150897A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135875A (en) * | 2006-11-27 | 2008-06-12 | Nippon Dempa Kogyo Co Ltd | Manufacturing method of surface-mounted crystal oscillator |
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