JPH031474U - - Google Patents

Info

Publication number

JPH031474U

JPH031474U JP5946389U JP5946389U JPH031474U JP H031474 U JPH031474 U JP H031474U JP 5946389 U JP5946389 U JP 5946389U JP 5946389 U JP5946389 U JP 5946389U JP H031474 U JPH031474 U JP H031474U

Authority

JP

Japan

Prior art keywords

hole

circuit board

printed circuit

component land

wiring pattern

Prior art date

1989-05-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000002940 repellent Effects 0.000 claims description 2
• 239000005871 repellent Substances 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 230000002093 peripheral effect Effects 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1