JPH0313789U - - Google Patents
Info
- Publication number
- JPH0313789U JPH0313789U JP7547589U JP7547589U JPH0313789U JP H0313789 U JPH0313789 U JP H0313789U JP 7547589 U JP7547589 U JP 7547589U JP 7547589 U JP7547589 U JP 7547589U JP H0313789 U JPH0313789 U JP H0313789U
- Authority
- JP
- Japan
- Prior art keywords
- film
- circuit board
- printed circuit
- pack
- metal sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7547589U JPH0313789U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7547589U JPH0313789U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313789U true JPH0313789U (enrdf_load_stackoverflow) | 1991-02-12 |
Family
ID=31616084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7547589U Pending JPH0313789U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313789U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016089654A1 (en) * | 2014-12-04 | 2016-06-09 | Microsoft Technology Licensing, Llc | System for effectively transferring heat from electronic devices and method for forming the same |
-
1989
- 1989-06-27 JP JP7547589U patent/JPH0313789U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016089654A1 (en) * | 2014-12-04 | 2016-06-09 | Microsoft Technology Licensing, Llc | System for effectively transferring heat from electronic devices and method for forming the same |
| US10111363B2 (en) | 2014-12-04 | 2018-10-23 | Microsoft Technology Licensing, Llc | System for effectively transfering heat from electronic devices and method for forming the same |