JPH0313744U - - Google Patents

Info

Publication number

JPH0313744U

JPH0313744U JP7447689U JP7447689U JPH0313744U JP H0313744 U JPH0313744 U JP H0313744U JP 7447689 U JP7447689 U JP 7447689U JP 7447689 U JP7447689 U JP 7447689U JP H0313744 U JPH0313744 U JP H0313744U

Authority

JP

Japan

Prior art keywords

package

thermal expansion

circuit board

materials

matching circuit

Prior art date

1989-06-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
• 229910000833 kovar Inorganic materials 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (2)