JPH0313742U - - Google Patents

Info

Publication number
JPH0313742U
JPH0313742U JP7467289U JP7467289U JPH0313742U JP H0313742 U JPH0313742 U JP H0313742U JP 7467289 U JP7467289 U JP 7467289U JP 7467289 U JP7467289 U JP 7467289U JP H0313742 U JPH0313742 U JP H0313742U
Authority
JP
Japan
Prior art keywords
semiconductor device
package
metallized layer
marking
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7467289U
Other languages
English (en)
Japanese (ja)
Other versions
JPH08759Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989074672U priority Critical patent/JPH08759Y2/ja
Publication of JPH0313742U publication Critical patent/JPH0313742U/ja
Application granted granted Critical
Publication of JPH08759Y2 publication Critical patent/JPH08759Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989074672U 1989-06-26 1989-06-26 半導体素子収納用パッケージ Expired - Lifetime JPH08759Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989074672U JPH08759Y2 (ja) 1989-06-26 1989-06-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989074672U JPH08759Y2 (ja) 1989-06-26 1989-06-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0313742U true JPH0313742U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-12
JPH08759Y2 JPH08759Y2 (ja) 1996-01-10

Family

ID=31614568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989074672U Expired - Lifetime JPH08759Y2 (ja) 1989-06-26 1989-06-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH08759Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-02-23 1973-11-21
JPS5935498A (ja) * 1982-08-23 1984-02-27 日本電気ホームエレクトロニクス株式会社 プリント配線体
JPS6146739U (ja) * 1984-08-31 1986-03-28 富士通株式会社 半導体容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-02-23 1973-11-21
JPS5935498A (ja) * 1982-08-23 1984-02-27 日本電気ホームエレクトロニクス株式会社 プリント配線体
JPS6146739U (ja) * 1984-08-31 1986-03-28 富士通株式会社 半導体容器

Also Published As

Publication number Publication date
JPH08759Y2 (ja) 1996-01-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term