JPH03136850A - Composite film - Google Patents
Composite filmInfo
- Publication number
- JPH03136850A JPH03136850A JP27485889A JP27485889A JPH03136850A JP H03136850 A JPH03136850 A JP H03136850A JP 27485889 A JP27485889 A JP 27485889A JP 27485889 A JP27485889 A JP 27485889A JP H03136850 A JPH03136850 A JP H03136850A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- layers
- adhesive
- polyamide resin
- composite film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims description 18
- 239000010410 layer Substances 0.000 claims abstract description 48
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 23
- 239000000565 sealant Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract 2
- 230000001070 adhesive effect Effects 0.000 claims abstract 2
- 230000001954 sterilising effect Effects 0.000 abstract description 5
- 238000004659 sterilization and disinfection Methods 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000004677 Nylon Substances 0.000 description 11
- 229920001778 nylon Polymers 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 6
- 235000013305 food Nutrition 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 229920000092 linear low density polyethylene Polymers 0.000 description 3
- 239000004707 linear low-density polyethylene Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 2
- BLDFSDCBQJUWFG-UHFFFAOYSA-N 2-(methylamino)-1,2-diphenylethanol Chemical compound C=1C=CC=CC=1C(NC)C(O)C1=CC=CC=C1 BLDFSDCBQJUWFG-UHFFFAOYSA-N 0.000 description 1
- UNPLRYRWJLTVAE-UHFFFAOYSA-N Cloperastine hydrochloride Chemical compound Cl.C1=CC(Cl)=CC=C1C(C=1C=CC=CC=1)OCCN1CCCCC1 UNPLRYRWJLTVAE-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 101000969770 Homo sapiens Myelin protein zero-like protein 2 Proteins 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 102100021272 Myelin protein zero-like protein 2 Human genes 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 101150083127 brox gene Proteins 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009459 flexible packaging Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ａ１撃強度や耐ピンホール性、および柔軟性
を改良し、ガスバリア性、透明性に優れた複合フィルム
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a composite film that has improved a1 impact strength, pinhole resistance, and flexibility, and has excellent gas barrier properties and transparency.
食品包装等の柔軟包装分野において必要とされる性能に
は、バリア性、柔軟性、耐ピンホール性などがある。Performance required in the field of flexible packaging such as food packaging includes barrier properties, flexibility, and pinhole resistance.
食品包装分野においては、食品の変質や腐敗の原因とな
る微生物を完全に死滅、除去するために、レトルト加熱
滅菌処理やボイル滅菌処理等の加熱滅菌処理が行われた
り、クリーンルーム内で包装作業が行われたりする。ま
た包装材にガスバリヤ性を付与して酸素ガスによる食品
の変質や腐敗を防ぐとともに保存性も高めている。In the food packaging field, heat sterilization processes such as retort heat sterilization and boil sterilization are used to completely kill and remove microorganisms that cause food deterioration and spoilage, and packaging work is performed in clean rooms. Sometimes it is done. In addition, the packaging material has gas barrier properties to prevent food deterioration and spoilage due to oxygen gas, and also improves preservability.
しかしながら流通過程において、製品に与える振動およ
び落下によってピンホールが発生し、その箇所から外部
環境の空気が侵入し、製品に触れ、製品が変色したり腐
敗する場合がある。そのため包装材には、振動や落下に
よる衝撃などによるピンホールの発生や破袋しない衝撃
強度や耐ピンホール性が要求されている。However, during the distribution process, pinholes are generated due to vibrations and drops on the product, and air from the external environment enters through the pinholes and comes into contact with the product, which may discolor or rot the product. For this reason, packaging materials are required to have impact strength and pinhole resistance to prevent pinholes from forming or bags to break due to shocks caused by vibration or dropping.
特に耐ピンホール性において、従来よりよく用いられて
いる技術は、複合フィルムの一層に衝撃強度に優れたポ
リアミド樹脂を使用し、複合フィルムにおけるポリアミ
ド樹脂の比率を高くすることにより耐ピンホール性の向
上を計っていた。しかしながら、ポリアミド樹脂の比率
を高くすると複合フィルム全体の柔軟性は乏しくなり、
またフィルムの柔軟性が低下する割には耐ピンホール性
は正比例して向上されない、そのため柔軟性を考慮して
ポリアミド樹脂の比率を設計する必要性がある。Particularly in terms of pinhole resistance, the technology that has been commonly used in the past is to use a polyamide resin with excellent impact strength as a layer of the composite film, and to increase the ratio of polyamide resin in the composite film to improve pinhole resistance. I was trying to improve. However, when the proportion of polyamide resin is increased, the flexibility of the entire composite film becomes poor.
Furthermore, although the flexibility of the film decreases, the pinhole resistance does not improve in direct proportion, so it is necessary to design the ratio of polyamide resin in consideration of flexibility.
本発明は、複合フィルムにおけるポリアミド樹脂の比率
は従来と同じとし、ポリアミド樹脂層を多層に分けるこ
とにより柔軟性および衝撃強度、耐ピンホール性を改良
したガス遮断性複合フィルムを従供することにある。The present invention provides a gas-barrier composite film with improved flexibility, impact strength, and pinhole resistance by dividing the polyamide resin layer into multiple layers, while keeping the ratio of polyamide resin in the composite film the same as before. .
本発明は、ポリアミド樹脂層を多層に分け、ポリアミド
樹脂層の間に緩衝材として接着層を入れ外
た層をＡ層とし、六層、接着層、Ａ層、接着層、シーラ
ント層順で積層されたことを特徴とした複合フィルムに
関するものである。In the present invention, the polyamide resin layer is divided into multiple layers, an adhesive layer is inserted as a cushioning material between the polyamide resin layers, and the layer A is formed by removing the adhesive layer, and six layers are laminated in the order of adhesive layer, A layer, adhesive layer, and sealant layer. The present invention relates to a composite film characterized by:
ポリアミド樹脂層を多層に分は接着層をいれた場合、同
比率でポリアミド樹脂層を分けずに複合フィルムを作っ
たものに比べ、飛躍的に衝撃強度が向上し、柔軟性が改
良されることを見いだした。When multiple polyamide resin layers are combined with an adhesive layer, the impact strength and flexibility are dramatically improved compared to a composite film made without dividing the polyamide resin layers at the same ratio. I found it.
第一図は、本発明による積層体の１具体例の断面図であ
る。１は外層、２はポリアミド樹脂層、３は接着層、４
はシーラント層となっている。FIG. 1 is a sectional view of one specific example of a laminate according to the present invention. 1 is an outer layer, 2 is a polyamide resin layer, 3 is an adhesive layer, 4
is a sealant layer.
外層に用いられる樹脂は、ポリプロピレン樹脂、ポリエ
チレン樹脂、ポリエステル樹脂およびそれらの共重合体
である。外層は、加熱滅菌時のフィルムへの水分の透過
を遮断しポリアミド樹脂層の吸水を防いでいる。The resin used for the outer layer is polypropylene resin, polyethylene resin, polyester resin, and copolymers thereof. The outer layer blocks moisture from permeating the film during heat sterilization and prevents the polyamide resin layer from absorbing water.
用いられるポリアミド樹脂は、ナイロン６、ナイロン１
１．６−１２共重合体ナイロン、６−６６共重合体ナイ
ロン、ナイロン６−１Ｏ、ナイロン１２、非品性ナイロ
ンおよびそれらを主成分とするブレンド物であり、ポリ
アミド樹脂を単層で用いるのではなく、ポリアミド樹脂
層間に接着層をいれ多層にわけ、耐ピンホール性を向上
させている。ポリアミド樹脂を多層にわける際、１種類
のポリアミド樹脂を接着層を介して多層にわけても、２
種類以上のポリアミド樹脂を接着層を介して多層にわけ
てもかまわない、多層にわけたポリアミド樹脂層間の接
着層は緩衝材層の役割を担っており、耐ピンホール性を
大幅に改善している。The polyamide resins used are nylon 6 and nylon 1.
1.6-12 copolymer nylon, 6-66 copolymer nylon, nylon 6-1O, nylon 12, non-grade nylon, and blends containing these as main components. Instead, an adhesive layer is inserted between the polyamide resin layers to create multiple layers, improving pinhole resistance. When dividing polyamide resin into multiple layers, even if one type of polyamide resin is divided into multiple layers via an adhesive layer, two
It is possible to separate multiple types of polyamide resin into multiple layers via an adhesive layer, and the adhesive layer between the multiple polyamide resin layers plays the role of a cushioning layer, greatly improving pinhole resistance.
接着層として用いられるものには、エチレン−酢酸ビニ
ル共重合体またはエチレン−プロピレンエラストマーに
一塩基性不飽和脂肪酸あるいは二塩基性不飽和脂肪酸の
無水物を化学的に結合させて得られる酸変性オレフィン
系樹脂が用いられる。The adhesive layer used is acid-modified olefin obtained by chemically bonding monobasic unsaturated fatty acid or dibasic unsaturated fatty acid anhydride to ethylene-vinyl acetate copolymer or ethylene-propylene elastomer. type resin is used.
シーラント層は、オレフィン系樹脂であるＶＬＤＰＥ、
ＬＬＤＰＥ、ＬＤＰＥ、ＭＤＰＥ％ＨＤＰＥ、ＰＰ、お
よびエチレン共重合体であるＥＶＡ１エチレン−メチル
メタアクリレート共重合体、エチレン−エチルアクリレ
ート共重合体、エチレン−メチルアクリレート共重合体
、エチレン−エチルアクリレート−無水マレイン酸共重
合体、エチレン−アクリル酸共重合体、エチレン−メタ
クリル酸共重合体、ＩＯＮなどの樹脂である。The sealant layer is made of olefin resin VLDPE,
LLDPE, LDPE, MDPE% HDPE, PP, and ethylene copolymer EVA1 Ethylene-methyl methacrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate-maleic anhydride These are resins such as acid copolymers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, and ION.
本発明の実施例を示す０表１の様な構成で積層体を作り
、耐ピンホール性について評価を行った。A laminate was made with the configuration shown in Table 1 showing an example of the present invention, and the pinhole resistance was evaluated.
耐ピンホール性の評価は、図２に示したように、先端が
鋼製の計５を治具で水平゛にセットした複合フィルム６
に当て、針に一定加重をかけて一分間保持した。加重は
１０ｇずつピンホールが発生するまで増やしていき、ピ
ンホールの発生した荷重の前の荷重が複合フィルムの耐
えうる荷重とした。The pinhole resistance was evaluated using a composite film 6 with a steel tip set horizontally using a jig, as shown in Figure 2.
A constant load was applied to the needle and held for one minute. The load was increased by 10 g until pinholes were generated, and the load before the load at which pinholes were generated was defined as the load that the composite film could withstand.
図３に耐ピンホール性の評価結果を示した。FIG. 3 shows the evaluation results of pinhole resistance.
本発明の複合フィルムを用いることにより、従来のもの
に比べ１．５〜２倍の耐ピンホール性を持っていること
がわかる。It can be seen that by using the composite film of the present invention, the pinhole resistance is 1.5 to 2 times higher than that of the conventional film.
本発明の複合フィルムを用いて、ブロックハムを真空包
装し、１００℃の熱水中に２０分間入れ、加熱滅菌を行
いサンプルを作製した０作製したサンプルをダンボール
箱に２０個つめ、そのダンボール箱を１ｍの高さから１
８０回落とし、ピンホールなどの脱気もれがないか調べ
た結果を表１に示した。Using the composite film of the present invention, brox ham was vacuum packaged, placed in hot water at 100°C for 20 minutes, and heat sterilized to prepare samples. 0 Packed 20 of the prepared samples in a cardboard box. from a height of 1m
Table 1 shows the results of 80 drops and checking for pinholes or other degassing leaks.
本発明の複合フィルムを用いた場合、１８０回の落下試
験を行なってもピンホールが発生しておらず、耐ピンホ
ール性が向上しているのがわかる。When the composite film of the present invention was used, no pinholes were generated even after 180 drop tests, indicating that the pinhole resistance was improved.
表 １
×：ピンホールが発生
Ａ：外層
線状低密度ポリエチレン
ウルトゼックス３５２０Ｌ
三井日石ポリマー株式会社
Ｂ：６ナイロン
宇部ナイロン１０３０Ｂ 宇部興産株式会社Ｃ：接着
層
アトマーＮＦ３００
三井石油化学工業株式会社
Ｄ ： ６−６６共重合体ナイロン
宇部ナイロン５０３３Ｂ 宇部興産株式会社Ｅ：６−
１２共重合体ナイロン
宇部ナイロン７０２４Ｂ 宇部興産株式会社Ｆ：接着
層
アトマーＶＦ５００
三井石油化学工業株式会社
Ｇ：エチレン酢酸ビニル共重合体
エバフレックスＶ５２７４
三井デュポン・ポリケミカル株式会社
Ｈ：線状低密度ポリエチレン
ウルトゼックス２０２２Ｌ
三井日石ポリマー株式会社
〔発明の効果〕
本発明の積層体を使用することにより、衝撃強度および
耐ピンホール性の向上が計れ、柔軟性も改良され、ピン
ホールの発生がなくなることにより食品等の包装分野に
大きく貢献し得るものである。Table 1 ×: Pinholes occur A: Outer layer linear low-density polyethylene Ultzex 3520L Mitsui Nippon Seki Polymer Co., Ltd. B: 6 nylon Ube Nylon 1030B Ube Industries Co., Ltd. C: Adhesive layer Atomer NF300 Mitsui Petrochemical Industries Co., Ltd. D: 6-66 copolymer nylon Ube Nylon 5033B Ube Industries Co., Ltd. E:6-
12 copolymer nylon Ube Nylon 7024B Ube Industries Co., Ltd. F: Adhesive layer Atomer VF500 Mitsui Petrochemicals Co., Ltd. G: Ethylene-vinyl acetate copolymer Evaflex V5274 Mitsui DuPont Polychemical Co., Ltd. H: Linear low-density polyethylene Urt ZEX 2022L Mitsui Nisseki Polymer Co., Ltd. [Effects of the Invention] By using the laminate of the present invention, impact strength and pinhole resistance are improved, flexibility is also improved, and pinholes do not occur. This can greatly contribute to the field of food packaging.
第 図No. figure
第１図は本発明による複合フィルムの１実施例を示す断
面図、第２図は複合フィルムの耐ピンホール性の評価方
法を示す斜視図及び一部拡大図、第３図は各複合フィル
ムの貴下荷重との関係を示すグラフである。
第
図Fig. 1 is a cross-sectional view showing one example of a composite film according to the present invention, Fig. 2 is a perspective view and partially enlarged view showing a method for evaluating the pinhole resistance of the composite film, and Fig. 3 is a cross-sectional view of each composite film. It is a graph showing the relationship with the load below. Diagram
Claims (1)
層の間に緩衝材として接着剤を入れた層をＡ層とし、外
層、接着層、Ａ層、接着層、シーラント層の順で積層さ
れたことを特徴とした複合フィルム。(1) The polyamide resin layer is divided into multiple layers, and the A layer is a layer in which an adhesive is inserted as a cushioning material between the polyamide resin layers, and the outer layer, adhesive layer, A layer, adhesive layer, and sealant layer are laminated in this order. A composite film characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27485889A JPH03136850A (en) | 1989-10-24 | 1989-10-24 | Composite film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27485889A JPH03136850A (en) | 1989-10-24 | 1989-10-24 | Composite film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03136850A true JPH03136850A (en) | 1991-06-11 |
| JPH0575585B2 JPH0575585B2 (en) | 1993-10-20 |
Family
ID=17547558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27485889A Granted JPH03136850A (en) | 1989-10-24 | 1989-10-24 | Composite film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03136850A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016030406A (en) * | 2014-07-30 | 2016-03-07 | 住友ベークライト株式会社 | Antimicrobial film and package |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143055A (en) * | 1974-10-09 | 1976-04-13 | Nippon Telegraph & Telephone | DEJITARUGEN SUIKI |
| JPS564571A (en) * | 1979-05-11 | 1981-01-17 | American Can Co | Heat sealed packing body |
| JPS583944A (en) * | 1981-06-30 | 1983-01-10 | Shin Etsu Chem Co Ltd | Permanent magnet alloy with variable reversible temperature coefficient |
| JPS6027000U (en) * | 1983-08-01 | 1985-02-23 | 三菱電機株式会社 | Connection mechanism of rocket motor to artificial satellite |
| JPS6114438U (en) * | 1984-06-29 | 1986-01-28 | 株式会社クラベ | power cord protection device |
| JPS62234929A (en) * | 1986-03-21 | 1987-10-15 | ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト | Oxygen barrier oriented shrinkable film |
-
1989
- 1989-10-24 JP JP27485889A patent/JPH03136850A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143055A (en) * | 1974-10-09 | 1976-04-13 | Nippon Telegraph & Telephone | DEJITARUGEN SUIKI |
| JPS564571A (en) * | 1979-05-11 | 1981-01-17 | American Can Co | Heat sealed packing body |
| JPS583944A (en) * | 1981-06-30 | 1983-01-10 | Shin Etsu Chem Co Ltd | Permanent magnet alloy with variable reversible temperature coefficient |
| JPS6027000U (en) * | 1983-08-01 | 1985-02-23 | 三菱電機株式会社 | Connection mechanism of rocket motor to artificial satellite |
| JPS6114438U (en) * | 1984-06-29 | 1986-01-28 | 株式会社クラベ | power cord protection device |
| JPS62234929A (en) * | 1986-03-21 | 1987-10-15 | ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト | Oxygen barrier oriented shrinkable film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016030406A (en) * | 2014-07-30 | 2016-03-07 | 住友ベークライト株式会社 | Antimicrobial film and package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0575585B2 (en) | 1993-10-20 |
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