JPH03135576A - Electrophotographic sensitive body - Google Patents
Electrophotographic sensitive bodyInfo
- Publication number
- JPH03135576A JPH03135576A JP27441689A JP27441689A JPH03135576A JP H03135576 A JPH03135576 A JP H03135576A JP 27441689 A JP27441689 A JP 27441689A JP 27441689 A JP27441689 A JP 27441689A JP H03135576 A JPH03135576 A JP H03135576A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- weight
- methyl
- layer
- etherified melamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 36
- 229920002050 silicone resin Polymers 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 71
- 239000011241 protective layer Substances 0.000 claims description 39
- 108091008695 photoreceptors Proteins 0.000 claims description 35
- JMHCCAYJTTWMCX-QWPJCUCISA-M sodium;(2s)-2-amino-3-[4-(4-hydroxy-3,5-diiodophenoxy)-3,5-diiodophenyl]propanoate;pentahydrate Chemical compound O.O.O.O.O.[Na+].IC1=CC(C[C@H](N)C([O-])=O)=CC(I)=C1OC1=CC(I)=C(O)C(I)=C1 JMHCCAYJTTWMCX-QWPJCUCISA-M 0.000 claims description 34
- -1 methyl-butyl Chemical group 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 17
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 16
- 239000011118 polyvinyl acetate Substances 0.000 claims description 15
- 229920000058 polyacrylate Polymers 0.000 claims description 12
- 229920005989 resin Polymers 0.000 abstract description 40
- 239000011347 resin Substances 0.000 abstract description 40
- 229920000877 Melamine resin Polymers 0.000 abstract description 16
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract description 11
- 238000009877 rendering Methods 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 43
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 19
- 239000011230 binding agent Substances 0.000 description 15
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 235000019256 formaldehyde Nutrition 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 206010034972 Photosensitivity reaction Diseases 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000036211 photosensitivity Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229960004279 formaldehyde Drugs 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 4
- 150000007974 melamines Chemical class 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000006266 etherification reaction Methods 0.000 description 3
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004001 molecular interaction Effects 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003219 pyrazolines Chemical class 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 150000004961 triphenylmethanes Chemical class 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- VEUMBMHMMCOFAG-UHFFFAOYSA-N 2,3-dihydrooxadiazole Chemical compound N1NC=CO1 VEUMBMHMMCOFAG-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- GEKJEMDSKURVLI-UHFFFAOYSA-N 3,4-dibromofuran-2,5-dione Chemical compound BrC1=C(Br)C(=O)OC1=O GEKJEMDSKURVLI-UHFFFAOYSA-N 0.000 description 1
- CLQYLLIGYDFCGY-UHFFFAOYSA-N 4-(2-anthracen-9-ylethenyl)-n,n-diethylaniline Chemical compound C1=CC(N(CC)CC)=CC=C1C=CC1=C(C=CC=C2)C2=CC2=CC=CC=C12 CLQYLLIGYDFCGY-UHFFFAOYSA-N 0.000 description 1
- MNFZZNNFORDXSV-UHFFFAOYSA-N 4-(diethylamino)benzaldehyde Chemical compound CCN(CC)C1=CC=C(C=O)C=C1 MNFZZNNFORDXSV-UHFFFAOYSA-N 0.000 description 1
- YGBCLRRWZQSURU-UHFFFAOYSA-N 4-[(diphenylhydrazinylidene)methyl]-n,n-diethylaniline Chemical compound C1=CC(N(CC)CC)=CC=C1C=NN(C=1C=CC=CC=1)C1=CC=CC=C1 YGBCLRRWZQSURU-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- XYPMAZCBFKBIFK-UHFFFAOYSA-N 9,10-dinitroanthracene Chemical compound C1=CC=C2C([N+](=O)[O-])=C(C=CC=C3)C3=C([N+]([O-])=O)C2=C1 XYPMAZCBFKBIFK-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- 102000006835 Lamins Human genes 0.000 description 1
- 108010047294 Lamins Proteins 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- CECABOMBVQNBEC-UHFFFAOYSA-K aluminium iodide Chemical compound I[Al](I)I CECABOMBVQNBEC-UHFFFAOYSA-K 0.000 description 1
- HUVXQFBFIFIDDU-UHFFFAOYSA-N aluminum phthalocyanine Chemical compound [Al+3].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 HUVXQFBFIFIDDU-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- PGEHNUUBUQTUJB-UHFFFAOYSA-N anthanthrone Chemical class C1=CC=C2C(=O)C3=CC=C4C=CC=C5C(=O)C6=CC=C1C2=C6C3=C54 PGEHNUUBUQTUJB-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- XCIXKGXIYUWCLL-UHFFFAOYSA-N cyclopentanol Chemical compound OC1CCCC1 XCIXKGXIYUWCLL-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Chemical class N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
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- 238000011068 loading method Methods 0.000 description 1
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Landscapes
- Photoreceptors In Electrophotography (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は電子写真感光体に関し、より詳細には、表面
保護層を有する電子写真感光体に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an electrophotographic photoreceptor, and more particularly to an electrophotographic photoreceptor having a surface protective layer.
〈従来の技術〉
いわゆるカールソンプロセスを利用した、複写機等の画
像形成装置においては、導電性を有する基材上に感光層
を形成した電子写真感光体が用いられている。<Prior Art> In an image forming apparatus such as a copying machine that utilizes the so-called Carlson process, an electrophotographic photoreceptor in which a photosensitive layer is formed on a conductive base material is used.
電子写真感光体は、画像形成プロセス時に電気的、光学
的、機械的な衝撃を繰返し受けるので、これら衝撃に対
する耐久性を向上させる等の目的で、感光層の上に、結
着樹脂からなる表面保護層を積層することが行われてい
る。Electrophotographic photoreceptors are repeatedly subjected to electrical, optical, and mechanical shocks during the image forming process, so in order to improve their durability against these shocks, a surface made of a binder resin is added on top of the photosensitive layer. Lamination of protective layers is practiced.
結着樹脂としては、表面保護層の硬度を向上させるため
、熱硬化性シリコーン樹脂が主として用いられる。しか
し、上記熱硬化性シリコーン樹脂単独では、摺動摩擦に
対して脆く、損傷を受けやすい等の問題がある。As the binder resin, a thermosetting silicone resin is mainly used in order to improve the hardness of the surface protective layer. However, using the thermosetting silicone resin alone has problems such as being brittle against sliding friction and being easily damaged.
そこで、表面保護層の結着樹脂として熱硬化性シリコー
ン樹脂と、ポリ酢酸ビニル等の熱可塑性樹脂とを併用し
た電子写真感光体(特開昭63−18354号公報参照
)や、熱硬化性シリコーン樹脂とブチルエーテル化メラ
ミン・ホルムアルデヒド樹脂とを併用した電子写真感光
体が提案されている(特開昭63−2071号公報参照
)。Therefore, electrophotographic photoreceptors that use a combination of thermosetting silicone resin and thermoplastic resin such as polyvinyl acetate as a binder resin for the surface protective layer (see Japanese Patent Application Laid-open No. 18354/1983), and thermosetting silicone An electrophotographic photoreceptor using a resin and a butyl etherified melamine/formaldehyde resin has been proposed (see Japanese Patent Laid-Open No. 63-2071).
〈発明が解決しようとする課題〉
しかしながら、前者の併用系においては、感光体の感度
が十分でなく、また、熱硬化性シリコーン樹脂単独の場
合に比べて表面硬度が低く、却って損傷を受けやすい等
、表面保護層の物性の面で問題がある他、特に熱硬化性
シリコーン樹脂にポリ酢酸ビニルを併用した系では、表
面保護層を形成するための塗布液が安定性に欠け、ポッ
トライフを過ぎると膜の白化が生じるという問題もあっ
た。<Problem to be solved by the invention> However, in the former combination system, the sensitivity of the photoreceptor is not sufficient, and the surface hardness is lower than in the case of using thermosetting silicone resin alone, making it more susceptible to damage. In addition to problems with the physical properties of the surface protective layer, especially in systems that use polyvinyl acetate in combination with thermosetting silicone resin, the coating solution used to form the surface protective layer lacks stability, resulting in a short pot life. There was also a problem that whitening of the film would occur if too much was used.
一方、後者の併用系では、系を構成する樹脂が、何れも
硬化によって硬度の高い3次元構造を形成する熱硬化性
樹脂であるため、形成された表面保護層は表面硬度が高
いものとなるが、層中におけるシリコーンサイトとメラ
ミンサイトとの間の相溶性が十分でないため、両サイト
間に、構造的なトラップとなる空隙を多数少じて、帯電
特性が悪化したり、繰返し露光を行うと電位の安定性が
低下したりする等、電子写真感光体の感光特性に悪影響
を及ぼす虞があった。On the other hand, in the latter combined system, the resins that make up the system are all thermosetting resins that form a three-dimensional structure with high hardness when cured, so the formed surface protective layer has a high surface hardness. However, because the compatibility between the silicone site and the melamine site in the layer is not sufficient, there are many voids between the two sites that act as structural traps, resulting in poor charging characteristics and repeated exposure. There was a risk that the photosensitive characteristics of the electrophotographic photoreceptor would be adversely affected, such as a decrease in potential stability.
本発明者らの検討によれば、上記ブチルエーテル化メラ
ミン・ホルムアルデヒド樹脂に代えて、メチルエーテル
化メラミン・ホルムアルデヒド樹脂またはメチル−ブチ
ル混合エーテル化メラミン・ホルムアルデヒド樹脂(以
下、上記2つをまとめて「特定エーテル化メラミン◆ホ
ルムアルデヒド樹脂Jという)を使用した併用系では、
上記特定エーテル化メラミン・ホルムアルデヒド樹脂が
、従来のブチルエーテル化メラミン・ホルムアルデヒド
樹脂に比べて架橋性が高く、硬化時に、熱硬化性シリコ
ーン樹脂のSL −OH基と共有結合することはないが
、上記5LOH基との間に十分に大きい分子相互作用を
生じるため、層中におけるシリコーンサイトとメラミン
サイトとの相溶性が向上し、構造的トラップの少ない緻
密な膜を形成し得ることが判明した。また、上記併用系
では、メラミンの芳香族π電子によって層の導電性が向
上するものと推定されるため、メラミン・ホルムアルデ
ヒド樹脂を多量に配合することが考えられるが、熱硬化
性シリコーン樹脂の非揮発性固形分100重量部に対し
て、メチルエーテル化メラミン・ホルムアルデヒド樹脂
の場合には15重量部、メチル−ブチル混合エーテル化
メラミン・ホルムアルデヒド樹脂の場合には30重量部
を超えて配合した場合には、熱硬化性シリコーン樹脂に
対する相互作用が強すぎて、表面保護層に内部応力が生
じ、クラック等が発生するという問題があった。According to the studies of the present inventors, instead of the butyl etherified melamine/formaldehyde resin, methyl etherified melamine/formaldehyde resin or methyl-butyl mixed etherified melamine/formaldehyde resin (hereinafter, the above two are collectively referred to as "specific In the combination system using etherified melamine◆formaldehyde resin J),
The specific etherified melamine/formaldehyde resin has higher crosslinking properties than conventional butyl etherified melamine/formaldehyde resins, and does not covalently bond with the SL -OH group of the thermosetting silicone resin during curing. It was found that because a sufficiently large molecular interaction occurs with the group, the compatibility between the silicone site and the melamine site in the layer is improved, and a dense film with fewer structural traps can be formed. In addition, in the above combination system, it is assumed that the conductivity of the layer is improved by the aromatic π electrons of melamine, so it is possible to incorporate a large amount of melamine/formaldehyde resin. When blending exceeds 15 parts by weight in the case of methyl etherified melamine/formaldehyde resin and 30 parts by weight in the case of methyl-butyl mixed etherified melamine/formaldehyde resin, based on 100 parts by weight of volatile solids. had a problem in that the interaction with the thermosetting silicone resin was too strong, causing internal stress in the surface protective layer and causing cracks and the like.
そこで、さらに検討を行ったところ、上記クラックや、
シリコーンサイトとメラミンサイトとの間に生じる構造
的なトラップ、層の白濁、或いは摺動摩擦に対する損傷
等は、画像形成プロセスにおける下層への電荷の注入を
容易にする目的で表面保護層中に分散される、導電性付
与剤としての導電性金属酸化物粒子により助長されるこ
とが判明した。これは、上記導電性金属酸化物粒子が、
層を構成する樹脂と膨張収縮率等の物性が大きく異なる
ため、層の連続性を阻害することが主たる原因であると
考えられる。Therefore, after further consideration, we found the above crack,
Structural traps, clouding of the layer, damage caused by sliding friction, etc. that occur between the silicone site and the melamine site are dispersed in the surface protective layer in order to facilitate charge injection into the underlying layer during the image forming process. It has been found that this is facilitated by conductive metal oxide particles as a conductivity imparting agent. This means that the conductive metal oxide particles are
The main cause is considered to be that the continuity of the layer is inhibited because the physical properties such as expansion and contraction rate are significantly different from those of the resin constituting the layer.
この発明は、以上の事情に鑑みてなされたちのであって
、電子写真感光体の感光特性、物性等に悪影響を与える
ことなく、且つ熱硬化性シリコーン樹脂単独の場合に比
べて摺動摩擦に対する脆さ等が改善されており、しかも
、より導電性に優れた表面保護層を有する電子写真感光
体を提供することを目的としている。The present invention was made in view of the above circumstances, and does not adversely affect the photosensitive characteristics, physical properties, etc. of an electrophotographic photoreceptor, and is less brittle against sliding friction than a thermosetting silicone resin alone. It is an object of the present invention to provide an electrophotographic photoreceptor having a surface protective layer with improved conductivity.
く課題を解決するための手段〉
上記課題を解決するための、この発明の電子写真感光体
は、熱硬化性シリコーン樹脂と、この熱硬化性シリコー
ン樹脂の非揮発性固形分100重量部に対して25〜1
00重量部のメチルエーテル化メラミン・ホルムアルデ
ヒド樹脂および/またはメチル−ブチル混合エーテル化
メラミン・ホルムアルデヒド樹脂と、上記熱硬化性シリ
コーン樹脂の非揮発性固形分およびエーテル化メラミン
・ホルムアルデヒド樹脂の合計量に対して10〜20重
量%の熱可塑性樹脂とを含有し、且つ導電性付与剤を含
有しない塗布液を感光層上に塗布し、硬化させてなる表
面保護層を有することを特徴としている。Means for Solving the Problems> In order to solve the above problems, the electrophotographic photoreceptor of the present invention includes a thermosetting silicone resin and a thermosetting silicone resin containing 100 parts by weight of non-volatile solids of the thermosetting silicone resin. te25~1
00 parts by weight of methyl etherified melamine/formaldehyde resin and/or methyl-butyl mixed etherified melamine/formaldehyde resin, based on the total amount of the non-volatile solid content of the thermosetting silicone resin and etherified melamine/formaldehyde resin. It is characterized by having a surface protective layer formed by applying a coating liquid containing 10 to 20% by weight of a thermoplastic resin and not containing a conductivity imparting agent onto the photosensitive layer and curing the coating liquid.
上記構成からなる、この発明の電子写真感光体において
は、塗布液中に含有される特定エーテル化メラミン・ホ
ルムアルデヒド樹脂が、従来のブチルエーテル化メラミ
ン・ホルムアルデヒド樹脂に比べて架橋性が高く、硬化
時に、熱硬化性シリコーン樹脂のSt −OH基と共有
結合することはないが、上記5LOH基との間に十分に
大きい分子相互作用を生じるため、層中におけるシリコ
ーンサイトとメラミンサイトとの相溶性が向上し、構造
的トラップの少ない緻密な膜が形成される。また、塗布
液中には、層の連続性を阻害する導電性付与剤(導電性
金属酸化物粒子)が含有されておらず、しかも、上記塗
布液中に含有される熱可塑性樹脂が、表面保護層におい
て、内部応力を低減させる緩衝体として作用するので、
上記特定エーテル化メラミン・ホルムアルデヒド樹脂を
、より多量に層中に配合してもクラック等の発生する虞
がなく、上記特定エーテル化メラミンホルムアルデヒド
樹脂に基づく多量の芳香族π電子によって層の導電性を
さらに向上させることができるものと推定される。した
がって、この発明の電子写真感光体は感光特性に優れた
ものとなる。また、上記のように、層を構成する主成分
が、硬化によって3次元構造を形成する熱硬化性シリコ
ーン樹脂と特定エーテル化メラミン・ホルムアルデヒド
樹脂であるため、硬化後の表面保護層は表面硬度が高く
なる。しかも、前述したように両樹脂は相溶性が高く、
硬化後の3次元構造が複雑に入り組んだものとなって、
熱可塑性樹脂による弾力性の付与、および導電性付与剤
を含有しないことによる層の連続性の向上と相俟って、
熱硬化性シリコーン樹脂単独の場合に比べて摺動摩擦に
対する脆さ等が改善されたものとなる。In the electrophotographic photoreceptor of the present invention having the above configuration, the specific etherified melamine/formaldehyde resin contained in the coating liquid has higher crosslinking properties than the conventional butyl etherified melamine/formaldehyde resin, and upon curing, Although it does not covalently bond with the St -OH group of the thermosetting silicone resin, it creates a sufficiently large molecular interaction with the 5LOH group, improving the compatibility between the silicone site and the melamine site in the layer. However, a dense film with few structural traps is formed. In addition, the coating solution does not contain conductivity imparting agents (conductive metal oxide particles) that inhibit layer continuity, and the thermoplastic resin contained in the coating solution In the protective layer, it acts as a buffer to reduce internal stress, so
Even if a larger amount of the specified etherified melamine formaldehyde resin is blended into the layer, there is no risk of cracks occurring, and the conductivity of the layer is improved by the large amount of aromatic π electrons based on the specified etherified melamine formaldehyde resin. It is estimated that further improvements can be made. Therefore, the electrophotographic photoreceptor of the present invention has excellent photosensitivity. In addition, as mentioned above, the main components of the layer are a thermosetting silicone resin that forms a three-dimensional structure when cured, and a specific etherified melamine/formaldehyde resin, so the surface protective layer after curing has a low surface hardness. It gets expensive. Moreover, as mentioned above, both resins are highly compatible;
After curing, the three-dimensional structure becomes complex,
Together with the provision of elasticity by the thermoplastic resin and the improvement of layer continuity by not containing a conductivity imparting agent,
Compared to the case of using thermosetting silicone resin alone, the brittleness against sliding friction is improved.
なお、塗布液中における、熱硬化性シリコーン樹脂の非
揮発性固形分100重量部に対する、特定エーテル化メ
ラミン・ホルムアルデヒド樹脂の含有量が25〜100
重量部の範囲内、熱可塑性樹脂の含有割合が、シリコー
ン樹脂の非揮発性固形分と特定エーテル化メラミン・ホ
ルムアルデヒド樹脂との合計量の10〜20重量%の範
囲内に、それぞれ限定されるのは、下記の理由による。In addition, the content of the specific etherified melamine/formaldehyde resin is 25 to 100 parts by weight based on 100 parts by weight of the non-volatile solid content of the thermosetting silicone resin in the coating solution.
Within the range of parts by weight, the content ratio of the thermoplastic resin is limited to within the range of 10 to 20% by weight of the total amount of the non-volatile solid content of the silicone resin and the specific etherified melamine/formaldehyde resin. is due to the following reasons.
すなわち、特定エーテル化メラミン・ホルムアルデヒド
樹脂の含有量が25重量部未満では、熱可塑性樹脂の含
有割合に関係なく、硬化後の表面保護層に、摺動摩擦に
対する脆さ等の問題が生じる他、層中の芳香族π電子が
不足して感光特性が悪化する。In other words, if the content of the specific etherified melamine/formaldehyde resin is less than 25 parts by weight, problems such as brittleness against sliding friction will occur in the surface protective layer after curing, regardless of the content ratio of the thermoplastic resin, and the layer will also deteriorate. The photosensitive characteristics deteriorate due to a lack of aromatic π electrons.
一方、特定エーテル化メラミン中ホルムアルデヒド樹脂
の含有量が100重量部を超えると、熱硬化性シリコー
ン樹脂に対する相互作用が強すぎて、熱可塑性樹脂の配
合割合に関係なく、表面保護層に内部応力が生じ、クラ
ック等が発生して、きれいな表面保護層が得られなくな
る。On the other hand, if the formaldehyde resin content in the specified etherified melamine exceeds 100 parts by weight, the interaction with the thermosetting silicone resin will be too strong, causing internal stress in the surface protective layer regardless of the blending ratio of the thermoplastic resin. This causes cracks and the like, making it impossible to obtain a clean surface protective layer.
また、熱可塑性樹脂の含有割合が10重量%未満では、
特定エーテル化メラミン・ホルムアルデヒド樹脂の含有
量が多いほど、表面保護層に内部応力が生じ、クラック
等が発生して、きれいな表面保護層が得られなくなる。Moreover, if the content ratio of the thermoplastic resin is less than 10% by weight,
The higher the content of the specific etherified melamine/formaldehyde resin, the more internal stress will be generated in the surface protective layer, and cracks will occur, making it impossible to obtain a clean surface protective layer.
そして、熱可塑性樹脂の含有割合が20重量%を超える
と、表面保護層の軟化を生じる上、特定エーテル化メラ
ミン・ホルムアルデヒド樹脂の含有量が少ないほど、白
濁や感光特性の悪化等を生じる。If the content of the thermoplastic resin exceeds 20% by weight, the surface protective layer will become softened, and the lower the content of the specific etherified melamine/formaldehyde resin, the more clouding and deterioration of photosensitivity will occur.
塗布液中に含有される熱硬化性シリコーン樹脂は、テト
ラアルコキシシラン、トリアルコキシアルキルシラン、
ジアルコキシジアルキルシラン等のオルガノシラン、ト
リクロルアルキルシラン、ジクロルジアルキルシラン等
のオルガノ/Xロゲンシランなど、シラン系化合物の、
単独または2種以上の混合物の加水分解物(いわゆるオ
ルガノポリシロキサン)、またはその初期縮合反応物を
非揮発性固形分として、溶媒中に溶解または分散させた
もので、シラン化合物のアルコキシ基、アルキル基とし
ては、メトキシ基、エトキシ基、インプロポキシ基、t
−ブトキシ基、グリシドキシ基、メチル、エチル等の、
炭素数1〜4程度の低級基が挙げられる。The thermosetting silicone resin contained in the coating solution includes tetraalkoxysilane, trialkoxyalkylsilane,
Silane-based compounds such as organosilanes such as dialkoxydialkylsilanes, organo/Xlogensilanes such as trichloroalkylsilanes and dichlorodialkylsilanes,
A hydrolyzate (so-called organopolysiloxane) of a single substance or a mixture of two or more thereof, or an initial condensation reaction product thereof, is dissolved or dispersed in a solvent as a non-volatile solid content, and is a non-volatile solid content of a hydrolyzate (so-called organopolysiloxane) or a mixture of two or more thereof, dissolved or dispersed in a solvent. Examples of groups include methoxy group, ethoxy group, impropoxy group, t
-Butoxy group, glycidoxy group, methyl, ethyl, etc.
Examples include lower groups having about 1 to 4 carbon atoms.
上記熱硬化性シリコーン樹脂と併用される特定エーテル
化メラミン・ホルムアルデヒド樹脂のうち、メチルエー
テル化メラミン・ホルムアルデヒド樹脂は、メラミンと
ホルムアルデヒドとの反応物であるモノないしヘキサの
各種メチロールメラミンにおけるメチロール基の一部ま
たは全部がメチルエーテル化したもの、またはその初期
縮合反応物であり、液状ないしシロップ状等の状態で供
給されるものが好ましく用いられる。Among the specific etherified melamine/formaldehyde resins used in combination with the above thermosetting silicone resin, methyl etherified melamine/formaldehyde resin is a mono- or hexa-methylol melamine that is a reaction product of melamine and formaldehyde. It is preferably used that is partially or entirely methyl etherified or its initial condensation reaction product, and is supplied in a liquid or syrup state.
上記メチルエーテル化メラミン・ホルムアルデヒド樹脂
の数平均分子量はこの発明では特に限定されないが、1
500を超えると反応性が低下するので、上記数平均分
子量は1500以下であることが好ましい。また、上記
樹脂は、メラミン核1個当たりの結合ホルムアルデヒド
数が3〜6個であり、そのうちの3〜6個がメチルエー
テル化したものであることが好ましい。メラミン核1個
当たりの結合ホルムアルデヒド数が3個未満では、表面
保護層が機械的強度に劣ったものとなる虞がある。また
、上記ホルムアルデヒドのうちメチルエーテル化した個
数が3個未満では、表面保護層用の塗布液が安定性に欠
けたものとなる虞がある。The number average molecular weight of the methyl etherified melamine/formaldehyde resin is not particularly limited in this invention;
If it exceeds 500, the reactivity decreases, so the number average molecular weight is preferably 1,500 or less. Moreover, the number of bound formaldehydes per melamine nucleus in the resin is 3 to 6, and it is preferable that 3 to 6 of them are methyl etherified. If the number of bound formaldehydes per melamine nucleus is less than 3, there is a risk that the surface protective layer will have poor mechanical strength. Furthermore, if the number of methyl etherified formaldehydes is less than three, the coating solution for the surface protective layer may lack stability.
一方、メチル−ブチル混合エーテル化メラミン・ホルム
アルデヒド樹脂は、上記モノないしヘキサの各種メチロ
ールメラミンにおけるメチロール基の少なくとも1つが
メチルエーテル化し、残余のメチロール基の少なくとも
1つがブチルエーテル化したもの、またはその初期縮合
反応物であり、同じく液状ないしシロップ状等の状態で
供給されるものが好ましく用いられる。On the other hand, the methyl-butyl mixed etherified melamine/formaldehyde resin is one in which at least one of the methylol groups in the mono- or hexa-methylol melamine is methyl etherified and at least one of the remaining methylol groups is butyl etherified, or an initial condensation thereof. It is a reactant, and those supplied in a liquid or syrupy state are preferably used.
」二紀メチルーブチル混合エーテル化メラミン・ホルム
アルデヒド樹脂の数平均分子量はこの発明では特に限定
されないか、1500を超えると反応性が低下するので
、上記数平均分子量は1500以下であることが好まし
い。また、上記樹脂は、メラミン核1個当たりの結合ホ
ルムアルデヒド数が3〜6個であり、そのうちの2〜5
個がメチルエーテル化し、1〜2個がブチルエーテル化
したものであることが好ましい。メラミン核1個当たり
の結合ホルムアルデヒド数が3個未満では表面保護層が
機械的強度に劣ったものとなる虞がある。また、上記ホ
ルムアルデヒドのうちメチルエーテル化した個数が2個
未満では繰り返し露光による表面電位の低下が大きくな
り、5個を超えると、クラックが発生し易くなる虞があ
る。The number average molecular weight of the secondary methyl-butyl mixed etherified melamine/formaldehyde resin is not particularly limited in the present invention, or if it exceeds 1,500, the reactivity decreases, so the number average molecular weight is preferably 1,500 or less. In addition, the above resin has 3 to 6 formaldehyde bonds per melamine nucleus, of which 2 to 5
It is preferable that 1 or 2 are methyl etherified and 1 or 2 are butyl etherified. If the number of bound formaldehydes per melamine nucleus is less than 3, the surface protective layer may have poor mechanical strength. Furthermore, if the number of methyl etherified formaldehydes is less than 2, the surface potential will decrease significantly due to repeated exposure, and if it exceeds 5, cracks may easily occur.
また、ブチルエーテル化した個数が1個未満ではクラッ
クが発生し易くなり、3個を超えると繰り返し露光によ
る表面電位の低下が大きくなる虞がある。Furthermore, if the number of butyl etherified particles is less than one, cracks are likely to occur, and if it exceeds three, there is a risk that the surface potential will decrease significantly due to repeated exposure.
なお、上記各硬化性樹脂は、条件によっては触媒を用い
なくても、加熱するだけで硬化させることができるが、
通常、硬化反応をスムーズ且つ均一に完結させるために
触媒を用いる場合が多い。Note that each of the above-mentioned curable resins can be cured by simply heating without using a catalyst depending on the conditions.
Usually, a catalyst is often used to complete the curing reaction smoothly and uniformly.
硬化用触媒としては、無機酸または有機酸、アミン類な
どのアルカリ等、種々のものを使用することができる。As the curing catalyst, various catalysts can be used, such as inorganic acids, organic acids, and alkalis such as amines.
また、必要に応じて、従来公知の硬化助剤等を併用する
こともできる。Further, if necessary, a conventionally known curing aid or the like can be used in combination.
上記熱硬化性シリコーン樹脂および特定エーテル化メラ
ミン・ホルムアルデヒド樹脂と共に表面保護層中に含有
される熱可塑性樹脂としては、スチレン系重合体;アク
リル系重合体;スチレンアクリル系共重合体;ポリエチ
レン、エチレン−酢酸ビニル共重合体、塩素化ポリエチ
レン、ポリプロピレン、アイオノマー等のオレフィン系
重合体;ポリ塩化ビニル;塩化ビニル−酢酸ビニル共重
合体;ポリ酢酸ビニル;飽和ポリエステル;ポリアミド
;熱可塑性ポリウレタン樹脂;ポリカーボネート;ボリ
アリレート;ポリスルホン;ケトン樹脂;ポリビニルブ
チラール樹脂;ポリエーテル樹脂等の、種々の合成樹脂
材料が使用できるが、特に、ポリ酢酸ビニルとアクリル
系重合体が好適に使用される。The thermoplastic resins contained in the surface protective layer together with the thermosetting silicone resin and the specific etherified melamine/formaldehyde resin include styrene polymers; acrylic polymers; styrene-acrylic copolymers; polyethylene, ethylene- Olefin polymers such as vinyl acetate copolymers, chlorinated polyethylene, polypropylene, and ionomers; polyvinyl chloride; vinyl chloride-vinyl acetate copolymers; polyvinyl acetate; saturated polyesters; polyamides; thermoplastic polyurethane resins; polycarbonates; Various synthetic resin materials can be used, such as arylate, polysulfone, ketone resin, polyvinyl butyral resin, and polyether resin, but polyvinyl acetate and acrylic polymers are particularly preferably used.
熱可塑性樹脂としてポリ酢酸ビニルを用いた系では、ポ
リ酢酸ビニルの持つ柔軟性により、表面保護層の脆さが
改善されて、機械的強度が向上し、長寿命化が可能にな
る。In systems using polyvinyl acetate as the thermoplastic resin, the flexibility of polyvinyl acetate improves the brittleness of the surface protective layer, improves mechanical strength, and makes it possible to extend the lifespan.
一方、熱可塑性樹脂としてポリメチルメタクリレート(
PMMA)等のアクリル系重合体を用いた系では、上記
アクリル系重合体の持つ高い光学特性に基づいて、より
一層の光感度化が可能になる。On the other hand, polymethyl methacrylate (
In a system using an acrylic polymer such as PMMA), further photosensitivity can be achieved based on the high optical properties of the acrylic polymer.
なお、上記ポリ酢酸ビニルおよびアクリル系重合体は、
それぞれ単独で使用できる他、両者を併用することもて
き、さらに、その他の熱可塑性樹脂を配合することも可
能である。In addition, the above polyvinyl acetate and acrylic polymer are
Each can be used alone or both can be used in combination, and it is also possible to mix other thermoplastic resins.
上記各成分を溶解または分散して、表面保護層用の塗布
液を構成する溶媒としては、例えばイソプロピルアルコ
ール;n−ヘキサン、オクタン、シクロヘキサン等の脂
肪族系炭化水素;ベンゼン、トルエン、キシレン等の芳
香族炭化水素;ジクロロメタン、ジクロロエタン、四塩
化炭素、クロロベンゼン等のハロゲン化炭化水素;ジメ
チルエーテル、ジエチルエーテル、テトラヒドロフラン
、エチレングリコールジメチルエーテル、エチレングリ
コールジエチルエーテル、ジエチレングリコールジメチ
ルエーテル等のエーテル類:アセトン、メチルエチルケ
トン、シクロヘキサノン等のケトン類;酢酸エチル、酢
酸メチル等のエステル類;ジメチルホルムアミド;ジメ
チルスルホキシド等が挙げられ、これらが単独で、また
は二種以上混合して使用される。Examples of solvents for dissolving or dispersing the above components to form a coating solution for the surface protective layer include isopropyl alcohol; aliphatic hydrocarbons such as n-hexane, octane, and cyclohexane; benzene, toluene, and xylene; Aromatic hydrocarbons; halogenated hydrocarbons such as dichloromethane, dichloroethane, carbon tetrachloride, chlorobenzene; ethers such as dimethyl ether, diethyl ether, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether; acetone, methyl ethyl ketone, cyclohexanone, etc. Ketones; esters such as ethyl acetate and methyl acetate; dimethylformamide; dimethyl sulfoxide; these may be used alone or in combination of two or more.
上記表面保護層を構成する結着樹脂には、膜の特性を損
なわない範囲で、前記以外の熱硬化性樹脂を併用するこ
とができる。前記以外の他の熱硬化性樹脂としては、硬
化性アクリル樹脂;アルキッド樹脂;不飽和ポリエステ
ル樹脂;ジアリルフタレート樹脂;フェノール樹脂;尿
素樹脂;ベンゾグアナミン樹脂;特定エーテル化系およ
びブチルエーテル化系以外のメラミン樹脂が例示される
。As the binder resin constituting the surface protective layer, thermosetting resins other than those mentioned above can be used in combination as long as the properties of the film are not impaired. Other thermosetting resins other than those mentioned above include curable acrylic resins; alkyd resins; unsaturated polyester resins; diallyl phthalate resins; phenol resins; urea resins; benzoguanamine resins; melamine resins other than specific etherification type and butyl etherification type. is exemplified.
上記表面保護層には、ターフェニル、ハロナフトキノン
類、アセナフチレン等従来公知の増感剤;9− (N、
N−ジフェニルヒドラジノ)フルオレン、9−力ルバゾ
リルイミノフルオレン等のフルオレン系化合物;導電性
付与剤;アミン系、フェノール系等の酸化防止剤、ベン
ゾフェノン系等の紫外線吸収剤などの劣化防止剤;可塑
剤など、種々の添加剤を含有させることができる。The surface protective layer contains conventionally known sensitizers such as terphenyl, halonaphthoquinones, and acenaphthylene;
Fluorene compounds such as N-diphenylhydrazino)fluorene and 9-rubazolyliminofluorene; Conductivity imparting agents; Deterioration inhibitors such as amine-based and phenol-based antioxidants, and benzophenone-based ultraviolet absorbers. ; Various additives such as plasticizers can be contained.
上記表面保護層の膜厚は、0.1〜10μm、特に2〜
5μ■の範囲内であることが好ましい。The thickness of the surface protective layer is 0.1 to 10 μm, particularly 2 to 10 μm.
It is preferably within the range of 5μ.
なお、この発明感光体は、表面保護層以外の構成につい
ては、従来と同様の材料を用い、従来同様の構成とする
ことができる。The photoreceptor of the present invention can be constructed using the same materials as the conventional photoreceptor except for the surface protective layer.
まず、導電性基材について述べる。First, the conductive base material will be described.
導電性基材は、電子写真感光体が組み込まれる画像形成
装置の機構、構造に対応してシート状あるいはドラム状
など、適宜の形状に形成される。The conductive base material is formed into an appropriate shape, such as a sheet shape or a drum shape, depending on the mechanism and structure of the image forming apparatus in which the electrophotographic photoreceptor is installed.
また、上記導電性基材は、全体を金属などの導電性材料
で構成しても良く、基材自体は導電性を有しない構造材
料で形成し、その表面に導電性を付与しても良い。Further, the conductive base material may be entirely composed of a conductive material such as metal, or the base material itself may be formed of a structural material that does not have conductivity, and its surface may be imparted with conductivity. .
なお、前者の構造を有する導電性基材において使用され
る導電性材料としては、表面かアルマイト処理された、
または未処理のアルミニウム、銅、スズ、白金、金、銀
、バナジウム、モリブデン、クロム、カドミウム、チタ
ン、ニッケル、パラジウム、インジウム、ステンレス鋼
、真鍮等の金属材料が好ましい。In addition, the conductive materials used in the conductive base material having the former structure include those whose surfaces are alumite-treated,
Alternatively, metal materials such as untreated aluminum, copper, tin, platinum, gold, silver, vanadium, molybdenum, chromium, cadmium, titanium, nickel, palladium, indium, stainless steel, and brass are preferred.
一方、後者の構造としては、合成樹脂製基材またはガラ
ス基材の表面に、上記例示の金属や、ヨウ化アルミニウ
ム、酸化スズ、酸化インジウム等の導電性材料からなる
薄膜が、真空蒸着法または湿式めっき法などの公知の膜
形成方法によって積層された構造、上記合成樹脂成形品
やガラス基材の表面に上記金属材料等のフィルムがラミ
ネートされた構造、上記合成樹脂成形品やガラス基材の
表面に、導電性を付与する物質が注入された構造が例示
される。On the other hand, in the latter structure, a thin film made of a conductive material such as the above-mentioned metal, aluminum iodide, tin oxide, or indium oxide is deposited on the surface of a synthetic resin base material or a glass base material using a vacuum evaporation method or A structure in which a film of the above-mentioned metal material is laminated on the surface of the above-mentioned synthetic resin molded product or glass base material, a structure in which a film of the above-mentioned metal material, etc. is laminated on the surface of the above-mentioned synthetic resin molded product or glass base material, etc. An example is a structure in which a substance imparting conductivity is injected into the surface.
なお、導電性基材は、必要に応じて、シランカツプリン
グ剤やチタンカップリング剤などの表面処理剤で表面処
理を施し、感光層との密着性を高めても良い。Note that the conductive base material may be surface-treated with a surface treatment agent such as a silane coupling agent or a titanium coupling agent to improve adhesion to the photosensitive layer, if necessary.
次に、導電性基村上に形成される感光層について述べる
。Next, the photosensitive layer formed on the conductive substrate will be described.
感光層は、半導体材料や有機材料、またはこれらの複合
材料からなる下記構成のものが使用できる。The photosensitive layer can be made of a semiconductor material, an organic material, or a composite material thereof and has the following structure.
■ 半導体材料からなる単層型の感光層。■ Single-layer photosensitive layer made of semiconductor material.
■ 結着樹脂中に電荷発生材料と電荷輸送材料とを含有
する単層型の有機感光層。■ A single-layer organic photosensitive layer containing a charge-generating material and a charge-transporting material in a binder resin.
■ 結着樹脂中に電荷発生材料を含有する電荷発生層と
、結着樹脂中に電荷輸送材料を含有する電荷輸送層とか
らなる積層型の有機感光層。■ A laminated organic photosensitive layer consisting of a charge generation layer containing a charge generation material in a binder resin and a charge transport layer containing a charge transport material in a binder resin.
■ 半導体材料からなる電荷発生層と、上記有機の電荷
輸送層とが積層された複合型の感光層。(2) A composite photosensitive layer in which a charge generation layer made of a semiconductor material and the organic charge transport layer described above are laminated.
複合型感光層において電荷発生層として用いられると共
に、単独でも感光層を形成できる半導体材料としては、
例えばa −As2 Sei 、a −5eAsTe等
のアモルファスカルコゲン化物やアモルファスセレン(
a−Se)、アモルファスシリコン(a −3t)が例
示される。上記半導体材料からなる感光層または電荷発
生層は、真空蒸着法、グロー放電分解法等の公知の薄膜
形成方法によって形成することができる。Semiconductor materials that can be used as a charge generation layer in a composite photosensitive layer and can also form a photosensitive layer by themselves include:
For example, amorphous chalcogenides such as a-As2Sei, a-5eAsTe, amorphous selenium (
a-Se) and amorphous silicon (a-3t). The photosensitive layer or charge generation layer made of the above semiconductor material can be formed by a known thin film forming method such as a vacuum deposition method or a glow discharge decomposition method.
単層型または積層型の有機感光層における電荷発生層に
使用される、有機または無機の電荷発生材料としては、
例えば前記例示の半導体材料の粉末:ZnO1cdS等
のn−vt族機微品;ビリリウム塩;アゾ系化合物;ビ
スアゾ系化合物;フタロシアニン系化合物:アンサンス
ロン系化合物;ペリレン系化合物;インジゴ系化合物;
トリフェニルメタン系化合物;スレン系化合物;トルイ
ジン系化合物;ピラゾリン系化合物;キナクリドン系化
合物;ピロロビロール系化合物が例示される。そして、
上記例示の化合物の中でも、フタロシアニン系化合物に
属する、α型、β型、γ型など種々の結晶型を有するア
ルミニウムフタロシアニン、銅フタロシアニン、メタル
フリーフタロシアニン、オキソチタニルフタロシアニン
等が好ましく用いられ、特に、上記メタルフリーフタロ
シアニンおよび/またはオキソチタニルフタロシアニン
がより好ましく用いられる。なお、上記電荷発生材料は
、それぞれ単独で用いられる他、複数種を併用しても良
い。Organic or inorganic charge-generating materials used in the charge-generating layer in single-layer or laminated organic photosensitive layers include:
For example, powders of semiconductor materials as exemplified above: n-vt group fines such as ZnO1cdS; biryllium salts; azo compounds; bisazo compounds; phthalocyanine compounds: anthanthrone compounds; perylene compounds; indigo compounds;
Examples include triphenylmethane compounds; thren compounds; toluidine compounds; pyrazoline compounds; quinacridone compounds; and pyrrolovirol compounds. and,
Among the above-exemplified compounds, aluminum phthalocyanine, copper phthalocyanine, metal-free phthalocyanine, oxotitanyl phthalocyanine, etc., which belong to phthalocyanine compounds and have various crystal forms such as α-type, β-type, and γ-type, are preferably used, and in particular, the above-mentioned Metal-free phthalocyanine and/or oxotitanyl phthalocyanine are more preferably used. Note that the charge generating materials described above may be used alone or in combination.
また、上記単層型または積層型の有機感光層や、複合型
の感光層における電荷輸送層中に含まれる電荷輸送材料
としては、例えばテトラシアノエチレン;2,4.7−
1リニトロ−9−フルオレノン等のフルオレノン系化合
物;ジニトロアントラセン等のニトロ化化合物;無水コ
ハク酸;無水マレイン酸;ジブロモ無水マレイン酸;ト
リフェニルメタン系化合物;2,5−ジ(4−ジメチル
アミノフェニル)−13,4−オキサジアゾール等のオ
キサジアゾール系化合物、9−(4−ジエチルアミノス
チリル)アントラセン等のスチリル系化合物;ポリ−N
−ビニルカルバゾール等のカルバゾール系化合物;1−
フェニル−3−(p −ジメチルアミノフェニル)ピラ
ゾリン等のピラゾリン系化合物、4 4’、4’−トリ
ス(N、 N−ジフェニルアミノ)トリフェニルアミン
等のアミン誘導“体;1,1−ビス(4−ジエチルアミ
ノフェニル)−4,4−ジフェニル−1,3−ブタジェ
ン等の共役不飽和化合物、4− (N、N−ジエチルア
ミノ)ベンズアルデヒド−N、N−ジフェニルヒドラゾ
ン等のヒドラゾン系化合物;インドール系化合物、オキ
サゾール系化合物、イソオキサゾール系化合物、チアゾ
ール系化合物、チアジアゾール系化合物、イミダゾール
系化合物、ピラゾール系化合物、ピラゾリン系化合物、
トリアゾール系化合物等の含窒素環式化合物;縮合多環
族化合物が例示される。上記電荷輸送材料も単独で、あ
るいは、複数種併用して用いることができる。なお、上
記電荷輸送材料の中でも、前記ポリ−N−ビニルカルバ
ゾール等の光導電性を有する高分子材料は、感光層の結
着樹脂としても使用することができる。Further, as the charge transport material contained in the charge transport layer in the single layer type or multilayer type organic photosensitive layer or the composite type photosensitive layer, for example, tetracyanoethylene; 2,4.7-
Fluorenone compounds such as 1-linitro-9-fluorenone; nitrated compounds such as dinitroanthracene; succinic anhydride; maleic anhydride; dibromomaleic anhydride; triphenylmethane compounds; 2,5-di(4-dimethylaminophenyl) )-Oxadiazole compounds such as 13,4-oxadiazole, styryl compounds such as 9-(4-diethylaminostyryl)anthracene; poly-N
- Carbazole compounds such as vinyl carbazole; 1-
Pyrazoline compounds such as phenyl-3-(p-dimethylaminophenyl)pyrazoline; amine derivatives such as 4',4'-tris(N,N-diphenylamino)triphenylamine; 1,1-bis( Conjugated unsaturated compounds such as 4-diethylaminophenyl)-4,4-diphenyl-1,3-butadiene; hydrazone compounds such as 4-(N,N-diethylamino)benzaldehyde-N,N-diphenylhydrazone; indole compounds , oxazole compounds, isoxazole compounds, thiazole compounds, thiadiazole compounds, imidazole compounds, pyrazole compounds, pyrazoline compounds,
Nitrogen-containing cyclic compounds such as triazole compounds; fused polycyclic compounds are exemplified. The above charge transport materials can also be used alone or in combination. Incidentally, among the above-mentioned charge transport materials, a polymeric material having photoconductivity such as the above-mentioned poly-N-vinylcarbazole can also be used as a binder resin for the photosensitive layer.
また、前記単層型または積層型の有機感光層、複合型感
光層における電荷輸送層などの層には、前記増感剤、フ
ルオレン系化合物、酸化防止剤、紫外線吸収剤等の劣化
防止剤、可塑剤などの添加剤を含有させることができる
。In addition, in layers such as the single layer type or laminated type organic photosensitive layer and the charge transport layer in the composite type photosensitive layer, deterioration inhibitors such as the sensitizer, fluorene compound, antioxidant, and ultraviolet absorber, Additives such as plasticizers can be included.
単層型の有機感光層における、結着樹脂100重量部に
対する電荷発生材料の含有割合は、2〜20重量部の範
囲内、特に3〜15重量部の範囲内であることが好まし
く、一方、結着樹脂100重量部に対する電荷輸送材料
の含有割合は、40〜200重量部の範囲内、特に50
〜100重量部の範囲内であることが好ましい。電荷発
生材料が2重量部未満、または、電荷輸送材料が40重
量部未満では、感光体の感度が不充分になったり残留電
位が大きくなったりするからであり、電荷発生材料が2
0重量部を超え、または、電荷輸送材料が200重量部
を超えると、感光体の耐摩耗性が十分に得られなくなる
からである。In the single-layer type organic photosensitive layer, the content ratio of the charge generating material to 100 parts by weight of the binder resin is preferably within the range of 2 to 20 parts by weight, particularly within the range of 3 to 15 parts by weight; The content ratio of the charge transport material to 100 parts by weight of the binder resin is within the range of 40 to 200 parts by weight, particularly 50 parts by weight.
It is preferably within the range of 100 parts by weight. This is because if the charge generation material is less than 2 parts by weight or the charge transport material is less than 40 parts by weight, the sensitivity of the photoreceptor becomes insufficient or the residual potential increases.
This is because if the amount exceeds 0 parts by weight or if the amount of the charge transport material exceeds 200 parts by weight, sufficient abrasion resistance of the photoreceptor cannot be obtained.
上記単層型感光層は、適宜の厚みに形成できるが、通常
は、10〜50岬、特に15〜25μmの範囲内に形成
されることが好ましい。The single-layer type photosensitive layer can be formed to have an appropriate thickness, but it is usually preferably formed within a range of 10 to 50 μm, particularly 15 to 25 μm.
一方、積層型の有機感光層を構成する層のうち、電荷発
生層における、結着樹脂100重量部に対する電荷発生
材料の含有割合は、5〜500重量部の範囲内、特に1
0〜250重量部の範囲内であることが好ましい。電荷
発生材料が5重量部未満では電荷発生能が小さ過ぎ、5
00重量部を超えると隣接する他の層や基材との密着性
が低下するからである。On the other hand, among the layers constituting the laminated organic photosensitive layer, the content ratio of the charge generating material in the charge generating layer to 100 parts by weight of the binder resin is within the range of 5 to 500 parts by weight, particularly 1
It is preferably within the range of 0 to 250 parts by weight. If the charge generation material is less than 5 parts by weight, the charge generation ability is too small;
This is because if the amount exceeds 0.00 parts by weight, the adhesion with other adjacent layers or the base material will decrease.
上記電荷発生層の膜厚は、0.01〜3μm5特に0.
1〜2μ朧の範囲内であることが好ましい。The thickness of the charge generation layer is 0.01 to 3 μm5, especially 0.01 μm to 3 μm5.
It is preferably within the range of 1 to 2 μm.
また、積層型の有機感光層および複合型感光層を構成す
る層のうち、電荷輸送層における、結着樹脂100重量
部に対する電荷輸送材料の含有割合は、10〜500重
量部の範囲内、特に25〜200重量部の範囲内である
ことが好ましい。電荷輸送材料が10重量部未満では電
荷輸送能が十分でなく、500重量部を超えると電荷輸
送層の機械的強度が低下するからである。Further, among the layers constituting the laminated organic photosensitive layer and the composite photosensitive layer, the content ratio of the charge transport material to 100 parts by weight of the binder resin in the charge transport layer is within the range of 10 to 500 parts by weight, particularly It is preferably within the range of 25 to 200 parts by weight. This is because if the amount of the charge transport material is less than 10 parts by weight, the charge transport ability will not be sufficient, and if it exceeds 500 parts by weight, the mechanical strength of the charge transport layer will decrease.
上記電荷輸送層の膜厚は、2〜100μm1特に5〜3
0μmの範囲内であることが好ましい。The thickness of the charge transport layer is 2 to 100 μm, especially 5 to 3 μm.
It is preferably within the range of 0 μm.
以上に説明した、単層型や積層型の有機感光層、複合型
感光層のうちの電荷輸送層、および表面保護層などの有
機の層は、前述した各成分を含有する各履用の塗布液を
調製し、これら塗布液を、前述した層構成を形成し得る
ように、各層毎に順次導電性基村上に塗布し、乾燥また
は硬化させることで積層形成することができる。The organic layers described above, such as the single-layer type or laminated type organic photosensitive layer, the charge transport layer of the composite type photosensitive layer, and the surface protective layer, are coated with each layer containing the above-mentioned components. Lamination can be formed by preparing a liquid, applying these coating liquids to the conductive substrate layer by layer in order so as to form the above-mentioned layer structure, and drying or curing the coating liquid.
なお、上記塗布液の調製に際しては、使用される結着樹
脂等の種類に応じて種々の溶剤を使用することができる
。上記溶剤としては、n−ヘキサン、オクタン、シクロ
ヘキサン等の脂肪族炭化水素;ベンゼン、キシレン、ト
ルエン等の芳香族炭化水素;ジクロロメタン、四塩化炭
素、クロロベンゼン、塩化メチレン等のハロゲン化炭化
水素:メチルアルコール、エチルアルコール、イソプロ
ピルアルコール、アリルアルコール、シクロペンタノー
ル、ベンジルアルコール、フルフリルアルコール、ジア
セトンアルコール等のアルコール類;ジメチルエーテル
、ジエチルエーテル、テトラヒドロフラン、エチレング
リコールジメチルエーテル、エチレングリコールジエチ
ルエーテル、ジエチレングリコールジメチルエーテル等
のエーテル類;アセトン、メチルエチルケトン、メチル
イソブチルケトン、シクロヘキサノン等のケトン類;酢
酸エチル、酢酸メチル等のエステル類;ジメチルホルム
アミド;ジメチルスルホキシド等、種々の溶剤が例示さ
れ、これらが一種または二種以上混合して用いられる。In addition, when preparing the above-mentioned coating liquid, various solvents can be used depending on the type of binder resin and the like used. The above-mentioned solvents include aliphatic hydrocarbons such as n-hexane, octane, and cyclohexane; aromatic hydrocarbons such as benzene, xylene, and toluene; halogenated hydrocarbons such as dichloromethane, carbon tetrachloride, chlorobenzene, and methylene chloride; and methyl alcohol. , ethyl alcohol, isopropyl alcohol, allyl alcohol, cyclopentanol, benzyl alcohol, furfuryl alcohol, diacetone alcohol, and other alcohols; dimethyl ether, diethyl ether, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, and other ethers Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; Esters such as ethyl acetate and methyl acetate; Dimethyl formamide; Dimethyl sulfoxide; used.
また、上記塗布液を調製する際、分散性、塗工性等を向
上させるため、界面活性剤やレベリング剤等を併用して
も良い。Further, when preparing the above coating liquid, a surfactant, a leveling agent, etc. may be used in combination to improve dispersibility, coatability, etc.
また、上記塗布液は従来慣用の方法、例えばミキサー
ボールミル、ペイントシェーカー サンドミル、アトラ
イター、超音波分散機等を用いて調製することができる
。In addition, the above coating liquid can be prepared by a conventional method such as a mixer.
It can be prepared using a ball mill, paint shaker sand mill, attritor, ultrasonic dispersion machine, etc.
〈実施例〉
以下に、実施例に基づき、この発明をより詳細に説明す
る。<Examples> The present invention will be described in more detail below based on Examples.
実施例1〜6、比較例1〜16
結着樹脂としてのボリアリレー1・(ユニチカ社製、商
品名U−100)100重量部、電荷輸送材料としての
4−(N、N−ジエチルアミノ)ベンズアルデヒド−N
、N−ジフェニルヒドラゾン100重量部および溶媒と
しての塩化メチレン(CH2Cl2)900重量部から
なる電荷輸送用塗布液を調製し、この塗布液を外径78
■×長さ340 m+wのアルミニウム管上に塗布した
後、90℃で30分間加熱乾燥させて、膜厚的20μm
の電荷輸送層を形成した。Examples 1 to 6, Comparative Examples 1 to 16 100 parts by weight of Boria Relay 1 (manufactured by Unitika, trade name U-100) as a binder resin, 4-(N,N-diethylamino)benzaldehyde as a charge transport material N
, 100 parts by weight of N-diphenylhydrazone and 900 parts by weight of methylene chloride (CH2Cl2) as a solvent.
■ After coating on an aluminum tube with a length of 340 m + w, it was heated and dried at 90°C for 30 minutes to form a film with a thickness of 20 μm.
A charge transport layer was formed.
次に、上記電荷輸送層上に、電荷発生材料としての2□
7−ジブロモアンサンスロン(IC1社製)80重量
部およびメタルフリーフタロシアニン(BASF社製)
20重量部、結着樹脂としてのポリ酢酸ビニル(日本合
成化学社製、商品名Y5−N)50重量部および溶媒と
してのジアセトンアルコール2000重量部からなる電
荷発生層用塗布液を塗布し、110℃で30分間加熱乾
燥させて、膜厚的0.5μ−の電荷発生層を形成した。Next, on the charge transport layer, 2□ as a charge generating material is applied.
80 parts by weight of 7-dibromoanthanthrone (manufactured by IC1) and metal-free phthalocyanine (manufactured by BASF)
20 parts by weight of polyvinyl acetate (manufactured by Nippon Gosei Kagaku Co., Ltd., trade name: Y5-N) as a binder resin, and 2000 parts by weight of diacetone alcohol as a solvent. It was dried by heating at 110° C. for 30 minutes to form a charge generation layer having a thickness of 0.5 μm.
次に、0.02N塩酸57.4重量部とイソプロピルア
ルコール36重量部とを混合し、上記混合液の液温を2
0〜25℃に保ちつつ攪拌しながら、メチルトリメトキ
シシラン80重量部およびグリシドキシプロピルトリメ
トキシシラン20重量部を徐々に滴下した後、室温に1
時間放置することによってシラン加水分解物溶液を得た
。そして、このシラン加水分解物溶液に、同溶液中の非
揮発性固形分に対し、表1に示す配合量の特定エーテル
化メラミン・ホルムアルデヒド樹脂と、上記熱硬化性シ
リコーン樹脂の非揮発性固形分および特定エーテル化メ
ラミン・ホルムアルデヒド樹脂の合計量に対し、同表に
示す配合割合のポリビニルブチラール(電気化学社製、
商品名デンカブチラール5000A)とを配合して表面
保護層用の塗布液を調製した。Next, 57.4 parts by weight of 0.02N hydrochloric acid and 36 parts by weight of isopropyl alcohol were mixed, and the liquid temperature of the above mixture was lowered to 2.
While stirring and maintaining the temperature at 0 to 25°C, 80 parts by weight of methyltrimethoxysilane and 20 parts by weight of glycidoxypropyltrimethoxysilane were gradually added dropwise.
A silane hydrolyzate solution was obtained by standing for a period of time. Then, in this silane hydrolyzate solution, a specific etherified melamine/formaldehyde resin in the amount shown in Table 1 and the non-volatile solid content of the thermosetting silicone resin are added to the non-volatile solid content in the solution. Polyvinyl butyral (manufactured by Denki Kagaku Co., Ltd.,
A coating solution for a surface protective layer was prepared by blending the product with Denka Butyral 5000A (trade name).
そして、上記塗布液を前記電荷発生層上に塗布し、11
0℃で1時間加熱硬化させて、膜厚的2.5μ−の表面
保護層を形成し、積層形感光層を有するドラム型の電子
写真感光体を作製した。Then, the coating liquid is applied onto the charge generation layer, and 11
The material was cured by heating at 0° C. for 1 hour to form a surface protective layer having a thickness of 2.5 μm, thereby producing a drum-shaped electrophotographic photoreceptor having a laminated photosensitive layer.
実施例7〜16、比較例17〜32
ポリビニルブチラールに代えて、表2に示す配合割合の
ポリ酢酸ビニル(日本合成化学社製、商品名Y5−N)
を使用したこと以外は、上記実施例1〜6と同様にして
、電子写真感光体を作製した。Examples 7 to 16, Comparative Examples 17 to 32 Instead of polyvinyl butyral, polyvinyl acetate (manufactured by Nippon Gosei Kagaku Co., Ltd., trade name Y5-N) with the blending ratio shown in Table 2 was used.
Electrophotographic photoreceptors were produced in the same manner as in Examples 1 to 6 above, except that .
実施例17〜28、比較例33〜48
ポリビニルブチラールに代えて、表3に示す配合割合の
アクリル系重合体(三菱レイヨン社製、商品名BR−1
05)を使用したこと以外は、上記実施例1〜6と同様
にして、電子写真感光体を作製した。Examples 17 to 28, Comparative Examples 33 to 48 Instead of polyvinyl butyral, an acrylic polymer (manufactured by Mitsubishi Rayon Co., Ltd., trade name BR-1) with a blending ratio shown in Table 3 was used.
Electrophotographic photoreceptors were produced in the same manner as in Examples 1 to 6 above, except that 05) was used.
上記各実施例並びに比較例で作製した電子写真感光体に
ついて、下記の各試験を行った。The following tests were conducted on the electrophotographic photoreceptors produced in the above Examples and Comparative Examples.
表面電位測定
上記各電子写真感光体を、静電複写試験装置(ジエンチ
ック社製、ジエンチックシン9730M型機)に装填し
、その表面を正に帯電させて、表面電位V+S、p、(
■)を測定した。Measurement of surface potential Each of the electrophotographic photoreceptors described above was loaded into an electrostatic copying tester (manufactured by Zientic Co., Ltd., Model 9730M machine), and its surface was positively charged to determine the surface potential V+S, p, (
■) was measured.
上記帯電状態の各電子写真感光体を、上記静電複写試験
装置の露光光源であるノ10ゲンランブを用いて、露光
強度0 、92 m W/ c4、露光時間60m秒の
条件で露光し、前記表面電位V1s、p。Each electrophotographic photoreceptor in the above-mentioned charged state was exposed to light using a No. 10 Gen lamp, which is the exposure light source of the above-mentioned electrostatic copying tester, at an exposure intensity of 0, 92 mW/c4, and an exposure time of 60 msec. Surface potential V1s, p.
が1/2になるのに要する時間を求め、半減露光ff1
E l/2 (Iux−8ee )を算出した。Find the time required for the value to become 1/2, and calculate the half-reduction exposure ff1
E 1/2 (Iux-8ee) was calculated.
また、上記露光開始時から0.4秒経過後の表面電位を
、残留電位Vr、p、(V)として測定した。Further, the surface potential 0.4 seconds after the start of the exposure was measured as the residual potential Vr,p (V).
耐摩耗試験
各電子写真感光体をドラム研磨試験機(三田工業社製)
に装填すると共に、このドラム研磨試験機に設けられた
、感光体が1000回転する間に1回転する研磨試験紙
装着リングに研磨試験紙(住良スリーエム社製、商品名
インペリアルラッピングフィルム、粒径12μmの酸化
アルミニウム粉末を表面に付着させたもの)を装填し、
この研磨試験紙を感光体表面に線圧10 g / mm
て押圧しながら、感光体を100回回転させた時の摩耗
量(μm)を測定した。Abrasion resistance test Each electrophotographic photoreceptor was subjected to a drum polishing tester (manufactured by Sanda Kogyo Co., Ltd.)
At the same time, an abrasive test paper (manufactured by Sumira 3M Co., Ltd., trade name Imperial Wrapping Film, particle size 12 μm aluminum oxide powder attached to the surface) was loaded,
Apply this abrasive test paper to the surface of the photoreceptor at a linear pressure of 10 g/mm.
The amount of wear (μm) when the photoreceptor was rotated 100 times while being pressed was measured.
外観 表面保護層の外観を目視により観察した。exterior The appearance of the surface protective layer was visually observed.
以上の結果を表1〜3に示す。なお、表1〜3、並びに
、後述する表4における*1〜*5は下記の通り。The above results are shown in Tables 1 to 3. Note that *1 to *5 in Tables 1 to 3 and Table 4 described later are as follows.
*I BEMH :メチルーブチル混合エーテル化メ ラミン・ホルムアルデヒド樹脂 メチルエーテル化メラミン・ホルム アルデヒド樹脂 ブチルエーテル化メラミン噛ホルム アルデヒド樹脂 MEM!(: BEMH: * 2 PVB :ポリビニルブチラール PVAc:ポリ酢酸ビニル ACニアクリル系重合体 *3 クラック発生のため測定できなかった。*I BEMH : Methyl-butyl mixed etherification method Lamin formaldehyde resin Methyl etherified melamine form aldehyde resin Butyl etherified melamine foam aldehyde resin MEM! (: BEMH: *2 PVB: Polyvinyl butyral PVAc: Polyvinyl acetate AC Niacrylic polymer *3 Unable to measure due to cracks.
*4 白濁発生のため測定できなかった。*4 Unable to measure due to cloudiness.
(以下余白)
上記表1〜3の結果より、熱可塑性樹脂としてポリビニ
ルブチラール、ポリ酢酸ビニルおよびアクリル系重合体
を用いた3つの併用系の何れにおいても、熱硬化性シリ
コーン樹脂の非揮発性固形分100重量部に対する、特
定エーテル化メラミン・ホルムアルデヒド樹脂の含有量
が25〜]00重量部の範囲内で、且つ、熱可塑性樹脂
の含有割合が、シリコーン樹脂の非揮発性固形分と特定
エーテル化メラミン・ホルムアルデヒド樹脂との合計量
の10〜20重量%の範囲内である場合にのみ、感光特
性、物性等に優れ、且つ摺動摩擦に対する脆さ等が改善
されており、しかも、より導電性に優れた表面保護層を
有する電子写真感光体を製造し得ることが判明した。(Left below) From the results in Tables 1 to 3 above, it is clear that in any of the three combination systems using polyvinyl butyral, polyvinyl acetate, and acrylic polymer as the thermoplastic resin, the non-volatile solid state of the thermosetting silicone resin The content of the specified etherified melamine/formaldehyde resin is within the range of 25 to 100 parts by weight, and the content ratio of the thermoplastic resin is equal to the non-volatile solid content of the silicone resin and the specified etherified resin. Only when the amount is within the range of 10 to 20% by weight of the total amount of melamine/formaldehyde resin, it has excellent photosensitivity, physical properties, etc., has improved brittleness against sliding friction, and has better conductivity. It has been found that an electrophotographic photoreceptor having an excellent surface protective layer can be produced.
また、各県を比較すると、熱可塑性樹脂としてポリ酢酸
ビニルを用いた系は、他の系に比べて耐摩耗性に優れ、
アクリル系重合体を用いた系は、他の系に比べて半減露
光量、残留電位が小さい等、感光特性に優れていること
が判明した。Also, when comparing each prefecture, systems using polyvinyl acetate as thermoplastic resin have superior wear resistance compared to other systems.
It has been found that the system using an acrylic polymer has excellent photosensitive characteristics such as a half-decreased exposure amount and a small residual potential compared to other systems.
実施例29、比較例49
実施例1〜6で作製したシラン加水分解物溶液に、同溶
液中の非揮発性固形分に対して50重量部のエーテル化
メラミン・ホルムアルデヒド樹脂と、上記熱硬化性シリ
コーン樹脂の非揮発性固形分およびエーテル化メラミン
・ホルムアルデヒド樹脂の合計量に対して9.09重量
%のアクリル系重合体(三菱レイヨン社製、商品名BR
−105)とを配合して表面保護層用の塗布液を調製し
、あとは、上記実施例1〜6と同様にして、電子写真感
光体を作製した。Example 29, Comparative Example 49 The silane hydrolyzate solution prepared in Examples 1 to 6 was added with 50 parts by weight of etherified melamine/formaldehyde resin based on the non-volatile solid content in the solution, and the above thermosetting resin. 9.09% by weight of acrylic polymer (manufactured by Mitsubishi Rayon Co., Ltd., product name: BR
-105) to prepare a coating solution for a surface protective layer, and then electrophotographic photoreceptors were produced in the same manner as in Examples 1 to 6 above.
上記実施例および比較例の電子写真感光体について、前
述した表面電位測定、半減露光量測定、並びに外観の観
察の各試験と、以下に示す、繰返し露光後の表面電位変
化71111定を行った。The electrophotographic photoreceptors of the above examples and comparative examples were subjected to the above-described surface potential measurement, half-decrease exposure measurement, and appearance observation tests, as well as the following surface potential change after repeated exposure.
繰返し露光後の表面電位変化測定 上記各電子写真感光体を複写機(三田工業社製。Measurement of surface potential change after repeated exposure Each of the above electrophotographic photoreceptors was used in a copying machine (manufactured by Sanda Kogyo Co., Ltd.).
oc−t t を型機)に装填して500枚の複写処理
を行った後、表面電位を、繰返し露光後の表面電位V、
s、p、 (V)として測定した。After loading oc-t t into a molding machine and copying 500 sheets, the surface potential was determined to be the surface potential after repeated exposure V,
It was measured as s, p, (V).
また、前記表面電位測定値V、S、p、値と、繰返し露
光後の表面電位測定値V2SJ、値とから、下記式(1
)により、表面電位変化値−ΔV <V)を算出した。Further, from the surface potential measurement values V, S, p, and the surface potential measurement value V2SJ after repeated exposure, the following formula (1
), the surface potential change value -ΔV<V) was calculated.
一ΔV (V) −
V2 s、p、(V) V+ 5−p−(V)・・・
(1)以上の結果を表4に示す。 (以下余白)上
記衣4の結果より、特定エーテル化メラミン・ホルムア
ルデヒド樹脂に含まれない、ブチルエーテル化メラミン
・ホルムアルデヒド樹脂を使用した系では、繰返し露光
によって感光特性が著しく悪化することが判明した。- ΔV (V) − V2 s, p, (V) V+ 5−p−(V)...
(1) The above results are shown in Table 4. (Hereinafter, blank space) From the results of Cloth 4 above, it was found that in systems using butyl etherified melamine/formaldehyde resins, which are not included in the specified etherified melamine/formaldehyde resins, the photosensitivity characteristics deteriorate significantly with repeated exposure.
〈発明の効果〉
この発明の電子写真感光体は以上のように構成されてい
るため、電子写真感光体の感光特性、物性等に悪影響を
与えることなく、且つ熱硬化性シリコーン樹脂単独の場
合に比べて摺動摩擦に対する脆さ等が改善されており、
しかも、より導電性に優れた表面保護層を有するものと
なる。<Effects of the Invention> Since the electrophotographic photoreceptor of the present invention is constructed as described above, it does not adversely affect the photosensitivity characteristics, physical properties, etc. of the electrophotographic photoreceptor, and when the thermosetting silicone resin is used alone, Compared to this, the brittleness against sliding friction has been improved,
Moreover, it has a surface protective layer with even better conductivity.
また、熱可塑性樹脂としてポリ酢酸ビニルを用いた場合
には、ポリ酢酸ビニルの持つ柔軟性により、表面保護層
の脆さが改善されて、機械的強度が向上し、長寿命化が
可能になる。In addition, when polyvinyl acetate is used as the thermoplastic resin, the flexibility of polyvinyl acetate improves the brittleness of the surface protective layer, improves mechanical strength, and extends the service life. .
一方、熱可塑性樹脂としてポリメチルメタクリレート(
PMMA)等のアクリル系重合体を用いた場合には、上
記アクリル系重合体の持つ高い光学特性に基づいて、よ
り一層の高感度化が可能になる。On the other hand, polymethyl methacrylate (
When an acrylic polymer such as PMMA) is used, even higher sensitivity can be achieved based on the high optical properties of the acrylic polymer.
Claims (1)
ン樹脂の非揮発性固形分100重量部に対して25〜1
00重量部のメチルエーテル化メラミン・ホルムアルデ
ヒド樹脂および/またはメチル−ブチル混合エーテル化
メラミン・ホルムアルデヒド樹脂と、上記熱硬化性シリ
コーン樹脂の非揮発性固形分およびエーテル化メラミン
・ホルムアルデヒド樹脂の合計量に対して10〜20重
量%の熱可塑性樹脂とを含有し、且つ導電性付与剤を含
有しない塗布液を感光層上に塗布し、 硬化させてなる表面保護層を有することを特徴とする電
子写真感光体。 2、熱可塑性樹脂がポリ酢酸ビニルである請求項1記載
の電子写真感光体。 3、熱硬化性シリコーン樹脂と、この熱硬化性シリコー
ン樹脂の非揮発性固形分100重量部に対して25〜1
00重量部のメチルエーテル化メラミン・ホルムアルデ
ヒド樹脂および/またはメチル−ブチル混合エーテル化
メラミン・ホルムアルデヒド樹脂と、上記熱硬化性シリ
コーン樹脂の非揮発性固形分およびエーテル化メラミン
・ホルムアルデヒド樹脂の合計量に対して10〜20重
量%のアクリル系重合体とを含有し、且つ導電性付与剤
を含有しない塗布液を感光層上に塗布し、硬化させてな
る表面保護層を有することを特徴とする電子写真感光体
。[Claims] 1. Thermosetting silicone resin and 25 to 1 part by weight per 100 parts by weight of non-volatile solid content of the thermosetting silicone resin.
00 parts by weight of methyl etherified melamine/formaldehyde resin and/or methyl-butyl mixed etherified melamine/formaldehyde resin, based on the total amount of the non-volatile solid content of the thermosetting silicone resin and etherified melamine/formaldehyde resin. an electrophotographic photosensitive layer comprising: a surface protective layer formed by applying a coating liquid containing 10 to 20% by weight of a thermoplastic resin and not containing a conductivity imparting agent onto the photosensitive layer and curing the coating liquid; body. 2. The electrophotographic photoreceptor according to claim 1, wherein the thermoplastic resin is polyvinyl acetate. 3. Thermosetting silicone resin and 25 to 1 part by weight per 100 parts by weight of non-volatile solid content of this thermosetting silicone resin.
00 parts by weight of methyl etherified melamine/formaldehyde resin and/or methyl-butyl mixed etherified melamine/formaldehyde resin, based on the total amount of the non-volatile solid content of the thermosetting silicone resin and etherified melamine/formaldehyde resin. Electrophotography, characterized in that it has a surface protective layer formed by applying a coating liquid containing 10 to 20% by weight of an acrylic polymer and not containing a conductivity imparting agent onto a photosensitive layer and curing the coating liquid. Photoreceptor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27441689A JPH03135576A (en) | 1989-10-20 | 1989-10-20 | Electrophotographic sensitive body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27441689A JPH03135576A (en) | 1989-10-20 | 1989-10-20 | Electrophotographic sensitive body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03135576A true JPH03135576A (en) | 1991-06-10 |
Family
ID=17541370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27441689A Pending JPH03135576A (en) | 1989-10-20 | 1989-10-20 | Electrophotographic sensitive body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03135576A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5733698A (en) * | 1996-09-30 | 1998-03-31 | Minnesota Mining And Manufacturing Company | Release layer for photoreceptors |
-
1989
- 1989-10-20 JP JP27441689A patent/JPH03135576A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5733698A (en) * | 1996-09-30 | 1998-03-31 | Minnesota Mining And Manufacturing Company | Release layer for photoreceptors |
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