JPH03129728U - - Google Patents
Info
- Publication number
- JPH03129728U JPH03129728U JP3848890U JP3848890U JPH03129728U JP H03129728 U JPH03129728 U JP H03129728U JP 3848890 U JP3848890 U JP 3848890U JP 3848890 U JP3848890 U JP 3848890U JP H03129728 U JPH03129728 U JP H03129728U
- Authority
- JP
- Japan
- Prior art keywords
- piston
- cavity
- view
- head
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
Landscapes
- Combustion Methods Of Internal-Combustion Engines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848890U JPH03129728U (zh) | 1990-04-12 | 1990-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848890U JPH03129728U (zh) | 1990-04-12 | 1990-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03129728U true JPH03129728U (zh) | 1991-12-26 |
Family
ID=31546538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3848890U Pending JPH03129728U (zh) | 1990-04-12 | 1990-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03129728U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10475743B2 (en) | 2016-03-15 | 2019-11-12 | Infineon Technologies Ag | Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device |
-
1990
- 1990-04-12 JP JP3848890U patent/JPH03129728U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10475743B2 (en) | 2016-03-15 | 2019-11-12 | Infineon Technologies Ag | Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device |
| US10777506B2 (en) | 2016-03-15 | 2020-09-15 | Infineon Technologies Ag | Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device |