JPH03128966U - - Google Patents

Info

Publication number

JPH03128966U

JPH03128966U JP3832990U JP3832990U JPH03128966U JP H03128966 U JPH03128966 U JP H03128966U JP 3832990 U JP3832990 U JP 3832990U JP 3832990 U JP3832990 U JP 3832990U JP H03128966 U JPH03128966 U JP H03128966U

Authority

JP

Japan

Prior art keywords

electrode portions

conductor pad

recess

insulating substrate

circuit board

Prior art date

1990-04-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 6
• 239000000758 substrate Substances 0.000 claims description 3
• 230000002093 peripheral effect Effects 0.000 claims 2
• 238000005476 soldering Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1