JPH03128938U - - Google Patents
Info
- Publication number
- JPH03128938U JPH03128938U JP1990038157U JP3815790U JPH03128938U JP H03128938 U JPH03128938 U JP H03128938U JP 1990038157 U JP1990038157 U JP 1990038157U JP 3815790 U JP3815790 U JP 3815790U JP H03128938 U JPH03128938 U JP H03128938U
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminals
- electrode terminal
- electrode
- protrusion
- bonding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990038157U JPH03128938U (es) | 1990-04-10 | 1990-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990038157U JPH03128938U (es) | 1990-04-10 | 1990-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03128938U true JPH03128938U (es) | 1991-12-25 |
Family
ID=31545911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990038157U Pending JPH03128938U (es) | 1990-04-10 | 1990-04-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03128938U (es) |
-
1990
- 1990-04-10 JP JP1990038157U patent/JPH03128938U/ja active Pending