JPH03126068U - - Google Patents
Info
- Publication number
- JPH03126068U JPH03126068U JP3464390U JP3464390U JPH03126068U JP H03126068 U JPH03126068 U JP H03126068U JP 3464390 U JP3464390 U JP 3464390U JP 3464390 U JP3464390 U JP 3464390U JP H03126068 U JPH03126068 U JP H03126068U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- laser chip
- submount
- surround
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3464390U JP2501588Y2 (ja) | 1990-03-30 | 1990-03-30 | 半導体レ―ザ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3464390U JP2501588Y2 (ja) | 1990-03-30 | 1990-03-30 | 半導体レ―ザ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126068U true JPH03126068U (pt) | 1991-12-19 |
| JP2501588Y2 JP2501588Y2 (ja) | 1996-06-19 |
Family
ID=31539300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3464390U Expired - Lifetime JP2501588Y2 (ja) | 1990-03-30 | 1990-03-30 | 半導体レ―ザ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501588Y2 (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012001931A1 (ja) * | 2010-06-28 | 2012-01-05 | Ｊｆｅ鋼板株式会社 | 嵌合式折板屋根材 |
-
1990
- 1990-03-30 JP JP3464390U patent/JP2501588Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012001931A1 (ja) * | 2010-06-28 | 2012-01-05 | Ｊｆｅ鋼板株式会社 | 嵌合式折板屋根材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501588Y2 (ja) | 1996-06-19 |