JPH03123048A - Probe contact - Google Patents
Probe contactInfo
- Publication number
- JPH03123048A JPH03123048A JP26047789A JP26047789A JPH03123048A JP H03123048 A JPH03123048 A JP H03123048A JP 26047789 A JP26047789 A JP 26047789A JP 26047789 A JP26047789 A JP 26047789A JP H03123048 A JPH03123048 A JP H03123048A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- ball
- probe
- recess
- probe contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 206010041662 Splinter Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置の特性を測定する装置のテストボ
ードから信号伝達を行うブローフコ〉′タクトに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tact system for transmitting signals from a test board of an apparatus for measuring characteristics of semiconductor devices.
第２図は従来の一例を示すプローブコンタクトの断面図
である。従来、この種のプローブコンタク１〜は、第２
図に示すように、ボード４に埋め込まれたブツシュにス
プリング５を介して挿入されている。また、このプロー
ブコンタクトはプローブ本体７と接触部６とから構成さ
れ、この接触部６がテストボード１の接触バッド２に接
触し信号伝達を行っている。さらに、その接触部６は尖
っており、接触バッド２との押圧力は、スプリンタ５の
ばね定数及び縮み代で決定される。FIG. 2 is a sectional view of a conventional probe contact. Conventionally, this type of probe contacts 1 to 2
As shown in the figure, it is inserted into a bush embedded in a board 4 via a spring 5. Further, this probe contact is composed of a probe body 7 and a contact portion 6, and this contact portion 6 contacts the contact pad 2 of the test board 1 to transmit signals. Furthermore, the contact portion 6 is sharp, and the pressing force against the contact pad 2 is determined by the spring constant and shrinkage margin of the splinter 5.
上述した従来のプローブコンタク１へは、その先端であ
る接触部が尖っているため、デス１〜ボードを抑える方
向に対し、強度的には問題ないが、上下動の運動に伴い
横方向の負荷が生し、この負荷のため、しばしば折損が
発生ずる欠点がある。また、その接触部が固定されてお
り、さらに点接触であるため、接触部が磨耗するという
欠点かある。The conventional probe contact 1 mentioned above has a sharp contact portion at the tip, so there is no problem in terms of strength in the direction of holding down the board 1, but it is subject to lateral loads due to vertical movement. There is a disadvantage that breakage often occurs due to this load. Further, since the contact portion is fixed and is a point contact, there is a drawback that the contact portion is subject to wear.
本発明の目的は、かかる欠点を解消し、接触部の磨耗の
少い、かつ接触部が折損しないプローブコンタク１〜を
提供することである。SUMMARY OF THE INVENTION An object of the present invention is to eliminate such drawbacks and to provide a probe contactor 1 to which the contact portion is less abraded and the contact portion does not break.
本発明のプローブコンタク）へは、棒状のプローブ本体
と、このプローブ本体の一端に形成された球状の窪みに
はめ込まれる球とを有している。The probe contactor of the present invention has a rod-shaped probe body and a ball that is fitted into a spherical recess formed at one end of the probe body.
［実施例〕 次に、本発明について図面を参照して説明する。[Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示すプローブコンタク１〜
の断面図である。このプローブコンタクトは、図に示す
ように、棒状のプローブ本体７と、このプローブ本体７
の先端に形成された球状の窪み７ａにはめ込まれる球３
を設けたことである。FIG. 1 shows probe contacts 1 to 1 showing an embodiment of the present invention.
FIG. As shown in the figure, this probe contact includes a rod-shaped probe body 7 and a rod-shaped probe body 7.
A ball 3 fitted into a spherical depression 7a formed at the tip of the
This is because we have established the following.
それ以外は従来と同じである。Other than that, it is the same as before.
このような構造にずれば、例えは、ボード４か矢印８ａ
の方向で上下し、プローブコンタクトぴ）接触部６ａが
テストボード１の接触ノく・ント２に接触をくり返した
とき、このときに生ずる矢印９の方向でテストボード１
が動かされても、球３は窪み７ａ内を自転し、接触部６
ａは常に変化する。If you shift to this kind of structure, for example, board 4 or arrow 8a
When the contact part 6a repeatedly contacts the contact part 2 of the test board 1, the test board 1 moves up and down in the direction of the arrow 9 that occurs at this time.
Even if the ball 3 is moved, the ball 3 rotates within the depression 7a and the contact portion 6
a always changes.
このことは、接触部は常に一定でないので、接触部の磨
耗は避けることが出来る。また、矢印９の方向の負荷が
接触部６ａを介して、球３に加わつても、球３は回転す
るため、球３自体に曲は応力が生じない。従って、従来
のように接触部自体の折損が生じることはない。This means that the contact area is not always constant, so that wear of the contact area can be avoided. Furthermore, even if a load in the direction of the arrow 9 is applied to the ball 3 via the contact portion 6a, the ball 3 rotates, so no bending stress is generated in the ball 3 itself. Therefore, the contact portion itself does not break as in the conventional case.
なお、このプローブコンタクトの製作については、例え
ば、銅の丸棒の一端を切削加工により球状の窪みを形成
し、この窪みに、良導体材料の球をはめ込み、窪みの周
囲をコーキングして、球が抜けないようにする。このよ
うにすれば、従来の尖った接触部をもつプローブコンタ
クトのように定期的にその先端を研磨する工数も不要に
なり、運用コストは、かえって安価なものとなる。To make this probe contact, for example, one end of a copper round rod is cut to form a spherical depression, a ball made of a good conductive material is fitted into the depression, and the area around the depression is caulked to form a spherical depression. Make sure it doesn't fall out. This eliminates the need for periodic polishing of the tip of the probe contact, which is required for conventional probe contacts with sharp contact portions, and the operating cost is reduced.
以上説明したように、本発明は、テストボードの接触パ
ッドにコンタクトするプローブコンタクトの先端に自在
回転可能の球を設けることによって、接触部に加わる横
方向の負荷が加わっても、負荷を逃すことも出来、また
接触点が常に変化することも出来るので、接触部が折損
することなく、かつ磨耗のないプローブコンタクトが得
られるという効果かある。As explained above, the present invention provides a freely rotatable ball at the tip of the probe contact that contacts the contact pad of the test board, thereby making it possible to release the load even if a lateral load is applied to the contact part. Moreover, since the contact point can be constantly changed, there is an effect that the contact portion does not break and a wear-free probe contact can be obtained.
第１図は本発明の一実施例の示すプローブコンタクトの
断面図、第２図は従来の一例を示すプローブコンタクト
の断面図である。
１・・・テストボード、２・・・接触パッド、３・・・
球、４・・・ボード、５・・・スプリング、６，６ａ・
・・接触部、７・・・プローブ本体、７ａ・・・窪み、
８．９・・・矢印。FIG. 1 is a cross-sectional view of a probe contact according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a probe contact according to a conventional example. 1...Test board, 2...Contact pad, 3...
Ball, 4... Board, 5... Spring, 6, 6a.
...Contact part, 7...Probe body, 7a...Recess,
8.9...Arrow.
Claims (1)
された球状の窪みにはめ込まれる球とを有することを特
徴とするプローブコンタクト。A probe contact characterized by having a rod-shaped probe body and a ball fitted into a spherical recess formed at one end of the probe body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26047789A JPH03123048A (en) | 1989-10-04 | 1989-10-04 | Probe contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26047789A JPH03123048A (en) | 1989-10-04 | 1989-10-04 | Probe contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03123048A true JPH03123048A (en) | 1991-05-24 |
Family
ID=17348496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26047789A Pending JPH03123048A (en) | 1989-10-04 | 1989-10-04 | Probe contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03123048A (en) |
-
1989
- 1989-10-04 JP JP26047789A patent/JPH03123048A/en active Pending
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