JPH03122572U - - Google Patents

Info

Publication number

JPH03122572U

JPH03122572U JP3206790U JP3206790U JPH03122572U JP H03122572 U JPH03122572 U JP H03122572U JP 3206790 U JP3206790 U JP 3206790U JP 3206790 U JP3206790 U JP 3206790U JP H03122572 U JPH03122572 U JP H03122572U

Authority

JP

Japan

Prior art keywords

circuit board

conductive layer

multilayer printed

printed circuit

insulating layer

Prior art date

1990-03-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 239000011889 copper foil Substances 0.000 claims description 2
• 239000000463 material Substances 0.000 claims description 2
• 238000010030 laminating Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 3
• 238000005476 soldering Methods 0.000 description 1

Cited By (1)