JPH03121861A - Manufacture of radiating plate - Google Patents
Manufacture of radiating plateInfo
- Publication number
- JPH03121861A JPH03121861A JP25939489A JP25939489A JPH03121861A JP H03121861 A JPH03121861 A JP H03121861A JP 25939489 A JP25939489 A JP 25939489A JP 25939489 A JP25939489 A JP 25939489A JP H03121861 A JPH03121861 A JP H03121861A
- Authority
- JP
- Japan
- Prior art keywords
- radiating plate
- heat sink
- alloys
- barrel
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000004512 die casting Methods 0.000 claims abstract description 8
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000009825 accumulation Methods 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000004576 sand Substances 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000003754 machining Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000011805 ball Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は熱転写用サーマルヘッドの放熱板の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a heat sink for a thermal head for thermal transfer.
[従来の技術]
従来の放熱板製造方法として、金属・合金をダイカスト
にて放熱板形状に成形したものを、サンドブラストやフ
ライス加工でパリ取り、及び表面処理を行う方法、金属
・合金塊を直接切削加工する方法があった。[Conventional technology] Conventional methods for manufacturing heat sinks include die-casting a metal or alloy into a heat sink shape, deburring it by sandblasting or milling, and subjecting it to surface treatment; There was a way to cut it.
[発明が解決しようとする課題]
しかし、従来の金属・合金をダイカストにて放熱板形状
に成形したものをフライス加工する方法と、金属・合金
塊を直接切削加工する方法は、放熱板表面が滑らかにな
って、ヘッドの放熱効果は得られるものの、生産コスト
が高いという欠点があった。[Problem to be solved by the invention] However, the conventional method of milling a metal/alloy formed into a heat sink shape by die-casting and the method of directly cutting a metal/alloy ingot, Although it is smoother and provides a heat dissipation effect for the head, it has the drawback of high production costs.
また、サンドブラストを用いる方法は、放熱板表面が粗
になり、ヘッドの放熱効果が得られず、従って、ヘッド
の畜熱による印字品質の劣化が生じるという欠点があっ
た。Furthermore, the method using sandblasting has the drawback that the surface of the heat sink becomes rough, making it impossible to achieve a heat dissipation effect from the head, resulting in deterioration of print quality due to heat accumulation in the head.
そこで、本発明は従来のこのような課題点を解決するも
のであって、生産コストが低く、放熱板表面の粗さが低
く、さらにヘッドの畜熱による印字品質の劣化のない放
熱板の製造方法を得ることを目的とする。Therefore, the present invention solves these conventional problems, and aims to manufacture a heat sink with low production cost, low surface roughness of the heat sink, and no deterioration in printing quality due to heat accumulation in the head. The purpose is to obtain a method.
[課題を解決するための手段]
本発明は熱転写用サーマルヘッドの放熱板の製造方法に
おいて、金属・合金をダイカストにより放熱板形状に成
形する工程と、前記成形品にバレル研摩を施す工程から
なることを特徴とする。[Means for Solving the Problems] The present invention provides a method for manufacturing a heat sink for a thermal head for thermal transfer, which comprises a step of forming a metal/alloy into a heat sink shape by die-casting, and a step of subjecting the molded product to barrel polishing. It is characterized by
[作用1
上記の製造方法を用いれば、放熱板1個当りの製造コス
ト、生産効率が大幅に改善され、その上放熱板のサーマ
ルヘッドの発熱体直下の表面の面粗さを下げることがで
きる。[Effect 1] By using the above manufacturing method, the manufacturing cost and production efficiency per heat sink can be greatly improved, and in addition, the surface roughness of the heat sink directly under the heating element of the thermal head can be reduced. .
[実施例] 以下に実施例に基づいて本発明を詳述する。[Example] The present invention will be explained in detail below based on Examples.
本発明の放熱板の製造方法は、以下の手順による。The method for manufacturing a heat sink of the present invention is based on the following procedure.
■、放熱板の金型を作製する。■Make a mold for the heat sink.
Il、 放熱板を■、の金型でダイカスト成形する。Il, Die-cast the heat sink using the mold shown in ■.
Hl 、 II 、 で成形した放熱板にバレル研
摩を施す。Barrel polishing is applied to the heat sink formed by Hl, II, and.
バレル研摩の方法は、周知の遠心バレルあるいは振動型
バレル等を用いる。また、メディアとしてはスチールボ
ール、石、砂等を用いることが可能である。コンパウン
ドとしてはGPP、GLClGPB等を用いることが可
能である。また、放熱板材料としては熱伝導率が良好か
つ、加工付が良好な、金属・合金が用いられる。特に望
ましいのは、アルミニウム及びその合金、銅及びその合
金等である。The barrel polishing method uses a well-known centrifugal barrel, vibrating barrel, or the like. Further, as the media, steel balls, stones, sand, etc. can be used. As the compound, GPP, GLClGPB, etc. can be used. Furthermore, as the material for the heat sink, metals and alloys that have good thermal conductivity and can be easily processed are used. Particularly desirable are aluminum and its alloys, copper and its alloys, and the like.
以下に、本発明をさらに詳細に説明する。The present invention will be explained in more detail below.
・実施例1
シリアルタイプの熱転写用サーマルヘッドの放熱板とし
て、アルミニウムを用いダイカスト成形した後に、80
リツトルの漕を持つ遠心バレル機を用い、回転数200
rpm、メディアはφ6×10mm の石、コンパウン
ドはGPPを用いて放熱板を作製した。この時、加工時
間と被加工品の表面粗さの関係を調べた。その結果を第
1図に示す。図中横軸は加工時間を表し、縦軸は表面粗
さを表す。尚、表面粗さの定義はJIS B 06
01に基づく。・Example 1 After die-casting aluminum as a heat dissipation plate for a serial type thermal transfer thermal head, 80
Using a centrifugal barrel machine with a little row, the number of revolutions is 200.
rpm, a stone with a diameter of 6 x 10 mm as the media, and GPP as the compound to prepare a heat sink. At this time, the relationship between machining time and surface roughness of the workpiece was investigated. The results are shown in FIG. In the figure, the horizontal axis represents machining time, and the vertical axis represents surface roughness. The definition of surface roughness is JIS B 06.
Based on 01.
また、表面粗さとヘッドの蓄熱についても調べた。測定
方法はべた黒印字をA4サイズの紙に5行行い、その前
後での、サーマルヘッド表面の温度差を赤外線カメラで
測定した。その結果を第2図に示す。図中横軸は表面粗
さを表し、縦軸は温度差を表す。We also investigated surface roughness and heat accumulation in the head. The measurement method was to print 5 lines of solid black on A4 size paper, and measure the temperature difference on the surface of the thermal head before and after printing with an infrared camera. The results are shown in FIG. In the figure, the horizontal axis represents surface roughness, and the vertical axis represents temperature difference.
第2図より表面粗さ3.2S以下であれば、放熱板は十
分な放熱効果を持つ事が判る。また、第1図より、表面
粗さ3.2S以下にするには、加工時間は15分で十分
であることが判る。From FIG. 2, it can be seen that the heat sink has a sufficient heat dissipation effect if the surface roughness is 3.2S or less. Further, from FIG. 1, it can be seen that a machining time of 15 minutes is sufficient to achieve a surface roughness of 3.2S or less.
さらに、実施例1と従来の周知の方法で製造された放熱
板とで様々な比較をした。Furthermore, various comparisons were made between Example 1 and a heat sink manufactured by a conventional well-known method.
・比較例1
比較例1として、放熱板の材質としてアルミニウムを用
い1. Il、 の工程を経た後、サンドブラスト
加工を施し作製した。- Comparative Example 1 As Comparative Example 1, aluminum was used as the material of the heat sink.1. After going through the steps I1 and 2, it was produced by sandblasting.
・比較例2
比較例2として、放熱板の材質としてアルミニウムを用
い1. Il、 の工程を経た後、フライス加工を
施し作製した。- Comparative Example 2 As Comparative Example 2, aluminum was used as the material of the heat sink and 1. After going through the steps I1 and 2, it was manufactured by milling.
・比較例3
比較例3として、アルミニウム魂を直接切削加工し作製
した。- Comparative Example 3 As Comparative Example 3, aluminum soul was directly cut and produced.
以上の実施例及び比較例1〜3に対し、下記の■〜■の
評価を行い、その結果を第1表に示す。The above Examples and Comparative Examples 1 to 3 were evaluated as follows (1) to (2), and the results are shown in Table 1.
・0表面粗さ
表面粗さはJIS B 0601に基づき、O:表
面粗さ3.2S以下、X: 表面粗さ3.28をこえる
ものとして第1表中に示した。- 0 surface roughness The surface roughness is shown in Table 1 based on JIS B 0601, with O: surface roughness of 3.2S or less, and X: surface roughness exceeding 3.28.
・■生産性
生産性は実施例1に於て単位時間内に生産される個数を
100とした場合、○: 95以上、×:95未満とし
て第1表中に示した。- Productivity Productivity is shown in Table 1 as ○: 95 or more, ×: less than 95, where the number of products produced within a unit time in Example 1 is 100.
・■放熱性
放熱性はサーマルヘッドを各側の放熱板に取り付け、べ
た黒印字をA4サイズの紙に5行行い、その前後でのサ
ーマルヘッド表面の温度差を赤外線カメラで測定し、○
:温度差が5°C以上10°C未満、×:温度差が10
°C以上として第1表中に示した。・■ Heat dissipation Heat dissipation was determined by attaching a thermal head to the heat dissipation plate on each side, printing 5 lines of solid black on A4 size paper, and measuring the temperature difference on the surface of the thermal head before and after with an infrared camera.
: Temperature difference is 5°C or more and less than 10°C, ×: Temperature difference is 10°C
It is shown in Table 1 as ℃ or higher.
第1表
第1表から実施例1の放熱板は、表面粗さ、生産性、放
熱性のいずれをとっても他の比較例に対し優れているこ
とが判る。From Table 1, it can be seen that the heat sink of Example 1 is superior to other comparative examples in terms of surface roughness, productivity, and heat dissipation.
また、第1表には記載しなかったが、各側の放熱板に装
着されたサーマルヘッドにより、実際の画像形成を行っ
たところ、実施例1の放熱板を持つサーマルヘッドは高
い画像品質を保有していることがいることが確認された
。また、バレル研摩は均質な製品を人里生産できるので
、実施例1の放熱板を持つサーマルヘッドは、比較例2
,3の放熱板に比べ、印字品質等の個体差が小さいこと
が判った。Although not listed in Table 1, when actual image formation was performed using the thermal heads attached to the heat sinks on each side, the thermal head with the heat sinks of Example 1 achieved high image quality. It has been confirmed that some people have it. In addition, since barrel polishing can produce homogeneous products manually, the thermal head with the heat sink of Example 1 is different from that of Comparative Example 2.
It was found that individual differences in printing quality, etc., were smaller than those of heat sinks No. 3 and No. 3.
・実施例2 実施例1とは別の方法で、本発明を実施した。・Example 2 The present invention was carried out in a different manner from Example 1.
詳細は以下の様である。Details are as follows.
シリアルタイプのプリンターの放熱板製造に於て、アル
ミニウムを材料とし、振動型バレルを用い、振動数17
00cycle/min、振幅3゜5 mm、 加工
時間15分、コンパウンドAX−T20、メディアGL
Cで行ったが、はぼ実施例1と同様の優秀性が認められ
た。In manufacturing heat sinks for serial type printers, aluminum is used as the material and a vibrating barrel is used to achieve a vibration frequency of 17.
00cycle/min, amplitude 3゜5mm, processing time 15 minutes, compound AX-T20, media GL
However, the same excellence as in Example 1 was observed.
尚、本発明は本実施例に限定されず放熱板の製造方法に
広く応用できる。Note that the present invention is not limited to this embodiment, but can be widely applied to methods of manufacturing heat sinks.
[発明の効果]
本発明は以上説明したように、金属・合金をダイカスト
により放熱板形状に成形する工程と、前記成形品にバレ
ル研摩を施す工程からなるので、サーマルヘッドからの
伝熱量の大きい、均質な放熱板を低コストで大量に生産
できる。[Effects of the Invention] As explained above, the present invention includes a step of forming a metal/alloy into a heat sink shape by die-casting, and a step of barrel-polishing the molded product, so that a large amount of heat is transferred from the thermal head. , homogeneous heat sinks can be produced in large quantities at low cost.
そのため、この放熱板を用いた熱転写方式の画像形成装
置に於ては、通電パルス幅、ドツトの履歴制御等を簡単
な制御で高品質な画像の提供が可能となる。Therefore, in a thermal transfer type image forming apparatus using this heat dissipation plate, it is possible to provide high quality images by simple control of the energizing pulse width, dot history control, etc.
また、この放熱板を用いた熱転写方式の画像形成装置は
広くプリンター ビデオプリンター ファクシミリ、複
写機へ応用できる。In addition, thermal transfer image forming devices using this heat sink can be widely applied to printers, video printers, facsimile machines, and copying machines.
第1図は、本発明に係わる製造方法に於て作製した放熱
板の加工時間と表面粗さの関係を示す図。
第2図は、本発明に係わる製造方法に於て作製した放熱
板の表面粗さと印字前後での発熱体の温度差の関係を示
す図。
以 上FIG. 1 is a diagram showing the relationship between processing time and surface roughness of a heat sink manufactured by the manufacturing method according to the present invention. FIG. 2 is a diagram showing the relationship between the surface roughness of a heat sink manufactured by the manufacturing method according to the present invention and the temperature difference of the heating element before and after printing. that's all
Claims (1)
造方法に於て、金属・合金をダイカストにより放熱板形
状に成形する工程と、前記成形品にバレル研摩を施す工
程からなることを特徴とする放熱板の製造方法。A method for manufacturing a heat sink provided on the back side of a thermal head for thermal transfer, characterized by comprising a step of molding a metal or alloy into a heat sink shape by die casting, and a step of subjecting the molded product to barrel polishing. Method of manufacturing a heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25939489A JPH03121861A (en) | 1989-10-04 | 1989-10-04 | Manufacture of radiating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25939489A JPH03121861A (en) | 1989-10-04 | 1989-10-04 | Manufacture of radiating plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03121861A true JPH03121861A (en) | 1991-05-23 |
Family
ID=17333526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25939489A Pending JPH03121861A (en) | 1989-10-04 | 1989-10-04 | Manufacture of radiating plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03121861A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100253260B1 (en) * | 1997-04-24 | 2000-04-15 | 곽철우 | Heat dissipating plate for use in semiconductor package and semiconductor package process using the same |
US7871213B2 (en) | 2003-10-20 | 2011-01-18 | Zih Corp. | Ribbon cartridge including substrate cleaning apparatus |
-
1989
- 1989-10-04 JP JP25939489A patent/JPH03121861A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100253260B1 (en) * | 1997-04-24 | 2000-04-15 | 곽철우 | Heat dissipating plate for use in semiconductor package and semiconductor package process using the same |
US7871213B2 (en) | 2003-10-20 | 2011-01-18 | Zih Corp. | Ribbon cartridge including substrate cleaning apparatus |
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