JPH03120788A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH03120788A JPH03120788A JP25767989A JP25767989A JPH03120788A JP H03120788 A JPH03120788 A JP H03120788A JP 25767989 A JP25767989 A JP 25767989A JP 25767989 A JP25767989 A JP 25767989A JP H03120788 A JPH03120788 A JP H03120788A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- rubber
- section
- printed circuit
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は情報処理装置等に使用する印刷回路基板に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board used in information processing devices and the like.
平面デイスプレィパネルと制御用の印刷回路基板の接続
方法としては、パネル電極と基板電極の間に異方性導電
ゴムを介在し、全体をクリップのようなもので止めて加
圧する手段が一般的である。A common method for connecting a flat display panel and a control printed circuit board is to interpose anisotropic conductive rubber between the panel electrode and the board electrode, and then clamp the entire panel with something like a clip and apply pressure. It is.
なお参考文献としては、電子材料（１９８５−９）「フ
ィルムキャリヤ方式によるフラットパネルの実装方法Ｊ
（ＰＰ４９〜５８）、日経マイクロデバイス（１９
８７−６）ｒ液晶ポケットテレビから始まる多端子ＬＳ
Ｉの直付は実装Ｊ （ＰＰ６１〜７４）が挙げられる
。References include Electronic Materials (1985-9) “Flat panel mounting method using film carrier method J”
(PP49-58), Nikkei Microdevice (19
87-6)rMulti-terminal LS starting from LCD pocket TV
For direct attachment of I, mounting J (PP61 to 74) can be mentioned.
上記従来技術は印刷回路基板と異方性導電ゴムの貼り合
わせ方向と、基板電極部とゴムの導電部との位置合わせ
の点について配慮がされておらず、逆方向に貼り合わる
不良の発生及び位置ズレによる接触不良の発生という問
題があった。The above conventional technology does not take into account the bonding direction of the printed circuit board and the anisotropic conductive rubber, and the alignment of the board electrode part and the conductive part of the rubber, resulting in defects in the bonding in the opposite direction. There was also the problem of occurrence of poor contact due to positional deviation.
本発明の目的は印刷回路基板と異方性導電ゴムの貼り台
わせ方向の決定と、基板電極部とゴム導電部との位置合
わせを容易にする手段を提供することにある。An object of the present invention is to provide means for easily determining the mounting direction of a printed circuit board and anisotropic conductive rubber and for aligning the substrate electrode portion and the rubber conductive portion.
上記目的を達成するために、印刷回路基板の電極部を凹
形状もしくは凸形状とし、異方性導電ゴムの導電部を凸
形状もしくは凹形状にし°Ｃ両者を嵌合するようにした
ものである。In order to achieve the above object, the electrode portion of the printed circuit board is made concave or convex, and the conductive portion of the anisotropic conductive rubber is made convex or concave so that the two fit together. .
さらに印刷回路基板の任意位置にガイドを目的とした凹
部もしくは凸部を形成し、異方性導電ゴムの対向位置に
凸部もしくは凹部を設けることにより、貼り合わせの方
向を決定するようにしたものである。Furthermore, a concave or convex portion for the purpose of a guide is formed at an arbitrary position on the printed circuit board, and a convex or concave portion is provided at a position facing the anisotropic conductive rubber, thereby determining the direction of bonding. It is.
凸形状もしくは凹形状に形成した異方性導電ゴムの導電
部を、凹形状もしくは凸形状に形成した印刷回路基板の
電極部に嵌合することによって両者の位置合わせが容易
になるので、接触不良は発生しない。By fitting the conductive part of the anisotropic conductive rubber formed into a convex or concave shape to the electrode part of the printed circuit board, which is formed in a concave or convex shape, it becomes easy to align the two, thereby preventing poor contact. does not occur.
また、印刷回路基板の任意位置に設けたガイド用凹部も
しくは凸部と、これに対向する位置に設けた異方性導電
部の凸部もしくは凹部を嵌合することにより、貼り合せ
の方向が決定するので逆方向に貼り合せる不良がない。In addition, the direction of bonding is determined by fitting the guide recess or convex part provided at an arbitrary position on the printed circuit board with the convex part or recess of the anisotropic conductive part provided at the opposite position. Therefore, there are no defects caused by pasting in the opposite direction.
以下、本発明の一実施例を第１図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
本発明は液晶デイスプレィ等の平面デイスプレィパネル
１と、画素駆動用ＩＣなどの回路部品５を搭載した制御
用印刷回路基板２と、パネル電極部１ａと基板電極部２
ａを電気的に接続する異方性導電ゴム３と、これらを機
械的に圧接挾持する加圧治具４から構成される。異方性
導電ゴム３はパネル電極１ａと基板電極２ａを接続する
部分に金属粒子を偏在させた導電部３ａと絶縁部３ｂか
ら構成され、かつ導電部３ａを凸状に形成したものであ
る。印刷回路基板２は熱可塑性樹脂を材料とし、射出成
形することにより凹部を形成する。The present invention comprises a flat display panel 1 such as a liquid crystal display, a control printed circuit board 2 on which circuit components 5 such as pixel driving ICs are mounted, a panel electrode section 1a and a substrate electrode section 2.
It is composed of an anisotropic conductive rubber 3 that electrically connects a, and a pressing jig 4 that mechanically presses and clamps them. The anisotropic conductive rubber 3 is composed of a conductive part 3a and an insulating part 3b in which metal particles are unevenly distributed at the part connecting the panel electrode 1a and the substrate electrode 2a, and the conductive part 3a is formed in a convex shape. The printed circuit board 2 is made of thermoplastic resin, and the concave portion is formed by injection molding.
回路パターンは予め金型に作成しておき、射出成形時に
基板側に転写することで凹部に電極部２ａを形成する。A circuit pattern is created in advance on a mold, and is transferred to the substrate side during injection molding, thereby forming electrode portions 2a in the recessed portions.
また、印刷回路基板２にはガイドを目的とした凹部２ｂ
を形成し、異方性導電ゴムの対向位置には凸部３Ｃを形
成する。The printed circuit board 2 also has a recess 2b for the purpose of a guide.
, and a convex portion 3C is formed at a position facing the anisotropic conductive rubber.
次に各部の動作を説明する。Next, the operation of each part will be explained.
印刷回路基板２の任意位置に設けたガイド用凹部２ｂに
、異方性導電ゴム３側に設けたガイド用凸部３Ｃを嵌合
させることで貼り合わせの方向を決定する。これと同時
に印刷回路基板２の電極部である凹部２ａと、異方性導
電ゴム３の導電部である凸部３ｃを各々嵌合させる。そ
の後この異方性導電ゴム３の他方面に平面デイスプレィ
パネル１を貼り合わせ、加圧治具４にて全体を圧接挾持
することにより、印刷回路基板２と平面デイスプレィパ
ネル１を電気的に接続する。The direction of bonding is determined by fitting the guide protrusion 3C provided on the anisotropic conductive rubber 3 side into the guide recess 2b provided at an arbitrary position on the printed circuit board 2. At the same time, the concave portions 2a, which are the electrode portions of the printed circuit board 2, and the convex portions 3c, which are the conductive portions of the anisotropic conductive rubber 3, are respectively fitted. Thereafter, the flat display panel 1 is bonded to the other side of the anisotropic conductive rubber 3, and the entire body is pressed and clamped using the pressure jig 4, thereby electrically connecting the printed circuit board 2 and the flat display panel 1. Connecting.
この実施例によれば、印刷回路基板２と異方性導電ゴム
３の貼り合わせ方向を決定出来、さらに基板電極部２ａ
とゴムの導電部３ａとの位置合わせが容易になる。According to this embodiment, it is possible to determine the bonding direction of the printed circuit board 2 and the anisotropic conductive rubber 3, and also to determine the bonding direction of the printed circuit board 2 and the anisotropic conductive rubber 3.
This facilitates positioning between the rubber conductive portion 3a and the rubber conductive portion 3a.
以上の説明は、平面デイスプレィデバイスに関するもの
であったが、本発明は表面実装形の回路部品５と印刷回
路基板２の電極部２ａとの位置合せに対しても応用出来
ることを第２図を用いて説明する。Although the above explanation has been related to a flat display device, it is shown in FIG. Explain using.
第２図において、上述の実施例と同様に印刷回路基板２
の凹部に形成した電極部２ｂに対し、部品接続を目的と
した半田めつき６を施す。この凹部に対して部品のリー
ド５ａをはめ込むことで、搭載時の位置決めを容易にす
る。In FIG. 2, a printed circuit board 2 is shown similar to the above embodiment.
Solder plating 6 is applied to the electrode portion 2b formed in the recessed portion for the purpose of connecting components. By fitting the lead 5a of the component into this recess, positioning during mounting is facilitated.
また、本発明は第３図に示すように２枚の印刷回路基板
の電極部２ａを異方性導電ゴムをコネクタとじて接続す
る場合の位置ズレ防止においても適用出来る。Further, the present invention can also be applied to prevent misalignment when the electrode portions 2a of two printed circuit boards are connected using an anisotropic conductive rubber connector, as shown in FIG.
以上述べたように、本発明によれば、印刷回路基板と異
方性導電ゴムの貼り合せ方向を決定出来、逆方向に貼り
付ける不良を防止する。さらに基板電極部とゴム導電部
の位置合せを容易に行えることから、位置ズレによる接
触不良を防止する。As described above, according to the present invention, the direction in which the printed circuit board and the anisotropic conductive rubber are bonded can be determined, thereby preventing defects caused by bonding in the opposite direction. Furthermore, since the substrate electrode part and the rubber conductive part can be easily aligned, poor contact due to misalignment can be prevented.
また、本発明によれば２枚の印刷回路基板を異方性導電
ゴムをコネクタとして接続する場合においても上述と同
様の効果を得られる。Further, according to the present invention, the same effects as described above can be obtained even when two printed circuit boards are connected using anisotropic conductive rubber as a connector.
また、表面実装形の回路部品を印刷回路基板に搭載する
場合の位置合わせにおいても有効な方法であり、位置ズ
レ防止の効果を得られる。It is also an effective method for positioning surface-mounted circuit components when mounting them on a printed circuit board, and is effective in preventing misalignment.
第１図は本発明の一実施例を示す断面構造図、第２図及
び第３図は本発明の応用例を示す断面構造図である。
１・・・平面デイスプレィパネル、ｌａ・・・電極部、
２・・・制御回路基板、２ａ・・・電極部、２ｂ・・・
ガイド用凹部、３・・・異方性導電ゴム、３ａ・・・導
電部、３ｂ・・・絶縁部、３ｃ・・・ガイド用凸部、４
・・・加圧治具、５・・・回路部品、５ａ・・・部品リ
ード、６・・・半田めっき。FIG. 1 is a cross-sectional structural diagram showing one embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional structural diagrams showing applied examples of the present invention. 1...Flat display panel, la...electrode part,
2... Control circuit board, 2a... Electrode section, 2b...
Recessed part for guide, 3... Anisotropic conductive rubber, 3a... Conductive part, 3b... Insulating part, 3c... Convex part for guide, 4
... Pressure jig, 5... Circuit component, 5a... Component lead, 6... Solder plating.
Claims (1)
板において、基材に凹もしくは凸の部分を設け、該凹部
もしくは該凸部に電極部を設けたことを特徴とする印刷
回路基板。1. 1. A printed circuit board comprising a base material and an electrode part disposed on the base material, characterized in that the base material has a concave or convex part, and the concave part or the convex part is provided with an electrode part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25767989A JPH03120788A (en) | 1989-10-04 | 1989-10-04 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25767989A JPH03120788A (en) | 1989-10-04 | 1989-10-04 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120788A true JPH03120788A (en) | 1991-05-22 |
Family
ID=17309599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25767989A Pending JPH03120788A (en) | 1989-10-04 | 1989-10-04 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120788A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008202361A (en) * | 2007-02-22 | 2008-09-04 | Yoshifuji Kk | Formed article for road screen |
-
1989
- 1989-10-04 JP JP25767989A patent/JPH03120788A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008202361A (en) * | 2007-02-22 | 2008-09-04 | Yoshifuji Kk | Formed article for road screen |
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