JPH03120563U - - Google Patents
Info
- Publication number
- JPH03120563U JPH03120563U JP2610490U JP2610490U JPH03120563U JP H03120563 U JPH03120563 U JP H03120563U JP 2610490 U JP2610490 U JP 2610490U JP 2610490 U JP2610490 U JP 2610490U JP H03120563 U JPH03120563 U JP H03120563U
- Authority
- JP
- Japan
- Prior art keywords
- roll
- current
- carrying
- bodies
- axes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は、本考案の一実施例を示す説明図であ
る。第２図は、従来の装置を示す説明図である。
図において、３は支持ロール、４ａ，４ｂはロ
ール体である。
FIG. 1 is an explanatory diagram showing an embodiment of the present invention. FIG. 2 is an explanatory diagram showing a conventional device. In the figure, 3 is a support roll, and 4a, 4b are roll bodies.
Claims (1)
これらロール体を、それらの軸心と通電ロールの
軸心とを結ぶ線が１８０゜以下の角度をなすよう
、通電ロールに対して配置してなる水平型電気メ
ツキラインにおける通電ロール用支持ロール。 Consists of two roll bodies facing the energized roll,
A support roll for a current-carrying roll in a horizontal electroplating line, in which these roll bodies are arranged with respect to the current-carrying roll so that a line connecting their axes and the axis of the current-carrying roll forms an angle of 180° or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610490U JPH03120563U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610490U JPH03120563U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120563U true JPH03120563U (en) | 1991-12-11 |
Family
ID=31529016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2610490U Pending JPH03120563U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120563U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100376595B1 (en) * | 2000-09-08 | 2003-03-15 | 주식회사 아큐텍반도체기술 | Plating cathode device |
-
1990
- 1990-03-16 JP JP2610490U patent/JPH03120563U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100376595B1 (en) * | 2000-09-08 | 2003-03-15 | 주식회사 아큐텍반도체기술 | Plating cathode device |