JPH03120039U - - Google Patents
Info
- Publication number
- JPH03120039U JPH03120039U JP1990029710U JP2971090U JPH03120039U JP H03120039 U JPH03120039 U JP H03120039U JP 1990029710 U JP1990029710 U JP 1990029710U JP 2971090 U JP2971090 U JP 2971090U JP H03120039 U JPH03120039 U JP H03120039U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor
- accommodating
- top surface
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029710U JPH03120039U (US20100268047A1-20101021-C00003.png) | 1990-03-22 | 1990-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029710U JPH03120039U (US20100268047A1-20101021-C00003.png) | 1990-03-22 | 1990-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120039U true JPH03120039U (US20100268047A1-20101021-C00003.png) | 1991-12-10 |
Family
ID=31532461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990029710U Pending JPH03120039U (US20100268047A1-20101021-C00003.png) | 1990-03-22 | 1990-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120039U (US20100268047A1-20101021-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129726A (ja) * | 2008-11-27 | 2010-06-10 | Kyocera Corp | 電子部品収納用パッケージ、電子装置、および電子装置の製造方法 |
-
1990
- 1990-03-22 JP JP1990029710U patent/JPH03120039U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129726A (ja) * | 2008-11-27 | 2010-06-10 | Kyocera Corp | 電子部品収納用パッケージ、電子装置、および電子装置の製造方法 |
