JPH03117807U - - Google Patents
Info
- Publication number
- JPH03117807U JPH03117807U JP2724590U JP2724590U JPH03117807U JP H03117807 U JPH03117807 U JP H03117807U JP 2724590 U JP2724590 U JP 2724590U JP 2724590 U JP2724590 U JP 2724590U JP H03117807 U JPH03117807 U JP H03117807U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- copper wire
- outer periphery
- insulating layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
Landscapes
- Insulating Of Coils (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2724590U JPH03117807U (de) | 1990-03-19 | 1990-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2724590U JPH03117807U (de) | 1990-03-19 | 1990-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117807U true JPH03117807U (de) | 1991-12-05 |
Family
ID=31530109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2724590U Pending JPH03117807U (de) | 1990-03-19 | 1990-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117807U (de) |
-
1990
- 1990-03-19 JP JP2724590U patent/JPH03117807U/ja active Pending