JPH03117739U - - Google Patents
Info
- Publication number
- JPH03117739U JPH03117739U JP2675890U JP2675890U JPH03117739U JP H03117739 U JPH03117739 U JP H03117739U JP 2675890 U JP2675890 U JP 2675890U JP 2675890 U JP2675890 U JP 2675890U JP H03117739 U JPH03117739 U JP H03117739U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thin film
- insulating film
- board
- thermopile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 description 1
Description
第１図ａは、本考案のサーモパイル型赤外線検
出器の構造を示す平面図であり、第１図ｂはこの
断面図である。
１……基板、２……ヒートシンク、３……薄膜
サーミスタ、４……ピツト部、３１……スルーホ
ール、３５……サーミスタ電極、５……絶縁膜、
６……ダイアフラム、７……熱電対、７０……サ
ーモパイル、７２……冷接点部、７３……温接点
部、７５……サーモパイル引き出し電極、９……
黒体。
FIG. 1a is a plan view showing the structure of the thermopile type infrared detector of the present invention, and FIG. 1b is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Heat sink, 3... Thin film thermistor, 4... Pit part, 31... Through hole, 35... Thermistor electrode, 5... Insulating film,
6... Diaphragm, 7... Thermocouple, 70... Thermopile, 72... Cold junction, 73... Hot junction, 75... Thermopile extraction electrode, 9...
black body.
Claims (1)
においてはヒートシンクとなり、基板の中央部に
設けられたピツト部においてはダイアフラムを構
成しており、ダイアフラムの中央部には赤外線吸
収体としての黒体が被着され、黒体の周囲には、
ダイアフラム上に温接点を有し、ヒートシンク上
に冷接点を有する複数個の熱電対が直列に接続さ
れたサーモパイルが配設され、薄膜サーミスタが
該絶縁膜のヒートシンク部分と基板との間に挾持
され、しかも該薄膜サーミスタの端面が露出して
いない状態で帯状に冷接点部全体を一周し、該薄
膜サーミスタの電極が該絶縁膜に開けられたスル
ーホールから引き出されていることを特徴とする
サーモパイル型赤外線検出器。 The insulating film coated on one side of the board serves as a heat sink at the periphery of the board, and the pit provided at the center of the board forms a diaphragm. The body is coated, and around the black body,
A thermopile in which a plurality of thermocouples having a hot junction on the diaphragm and a cold junction on the heat sink are connected in series is disposed, and a thin film thermistor is sandwiched between the heat sink portion of the insulating film and the substrate. , and a thermopile characterized in that the end face of the thin film thermistor is not exposed and goes around the entire cold contact part in a band shape, and the electrode of the thin film thermistor is drawn out from a through hole made in the insulating film. type infrared detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2675890U JPH03117739U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2675890U JPH03117739U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117739U true JPH03117739U (en) | 1991-12-05 |
Family
ID=31529638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2675890U Pending JPH03117739U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117739U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001102674A (en) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | Board for mounting semiconductor laser element and semiconductor laser module |
| JP2001116621A (en) * | 1999-09-03 | 2001-04-27 | Braun Gmbh | Infrared sensor capable of stabilization of temperature and infrared thermometer having the same type sensor |
| DE10151738B4 (en) * | 2000-10-19 | 2005-02-10 | Murata Manufacturing Co. Ltd. | Thermoelectric conversion component |
| JP2008193700A (en) * | 2007-02-07 | 2008-08-21 | Yungs Group Inc | Necklace-type earphone |
-
1990
- 1990-03-16 JP JP2675890U patent/JPH03117739U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001116621A (en) * | 1999-09-03 | 2001-04-27 | Braun Gmbh | Infrared sensor capable of stabilization of temperature and infrared thermometer having the same type sensor |
| JP4619499B2 (en) * | 1999-09-03 | 2011-01-26 | ブラウン ゲーエムベーハー | Infrared sensor capable of stabilizing temperature and infrared thermometer having this type of sensor |
| JP2001102674A (en) * | 1999-09-30 | 2001-04-13 | Kyocera Corp | Board for mounting semiconductor laser element and semiconductor laser module |
| JP4587503B2 (en) * | 1999-09-30 | 2010-11-24 | 京セラ株式会社 | Semiconductor laser device mounting substrate and semiconductor laser module |
| DE10151738B4 (en) * | 2000-10-19 | 2005-02-10 | Murata Manufacturing Co. Ltd. | Thermoelectric conversion component |
| JP2008193700A (en) * | 2007-02-07 | 2008-08-21 | Yungs Group Inc | Necklace-type earphone |