JPH0311702A - Temperature sensor - Google Patents

Temperature sensor

Info

Publication number
JPH0311702A
JPH0311702A JP14789989A JP14789989A JPH0311702A JP H0311702 A JPH0311702 A JP H0311702A JP 14789989 A JP14789989 A JP 14789989A JP 14789989 A JP14789989 A JP 14789989A JP H0311702 A JPH0311702 A JP H0311702A
Authority
JP
Japan
Prior art keywords
lead
connection
lead wire
temperature sensor
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14789989A
Other languages
Japanese (ja)
Inventor
Hidefumi Sasaki
英文 佐々木
Katsuji Shibuya
渋谷 勝治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14789989A priority Critical patent/JPH0311702A/en
Publication of JPH0311702A publication Critical patent/JPH0311702A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)

Abstract

PURPOSE:To contrive improvement in reliability of connection by a method wherein one end of an element lead and one end of a lead wire are fixed by welding in a superposed form, and a soldering treatment is conducted on the superposed part. CONSTITUTION:One end of the element lead 2a of a thermistor element 1 is superposed on one end of a lead wire 3 provided with a coated part 5 by conducting a coating treatment, and the superposed part is connection-fixed by welding 6. The lead 2a and the lead wire 3 are electrically and mechanically connected by conducting a connecting treatment on the superposed part using soldering 4. As a result, a lead connection having the intrinsic strength of soldering material is obtained, and the reliability of connection can be improved.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、衝撃・振動の環境下で用いられる自動車など
の各種制御に利用される温度センサに関するものである
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a temperature sensor used for various controls of automobiles and the like that are used in shock and vibration environments.

従来の技術 従来、この種の温度センサの素子リードとリード線の接
続構成は、第3図に示すような構成になっていた。
2. Description of the Related Art Conventionally, the connection structure between the element leads and lead wires of this type of temperature sensor has been as shown in FIG.

すなわち、サーミスタ素子1の両端より素子リード2a
 、2bが引出されており、mI記素子IJ−ド2aの
一端とリード線3の一端を重ね合わせ、半田4による接
続処理を施すことにより、素子リード2aとリードa3
を電気的・機械的に接続固定する構成になっていた。第
3図で6はリード線3の被覆部である。
That is, the element leads 2a are connected from both ends of the thermistor element 1.
.
It was designed to be electrically and mechanically connected and fixed. In FIG. 3, 6 is a covering portion of the lead wire 3. In FIG.

発明が解決しようとする課題 このような従来の構成では、下記に示すような問題点が
あった。
Problems to be Solved by the Invention This conventional configuration has the following problems.

すなわち、素子リード2aとリード線3の機械的接続強
度は、半田4の材料強度に依存している。
That is, the mechanical connection strength between the element lead 2a and the lead wire 3 depends on the material strength of the solder 4.

また、素子リード2aとリード線3を重ね合わせ、半田
処理により接続する際に、半田4が溶融状態より冷却し
固着状態に移行する過程で、素子リード2aまたはリー
ド線3の一方あるいはその双方が動いた場合、半田材料
が脆化し、接続強度が著しく劣化することにより、自動
車の温度センサのように衝撃・振動の激しい環境下で使
用された場合、衝撃・振動に起因する応力が脆化した半
田4に集中し、この半田処理部より断線するといった信
頼性上の品質問題が多発している状況である。
Furthermore, when the element lead 2a and the lead wire 3 are overlapped and connected by soldering, one or both of the element lead 2a and the lead wire 3 may If it moves, the solder material becomes brittle and the connection strength deteriorates significantly.If the solder material is used in an environment with strong shocks and vibrations, such as a temperature sensor in an automobile, the stress caused by shocks and vibrations will cause the solder material to become brittle. In this situation, reliability-related quality problems such as wire breakage concentrated in the solder 4 and disconnection from this solder processing section are occurring frequently.

従って、安全性が100%要求される自動車の温度セン
サとしては、この信頼性の向上が強く望まれていた。
Therefore, it has been strongly desired to improve the reliability of temperature sensors for automobiles that require 100% safety.

本発明は、このような問題点を解決するもので、素子リ
ードとリード線の各々の一端を重ね合わせ、半田による
接続処理を施す際に、重ね合わせ部分が動かないように
固定することにより、半田が溶融状態から冷却し固着状
態に移行する過程で、半田材料の本来の接続強度を有す
る構成とした温度センサを提供することを目的とするも
のである。
The present invention solves these problems by overlapping one end of each of the element leads and lead wires and fixing the overlapping parts so that they do not move when performing the solder connection process. It is an object of the present invention to provide a temperature sensor configured to have the original connection strength of the solder material during the process in which the solder cools from a molten state and transitions to a fixed state.

課題を解決するための手段 この問題を解決するために本発明は、素子リードの一端
とリード線の一端が重ね合わせられた形で溶接により固
定され、かつ前記重ね合わせ部に半田処理が施され、前
記素子リードとリード線が接続されている構成としたも
のである。
Means for Solving the Problem In order to solve this problem, the present invention provides a method in which one end of the element lead and one end of the lead wire are fixed by welding in an overlapping manner, and the overlapping portion is soldered. , the element lead and the lead wire are connected to each other.

作用 この構成により、素子リードとリード線の各々の一端が
溶接により固定されているため、重ね合わせ部を半田処
理により接続する際に、半田が溶融状態より冷却し固着
状態に移行する過程で、素子リードまたはリード線の一
方あるいはその双方が動くことがなく、半田材料の本来
の強度を有した接続構成となる。
Effect With this configuration, one end of each element lead and lead wire is fixed by welding, so when the overlapping parts are connected by soldering, the solder cools from a molten state and transitions to a fixed state. One or both of the element leads and lead wires do not move, resulting in a connection structure that has the original strength of the solder material.

実施例 第1図は本発明の一実施例による温度センサにおいてリ
ード接続部を断面にて示す全体構成図、第2図は同セン
サにおいてリード接続部を溶接固定時の状態で示す全体
構成図であり、従来例と同一箇所には同一番号を付して
いる。
Embodiment FIG. 1 is an overall configuration diagram showing a lead connection section in cross section in a temperature sensor according to an embodiment of the present invention, and FIG. 2 is an overall configuration diagram showing the lead connection section of the same sensor in a state in which it is fixed by welding. The same parts as in the conventional example are given the same numbers.

第1図および第2図において、被覆処理を施し被覆部6
を設けたリード線3の一端に、サーミスタ素子1の素子
リード2aの一端を重ね合わせ、その重ね合わせ部を溶
接により接続固定し、かつ重ね合わせ部に半田4による
接続処理を施すことにより、素子リード2aとリード線
3を電気的・機械的に接続した構成としているものであ
る。図において、6は溶接部である。
In FIG. 1 and FIG. 2, the covering portion 6 is
By overlapping one end of the element lead 2a of the thermistor element 1 on one end of the lead wire 3 provided with a The lead 2a and the lead wire 3 are electrically and mechanically connected. In the figure, 6 is a welding part.

また、前記実施例におけるサーミスタ素子1は、その他
の温度変化を検出し特性値が変化するものであれば良い
ものである。
Further, the thermistor element 1 in the embodiment described above may be of any type as long as it detects other temperature changes and its characteristic values change.

発明の効果 以上のように本発明によれば、素子リードとリード線の
各々の一端が重ね合わせられ、溶接により固定された状
態で半田処理が施される構成のために、重ね合わせ部を
半田処理する際に、半田が溶融状態より冷却して固着状
態に移行する過程で。
Effects of the Invention As described above, according to the present invention, one end of the element lead and the lead wire are overlapped and soldered while being fixed by welding. During processing, the process in which solder cools from a molten state to a solid state.

素子リードやリード線の一方またはその双方が動くこと
により半田材料が脆化し、強度が著しく劣化するといっ
たことがなく、半田材料本来の強度を有したリード接続
となり、接続の信頼性が優れたものとなる。
The solder material does not become brittle and its strength deteriorates significantly due to movement of one or both of the element leads and lead wires, and the lead connection retains the original strength of the solder material, resulting in excellent connection reliability. becomes.

従って、安全性が特に要求される自動車の温度センサと
して最適な構成を提供することができる。
Therefore, it is possible to provide an optimal configuration as a temperature sensor for automobiles where safety is particularly required.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例による温度センサにおいてリ
ード接続部を断面にて示す全体構成図、第2図は本発明
の一実施例による温度センサにおいてリード接続部を溶
接固定時の状態で示す全体構成図、第3図は従来例の温
度センサにおいてリード接続部を断面にて示す全体構成
図である。 1・・・・・・サーミスタ素子、2・・・・・・素子リ
ード、3・・・・・・リード線、4・・・・・・半田、
5・・・・・・被覆部、6・・・・・・溶接部。
FIG. 1 is an overall configuration diagram showing a cross-section of the lead connection portion of a temperature sensor according to an embodiment of the present invention, and FIG. 2 is a state in which the lead connection portion is fixed by welding in a temperature sensor according to an embodiment of the present invention. FIG. 3 is an overall configuration diagram showing a lead connection portion in cross section in a conventional temperature sensor. 1... Thermistor element, 2... Element lead, 3... Lead wire, 4... Solder,
5... Covering part, 6... Welding part.

Claims (1)

【特許請求の範囲】[Claims]  サーミスタ素子などの素子より引出された素子リード
の一端とリード線の一端が重ね合わせられた形で溶接に
より固定され、かつ前記重ね合わせ部に半田処理が施さ
れ、前記素子リードとリード線が接続されている構成と
した温度センサ。
One end of the element lead drawn out from an element such as a thermistor element and one end of the lead wire are overlapped and fixed by welding, and the overlapping portion is soldered to connect the element lead and the lead wire. Temperature sensor configured as follows.
JP14789989A 1989-06-09 1989-06-09 Temperature sensor Pending JPH0311702A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14789989A JPH0311702A (en) 1989-06-09 1989-06-09 Temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14789989A JPH0311702A (en) 1989-06-09 1989-06-09 Temperature sensor

Publications (1)

Publication Number Publication Date
JPH0311702A true JPH0311702A (en) 1991-01-21

Family

ID=15440660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14789989A Pending JPH0311702A (en) 1989-06-09 1989-06-09 Temperature sensor

Country Status (1)

Country Link
JP (1) JPH0311702A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04319634A (en) * 1991-04-19 1992-11-10 Mitsubishi Electric Corp Temperature sensor device
JP2016065755A (en) * 2014-09-24 2016-04-28 株式会社鷺宮製作所 Method for manufacturing temperature measurement sensor and temperature measurement sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346701A (en) * 1986-08-14 1988-02-27 株式会社村田製作所 Manufacture of leaded thermistor
JPS6367701A (en) * 1986-09-09 1988-03-26 株式会社村田製作所 Negative characteristic thermistor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6346701A (en) * 1986-08-14 1988-02-27 株式会社村田製作所 Manufacture of leaded thermistor
JPS6367701A (en) * 1986-09-09 1988-03-26 株式会社村田製作所 Negative characteristic thermistor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04319634A (en) * 1991-04-19 1992-11-10 Mitsubishi Electric Corp Temperature sensor device
JP2016065755A (en) * 2014-09-24 2016-04-28 株式会社鷺宮製作所 Method for manufacturing temperature measurement sensor and temperature measurement sensor

Similar Documents

Publication Publication Date Title
US5742159A (en) Angular velocity sensor with housing and bobbin forming wedge fit seal
JPH03122987A (en) Connecting device of electric cable
JPH0311702A (en) Temperature sensor
CN109119234B (en) Coil component
US5796324A (en) Surface mount coil assembly
US4380775A (en) Semiconductor unit with connecting wires
US5292051A (en) Connecting method and structure of superconducting wires
US4878430A (en) Detonator pellet
JPH09161937A (en) Connecting method for terminal and electric wire
JP4584064B2 (en) Wire connection method
JP3511682B2 (en) Electrical connector
JPH07318573A (en) Output line/terminal connecting structure for wheel speed sensor
JPH0749784Y2 (en) Electromagnetic device
JP4617421B2 (en) Terminal structure and manufacturing method thereof
JP3633971B2 (en) Surface mount crystal unit
JPH07201525A (en) Manufacture of high-temperature thermistor temperature sensor
KR830000581B1 (en) Telephone set supportor
KR19990040562A (en) Resistor and manufacturing method
JPH0249310A (en) Sensor member
JPS6216071Y2 (en)
JPH07283041A (en) Axial lead type coil
US20200220276A1 (en) Connection of a Connection Wire and a Connection Element
JPS6225857Y2 (en)
KR19990040561A (en) resistor
KR800001299Y1 (en) Air-proof terminal