JPH0311675U - - Google Patents

Info

Publication number
JPH0311675U
JPH0311675U JP7126489U JP7126489U JPH0311675U JP H0311675 U JPH0311675 U JP H0311675U JP 7126489 U JP7126489 U JP 7126489U JP 7126489 U JP7126489 U JP 7126489U JP H0311675 U JPH0311675 U JP H0311675U
Authority
JP
Japan
Prior art keywords
thermoplastic resin
sheet
resin film
film
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7126489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7126489U priority Critical patent/JPH0311675U/ja
Publication of JPH0311675U publication Critical patent/JPH0311675U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Bag Frames (AREA)
  • Buffer Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、エンボス21の頂面に熱可塑性樹脂
フイルム3を貼り合わせた緩衝シート11の熱可
塑性樹脂フイルム3に導電性の網目模様10を印
刷した緩衝シートの例である。第2図は、エンボ
ス21の頂面に貼り合わせた熱可塑性樹脂フイル
ム3上に導電性皮膜10を形成した緩衝シートの
例である。第3図は、第1図の緩衝シートの製造
装置の一例を示す。第4図は、第1図の緩衝シー
トを用いた袋31の例を、第5図は、第2図の緩
衝シートを用いた袋31の例を示す。 1……本考案の緩衝シート、2……エンボスシ
ート、3……熱可塑性樹脂フイルム、4……ベー
スフイルム、5……貼り合わせ部、6……電子部
品用の袋の開口部、10……導電性の網目模様も
しくは導電性皮膜、11……緩衝性シート、21
……エンボス、31……電子部品用の袋、101
,102,103……Tダイ、201,202,
203,204,205,206……カレンダー
ロール、301……コロナ放電処理装置、401
……インクジエツトプリンター。
FIG. 1 shows an example of a buffer sheet in which a conductive mesh pattern 10 is printed on the thermoplastic resin film 3 of a buffer sheet 11 in which the thermoplastic resin film 3 is bonded to the top surface of the embossing 21. FIG. 2 shows an example of a buffer sheet in which a conductive film 10 is formed on a thermoplastic resin film 3 bonded to the top surface of an embossing 21. FIG. 3 shows an example of the manufacturing apparatus for the cushioning sheet shown in FIG. 4 shows an example of the bag 31 using the buffer sheet shown in FIG. 1, and FIG. 5 shows an example of the bag 31 using the buffer sheet shown in FIG. 2. DESCRIPTION OF SYMBOLS 1... Buffer sheet of the present invention, 2... Embossed sheet, 3... Thermoplastic resin film, 4... Base film, 5... Bonded portion, 6... Opening of bag for electronic parts, 10... ... Conductive mesh pattern or conductive film, 11 ... Cushioning sheet, 21
... Embossed, 31 ... Bag for electronic parts, 101
,102,103...T die, 201,202,
203, 204, 205, 206... Calendar roll, 301... Corona discharge treatment device, 401
...Inkjet printer.

Claims (1)

【実用新案登録請求の範囲】 (1) (a) 熱可塑性樹脂フイルムにエンボス21
を多数形成したエンボスシート2と (b) 熱可塑性樹脂フイルムからなるベースフ
イルム4を貼り合わせ、 (c) エンボスシート2又はベースフイルム4
に導電性の網目模様10を印刷した、 緩衝シート。 (2) (a) 熱可塑性樹脂フイルムにエンボス21
を多数形成したエンボスシート2と (b) 熱可塑性樹脂フイルムからなるベースフ
イルム4を貼り合わせ、 (c) 更にエンボス21の頂面に熱可塑性樹脂
フイルム3を貼り合わせ、 (d) 熱可塑性樹脂フイルム3又はベースフイ
ルム4に導電性の網目模様10を印刷した緩衝シ
ート。 (3) (a) 熱可塑性樹脂フイルムにエンボス21
を多数形成したエンボスシート2と (b) 熱可塑性樹脂フイルムからなるベースフ
イルム4を貼り合わせ、 (c) エンボスシート2又はベースフイルム4
に導電性皮膜10を形成した、 緩衝シート。 (4) (a) 熱可塑性樹脂フイルムにエンボス21
を多数形成したエンボスシート2と (b) 熱可塑性樹脂フイルムからなるベースフ
イルム4を貼り合わせ、 (c) 更にエンボス21の頂面に熱可塑性樹脂
フイルム3を貼り合わせ、 (d) 熱可塑性樹脂フイルム3又はベースフイ
ルム4に導電性皮膜10を形成した緩衝シート。 (5) 実用新案登録請求の範囲第1項、第2項、
第3項、又は第4項に記載の緩衝シートを重ね合
わせ、開口部6を残して周囲を貼り合わせた電子
部品用の袋。
[Scope of claims for utility model registration] (1) (a) Embossed 21 on thermoplastic resin film
The embossed sheet 2 on which a large number of
A buffer sheet with a conductive mesh pattern 10 printed on it. (2) (a) Embossing 21 on thermoplastic resin film
(b) A base film 4 made of a thermoplastic resin film is bonded to the embossed sheet 2 on which a large number of 3 or a buffer sheet in which a conductive mesh pattern 10 is printed on a base film 4. (3) (a) Embossing 21 on thermoplastic resin film
The embossed sheet 2 on which a large number of
A buffer sheet on which a conductive film 10 is formed. (4) (a) Embossing 21 on thermoplastic resin film
(b) A base film 4 made of a thermoplastic resin film is bonded to the embossed sheet 2 on which a large number of 3 or a buffer sheet in which a conductive film 10 is formed on a base film 4. (5) Scope of claims for utility model registration, paragraphs 1 and 2,
A bag for electronic components, in which the buffer sheets according to item 3 or 4 are stacked together and the periphery is pasted, leaving an opening 6.
JP7126489U 1989-06-20 1989-06-20 Pending JPH0311675U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7126489U JPH0311675U (en) 1989-06-20 1989-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7126489U JPH0311675U (en) 1989-06-20 1989-06-20

Publications (1)

Publication Number Publication Date
JPH0311675U true JPH0311675U (en) 1991-02-05

Family

ID=31608138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7126489U Pending JPH0311675U (en) 1989-06-20 1989-06-20

Country Status (1)

Country Link
JP (1) JPH0311675U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002011035A (en) * 2000-06-29 2002-01-15 Hakugen:Kk Antistatic body warmer
JP2003086925A (en) * 2001-09-12 2003-03-20 Matsushita Electric Ind Co Ltd Printed board with moisture-proofing structure and its manufacturing method
JP2011025979A (en) * 2009-07-28 2011-02-10 Ube Film Kk Cellular cushioning sheet
JP2013507280A (en) * 2009-10-13 2013-03-04 ナノケムテック・インコーポレイテッド Antistatic sheet for laminating drinks and food containers and method for producing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002011035A (en) * 2000-06-29 2002-01-15 Hakugen:Kk Antistatic body warmer
JP4630426B2 (en) * 2000-06-29 2011-02-09 株式会社白元 ESD protection
JP2003086925A (en) * 2001-09-12 2003-03-20 Matsushita Electric Ind Co Ltd Printed board with moisture-proofing structure and its manufacturing method
JP2011025979A (en) * 2009-07-28 2011-02-10 Ube Film Kk Cellular cushioning sheet
JP2013507280A (en) * 2009-10-13 2013-03-04 ナノケムテック・インコーポレイテッド Antistatic sheet for laminating drinks and food containers and method for producing the same

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