JPH03113840U - - Google Patents
Info
- Publication number
- JPH03113840U JPH03113840U JP2410590U JP2410590U JPH03113840U JP H03113840 U JPH03113840 U JP H03113840U JP 2410590 U JP2410590 U JP 2410590U JP 2410590 U JP2410590 U JP 2410590U JP H03113840 U JPH03113840 U JP H03113840U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor chip
- semiconductor device
- groove
- circumference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2410590U JPH03113840U (en, 2012) | 1990-03-09 | 1990-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2410590U JPH03113840U (en, 2012) | 1990-03-09 | 1990-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03113840U true JPH03113840U (en, 2012) | 1991-11-21 |
Family
ID=31527077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2410590U Pending JPH03113840U (en, 2012) | 1990-03-09 | 1990-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03113840U (en, 2012) |
-
1990
- 1990-03-09 JP JP2410590U patent/JPH03113840U/ja active Pending