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Application filedfiledCritical
Priority to JP2286890UpriorityCriticalpatent/JPH03113832U/ja
Publication of JPH03113832UpublicationCriticalpatent/JPH03113832U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
