JPH03112983U - - Google Patents
Info
- Publication number
- JPH03112983U JPH03112983U JP2046790U JP2046790U JPH03112983U JP H03112983 U JPH03112983 U JP H03112983U JP 2046790 U JP2046790 U JP 2046790U JP 2046790 U JP2046790 U JP 2046790U JP H03112983 U JPH03112983 U JP H03112983U
- Authority
- JP
- Japan
- Prior art keywords
- pin terminal
- wiring board
- lead wire
- fixing structure
- wire fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2046790U JPH03112983U (sl) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2046790U JPH03112983U (sl) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112983U true JPH03112983U (sl) | 1991-11-19 |
Family
ID=31523558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2046790U Pending JPH03112983U (sl) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112983U (sl) |
-
1990
- 1990-03-02 JP JP2046790U patent/JPH03112983U/ja active Pending