JPH03112144A - Conveyor for semiconductor device - Google Patents
Conveyor for semiconductor deviceInfo
- Publication number
- JPH03112144A JPH03112144A JP1250876A JP25087689A JPH03112144A JP H03112144 A JPH03112144 A JP H03112144A JP 1250876 A JP1250876 A JP 1250876A JP 25087689 A JP25087689 A JP 25087689A JP H03112144 A JPH03112144 A JP H03112144A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- air
- nozzle
- devices
- advancing direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000007664 blowing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001141 propulsive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、圧縮空気（以下「エア」と称する）を吹き
付けて半導体装置を搬送する装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for transporting semiconductor devices by blowing compressed air (hereinafter referred to as "air").
第４図は従来のこの種の半導体装置の搬送機構を示す側
面図である０図において、１ （１ａ、１ｂ）はＩＣ等
の半導体装置、２はこの半導体装置１が滑走するレール
、３はエアを噴出するためのノズル、４は前記半導体装
置１の到着を確認するためのセンサである。FIG. 4 is a side view showing a conventional transport mechanism for a semiconductor device of this type. In FIG. A nozzle 4 for blowing out air is a sensor for confirming the arrival of the semiconductor device 1.
次に動作について説明する。半導体装置１は連続した状
態（図中、ｌａ、ｌｂ） 、あるいは単体でセンサ４の
位置までレール２上を搬送されてくる（この搬送機構の
詳細は特にこの発明とは無関係のため省略する）、そし
て、半導体装置１がセンサ４を遮光した時点でノズル３
よりエアが噴出されて、半導体装置１のモールド部のテ
ーパ一部Ａにエアが当たり、このエアの推進力で先頭の
センサ４を遮光した半導体装Ｗ１１ａのみがレール２上
を滑って進行方向に搬送されていく。Next, the operation will be explained. The semiconductor device 1 is transported on the rail 2 in a continuous state (la, lb in the figure) or singly to the position of the sensor 4 (the details of this transport mechanism are omitted because they are not particularly relevant to this invention). , and when the semiconductor device 1 blocks light from the sensor 4, the nozzle 3
The air is blown out, and the air hits the tapered part A of the mold part of the semiconductor device 1, and due to the propulsive force of this air, only the semiconductor device W11a, which shields the leading sensor 4 from light, slides on the rail 2 and moves in the direction of travel. being transported.
従来の半導体装置の搬送機構は以上の様に構成されてい
るので、半導体装置１の長さがその種類の違いにより変
化した場合、センサ４と半導体装置のモールドのテーパ
一部Ａの距離が変化し、ノズル３あるいはセンサ４のど
ちらか一方を位置調整する必要があった。またモールド
の表面にエアを当てたのでは半導体装置１を押え付ける
形となり、強い推進力が得られないため、モールドのテ
ーパ一部Ａにのみエアを当てる必要があるが、モールド
のテーパ一部Ａの位置範囲が狭く限られているため、半
導体装ｆｌが停止した状態でエアを吹いても、正確に位
置が合っていない場合うまく前進しないといった問題が
あった。Since the conventional semiconductor device transport mechanism is configured as described above, when the length of the semiconductor device 1 changes due to the difference in its type, the distance between the sensor 4 and the tapered part A of the mold of the semiconductor device changes. However, it was necessary to adjust the position of either the nozzle 3 or the sensor 4. Also, if air is applied to the surface of the mold, it will press down the semiconductor device 1 and a strong propulsion force cannot be obtained, so it is necessary to apply air only to the tapered part A of the mold. Since the position range of A is narrow and limited, there is a problem in that even if air is blown while the semiconductor device fl is stopped, it will not move forward if the semiconductor device fl is not positioned accurately.
さらに、半導体装置が連続した状態で供給される場合、
隣同志の半導体装置１ａ、 ｌｂの間（第４図Ｂ部分）
でモールドバリが絡み合い、ノズル３から吹き出るエア
のみでは分離できない問題点があった。Furthermore, when semiconductor devices are supplied in a continuous state,
Between adjacent semiconductor devices 1a and lb (part B in Figure 4)
There was a problem in that the mold burrs became entangled and could not be separated using only the air blown from the nozzle 3.
この発明は以上の様な問題点を解消するためになされた
もので、半導体装置の長さがその種類により変化しても
、センサあるいはノズルの位置調整をする必要がなく、
また半導体装置が停止した状態でもエアを吹けば確実に
進行方向に搬送できる機構を得る事を目的とする。This invention was made to solve the above problems, and even if the length of the semiconductor device changes depending on the type, there is no need to adjust the position of the sensor or nozzle.
Another object of the present invention is to provide a mechanism that can reliably transport a semiconductor device in the advancing direction by blowing air even when the semiconductor device is stopped.
この発明に係る半導体装置の搬送装置は、エアを噴出さ
せるノズルを半導体装置が滑走するレールの側部に設置
し、先頭の半導体装置のリード部に向けてエアを吹き付
ける様にするとともに、先頭から２番目の半導体装置を
進行方向と反対方向に推しとどめるエアを吹き出すノズ
ルを、前記レールの上方に設けたことを特徴とする。In the semiconductor device transport device according to the present invention, a nozzle for blowing out air is installed on the side of the rail on which the semiconductor device slides, and the air is blown toward the lead portion of the semiconductor device at the front. The present invention is characterized in that a nozzle is provided above the rail for blowing out air that pushes the second semiconductor device in a direction opposite to the traveling direction.
この発明に係る半導体装置の搬送装置は、特に進行方向
に対して先頭の半導体装置の数本のリード部を狙ってエ
アを吹きつけているために、半導体装置の長さに関係な
く、また停止していても確実に前進させることができる
。また、先頭から２番目の半導体装置に対して進行方向
と反対方向へ推しとどめるエアを吹き付けているので、
先頭の半導体装置と２番目の半導体装置を確実に分離す
ることができる。Since the semiconductor device transport device according to the present invention blows air particularly aiming at several leads of the leading semiconductor device in the direction of travel, the semiconductor device can stop or stop regardless of the length of the semiconductor device. Even if you do, you can definitely move forward. In addition, air is blown against the second semiconductor device from the top in a direction opposite to the direction in which it is traveling.
The first semiconductor device and the second semiconductor device can be reliably separated.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの実施例による半導体装置の搬送装置を示す
平面図、第２図は上記半導体装置の搬送装置を示す側面
図、第３図は上記半導体装置のリード部の詳細を示す斜
視図である。FIG. 1 is a plan view showing a semiconductor device transport device according to this embodiment, FIG. 2 is a side view showing the semiconductor device transport device, and FIG. 3 is a perspective view showing details of the lead portion of the semiconductor device. be.
図において、１ （ｌａ、 ｌｂ）は半導体装置、２は
レール、３ａはこのレール２の側部に設置されたノズル
であって、ここから吹き出されるエアは前記半導体装ｆ
ｆ１ａのリード部５に当たり、この半導体装置１ａを進
行方向に搬送する役割を果す、また、３ｂは前記レール
２の上方に設置されたノズルであって、ここから吹き出
されるエアは先頭から２個目の半導体装置１ｂの表面に
当たり、この半導体装置ｌｂを進行方向に対して反対方
向に推しとどめる役割を果す、４はセンサ、５は前記半
導体装置１のリード、６はストッパ、７はこのストッパ
６に連絡されたシリンダを示す。In the figure, 1 (la, lb) is a semiconductor device, 2 is a rail, and 3a is a nozzle installed on the side of this rail 2, from which air is blown out to the semiconductor device f.
It corresponds to the lead part 5 of f1a and plays the role of transporting this semiconductor device 1a in the traveling direction. Also, 3b is a nozzle installed above the rail 2, and the air blown from this is two from the top. 4 is a sensor, 5 is a lead of the semiconductor device 1, 6 is a stopper, and 7 is a stopper 6. Indicates the cylinder that was contacted.
次に動作について説明する。半導体装置ｌはレール２上
を連続（図中、ｌａ、 ｌｂ・・・）あるいは単体でセ
ンサ４の位置まで搬送される。そして、先頭の半導体装
置ｌａがセンサ４を遮光した時点で、この半導体装置！
ａの進行方向に対し前面から数本のリード５（特に第３
図の斜線部の面）に向って、ノズル３ａよりエアを吹き
つける。このとき、半導体装置１ａはストッパ６に押付
けられた状態で停止することとなる０次に、半導体装Ｍ
１ａを搬送したいタイミングでシリンダ７を動作させる
ことにより、ストッパ６は下降し、半導体装１ｆｆｆｆ
ｉｌａはノズル３ａによるエアの推進力で進行方向に搬
送される。Next, the operation will be explained. The semiconductor device 1 is conveyed on the rail 2 continuously (la, lb, . . . in the figure) or singly to the position of the sensor 4. Then, when the first semiconductor device la blocks the sensor 4, this semiconductor device!
Several leads 5 (especially the third lead) from the front in the direction of movement of a.
Air is blown from the nozzle 3a toward the shaded area in the figure. At this time, the semiconductor device 1a is stopped in a state where it is pressed against the stopper 6, and the semiconductor device M
By operating the cylinder 7 at the desired timing to transport the semiconductor device 1a, the stopper 6 is lowered and the semiconductor device 1ffff
ila is conveyed in the traveling direction by the propulsion force of air from the nozzle 3a.
一方、半導体装置１が連続的に搬入されてきた場合、先
頭から２番目の半導体装置１ｂには、前面上方に設置さ
れたノズル３ｂから吹き出すエアによって、進行方向と
は反対方向にエアブローされる。On the other hand, when the semiconductor devices 1 are continuously carried in, the second semiconductor device 1b from the top is blown in the opposite direction to the direction of travel by air blown from the nozzle 3b installed above the front surface.
これにより、モールドバリ等の絡みがあっても先頭の半
導体装置１ａと２番目の半導体装置！ｂは引き離されて
、確実に１個ずつ搬送されることとなる。As a result, even if there is entanglement due to mold burrs, etc., the first semiconductor device 1a and the second semiconductor device can be separated! b will be separated and reliably transported one by one.
なお、前記ノズル３ｂからのエアブロ−は、ノズル３ａ
によるエアブロ−の推進力の障害とはならず、かつパリ
の重なり等を引離すに充分な力を持った微量のエアであ
る。Note that the air blow from the nozzle 3b is transmitted to the nozzle 3a.
This is a very small amount of air that does not impede the propulsion force of the air blow and has sufficient force to separate overlapping particles.
以上の様にこの発明に依れば、エアを半導体装置の進行
方向に対して先頭から数本のリード部へ吹きつけて半導
体装置を搬送する様にしたため、装置に仕掛ける半導体
装置の品種が変わり長さ幅が変化しても、ノズル、セン
サ、ストッパ等の位置を再調整する必要がなく、品種換
えに際しても段取換時間の短縮に効果がある。またノズ
ルの位置、角度を特に厳密に調整しなくてもいずれかの
リードにエアが当たるだけで半導体装置を搬送する推進
力が得られる効果がある。また、先頭から２番目の半導
体装置に対して進行方向と反対方向にエアが当たり、モ
ールドバリ等の絡みがあっても引き離され、確実に１個
ずつ搬送される効果がある。As described above, according to the present invention, since the semiconductor device is conveyed by blowing air to several leads from the head in the direction of movement of the semiconductor device, the types of semiconductor devices installed in the device can be changed. Even if the length and width change, there is no need to readjust the positions of the nozzle, sensor, stopper, etc., and it is effective in shortening the setup time when changing products. Further, there is an effect that the driving force for transporting the semiconductor device can be obtained simply by blowing air onto one of the leads without particularly strictly adjusting the position and angle of the nozzle. In addition, air hits the second semiconductor device from the top in the direction opposite to the direction of travel, and even if there is entanglement with mold burrs, it is pulled apart and the semiconductor devices are reliably transported one by one.
第１図はこの発明の一実施例による半導体装置の搬送装
置を示す平面図、第２図は上記半導体装置の搬送装置を
示す側面図、第３図は上記半導体装置のリード部の詳細
を示す斜視図、第４図は従来の半導体装置の搬送装置を
示す側面図である。
図中、１．１ａ、ｌｂは半導体装置、２はレール、３ａ
。
３ｂはノズル、４はセンサ、５はリード、６はストッパ
、７はシリンダである。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a plan view showing a semiconductor device transport device according to an embodiment of the present invention, FIG. 2 is a side view showing the semiconductor device transport device, and FIG. 3 is a detailed view of the lead portion of the semiconductor device. The perspective view and FIG. 4 are side views showing a conventional semiconductor device transport device. In the figure, 1.1a and lb are semiconductor devices, 2 is a rail, and 3a
. 3b is a nozzle, 4 is a sensor, 5 is a lead, 6 is a stopper, and 7 is a cylinder. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
備えた半導体装置の搬送装置において、先頭の半導体装
置を進行方向に推進させる圧縮空気を、前記レールの側
方からこの半導体装置のリード部に向つて吹き出すノズ
ルを備えるとともに、先頭から２番目の半導体装置を進
行方向と反対方向におしとどめる圧縮空気を、前記レー
ルの上方からこの半導体装置の上面に向って吹き出すノ
ズルを備えたことを特徴とする半導体装置の搬送装置。In a semiconductor device transport device equipped with a rail on which a semiconductor device slides singly or continuously, compressed air that propels the leading semiconductor device in the traveling direction is directed from the side of the rail toward the lead portion of this semiconductor device. and a nozzle that blows out compressed air from above the rail toward the top surface of the semiconductor device to stop the second semiconductor device from the top in a direction opposite to the traveling direction. Transport equipment for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250876A JPH03112144A (en) | 1989-09-27 | 1989-09-27 | Conveyor for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1250876A JPH03112144A (en) | 1989-09-27 | 1989-09-27 | Conveyor for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112144A true JPH03112144A (en) | 1991-05-13 |
Family
ID=17214328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1250876A Pending JPH03112144A (en) | 1989-09-27 | 1989-09-27 | Conveyor for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112144A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61295922A (en) * | 1985-06-26 | 1986-12-26 | Mitsubishi Electric Corp | Device for transferring semiconductor device |
| JPS6253233B2 (en) * | 1980-05-16 | 1987-11-09 | Daicel Chem |
-
1989
- 1989-09-27 JP JP1250876A patent/JPH03112144A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253233B2 (en) * | 1980-05-16 | 1987-11-09 | Daicel Chem | |
| JPS61295922A (en) * | 1985-06-26 | 1986-12-26 | Mitsubishi Electric Corp | Device for transferring semiconductor device |
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