JPH03110871U - - Google Patents
Info
- Publication number
- JPH03110871U JPH03110871U JP1988990U JP1988990U JPH03110871U JP H03110871 U JPH03110871 U JP H03110871U JP 1988990 U JP1988990 U JP 1988990U JP 1988990 U JP1988990 U JP 1988990U JP H03110871 U JPH03110871 U JP H03110871U
- Authority
- JP
- Japan
- Prior art keywords
- layer conductor
- insulating substrate
- conductor patterns
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988990U JPH03110871U (me) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988990U JPH03110871U (me) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110871U true JPH03110871U (me) | 1991-11-13 |
Family
ID=31522993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988990U Pending JPH03110871U (me) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110871U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013106054A (ja) * | 2011-11-10 | 2013-05-30 | Daishinku Corp | 圧電デバイス |
-
1990
- 1990-02-28 JP JP1988990U patent/JPH03110871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013106054A (ja) * | 2011-11-10 | 2013-05-30 | Daishinku Corp | 圧電デバイス |